Plastic Packages for Integrated Circuits Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP) Q80.12x12 E E1 80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD PACKAGE MILLIMETERS SYMBOL D1 9.500 REF 80 D 1 PIN 1 TOP VIEW MIN 11.950±0.100 B Y - - 1.20 Overall height 0.05 0.10 0.15 Standoff A2 0.90 1.00 1.10 Package thickness D 13.8 14.0 14.2 Lead tip to tip D1 11.9 12.0 12.1 Package length E 13.8 14.0 14.2 Lead tip to tip E1 11.9 12.0 12.1 Package width L 0.45 0.60 0.75 Foot length 1.000 REF. T 0.09 T1 0.097 SIDE VIEW Lead length 0.150 0.20 0.127 0.157 Lead base metal thickness 0°~7° Lead thickness Foot angle b 0.17 0.22 0.27 Lead width b1 0.17 0.20 0.23 Lead base metal width e 12° ALL AROUND REMARKS A a 12.000±0.100 B MAX A1 L1 12° ALL AROUND TYP 0.500 BASE Lead pitch ccc - 0.080 - Foot coplanarity ddd - 0.080 - Foot position Rev. 0 8/07 NOTES: EXPOSED PAD AREA 1. General tolerance. Distance: ±0.1000, Angle: ±2.5° 2. Matte finish on package body surface except ejection and pin 1 marking: Ra0.8~2.0um 3. All molded body sharp corner radii unless otherwise specified: MAX. R0.200 REF. 6.000 4. Package/lead frame misalignment (X, Y): MAX. 0.127 5. Top/bottom package misalignment (X, Y): MAX. 0.127 6. Drawing does not include plastic or metal protrusion or cutting burr. 7. Compliant to JEDEC standard MS-026. PIN 1 REF. 6.000 b BOTTOM VIEW T b1 SECTION B-B A1 SEATING PLANE a R0.080~0.200 e C b ddd L C DETAIL "Y" 1 L1 0.250 c A2 ccc A 0.200 MIN. . 0° MIN. IN 0M .0 8 0 R GAGE PLANE R0.250 TYP ALL AROUND T1