Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Thin Plastic Quad Flatpack Exposed Pad Packages (EPTQFP)
Q80.12x12
E
E1
80 LEAD THIN PLASTIC QUAD FLATPACK EXPOSED PAD
PACKAGE
MILLIMETERS
SYMBOL
D1
9.500 REF
80
D
1
PIN 1
TOP VIEW
MIN
11.950±0.100
B
Y
-
-
1.20
Overall height
0.05
0.10
0.15
Standoff
A2
0.90
1.00
1.10
Package thickness
D
13.8
14.0
14.2
Lead tip to tip
D1
11.9
12.0
12.1
Package length
E
13.8
14.0
14.2
Lead tip to tip
E1
11.9
12.0
12.1
Package width
L
0.45
0.60
0.75
Foot length
1.000 REF.
T
0.09
T1
0.097
SIDE VIEW
Lead length
0.150
0.20
0.127
0.157 Lead base metal thickness
0°~7°
Lead thickness
Foot angle
b
0.17
0.22
0.27
Lead width
b1
0.17
0.20
0.23
Lead base metal width
e
12° ALL AROUND
REMARKS
A
a
12.000±0.100
B
MAX
A1
L1
12° ALL AROUND
TYP
0.500 BASE
Lead pitch
ccc
-
0.080
-
Foot coplanarity
ddd
-
0.080
-
Foot position
Rev. 0 8/07
NOTES:
EXPOSED
PAD AREA
1. General tolerance. Distance: ±0.1000, Angle: ±2.5°
2. Matte finish on package body surface except ejection and pin 1
marking: Ra0.8~2.0um
3. All molded body sharp corner radii unless otherwise specified:
MAX. R0.200
REF. 6.000
4. Package/lead frame misalignment (X, Y): MAX. 0.127
5. Top/bottom package misalignment (X, Y): MAX. 0.127
6. Drawing does not include plastic or metal protrusion or cutting
burr.
7. Compliant to JEDEC standard MS-026.
PIN 1
REF. 6.000
b
BOTTOM VIEW
T
b1
SECTION B-B
A1
SEATING
PLANE
a
R0.080~0.200
e
C
b
ddd
L
C
DETAIL "Y"
1
L1
0.250
c
A2
ccc
A
0.200 MIN.
.
0° MIN.
IN
0M
.0 8
0
R
GAGE PLANE
R0.250 TYP
ALL AROUND
T1