Package Outline Drawing (POD)

Plastic Packages for Integrated Circuits
Quad Flat No-Lead Plastic Package (QFN)
Micro Lead Frame Plastic Package (MLFP)
L32.5x6B (One of 10 Packages in MDP0046)
32 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
(COMPLIANT TO JEDEC MO-220)
A
MILLIMETERS
D
N
(N-1)
(N-2)
B
1
2
3
SYMBOL
MIN
NOMINAL
MAX
NOTES
A
0.80
0.90
1.00
-
A1
0.00
0.02
0.05
-
D
PIN #1
I.D. MARK
E
5.00 BSC
-
D2
3.60 REF
-
E
6.00 BSC
-
E2
(N/2)
2X
0.075 C
2X
0.075 C
b
L
0.20
0.55
-
0.22
0.24
-
c
0.20 REF
-
e
0.50 BSC
-
N
32 REF
4
ND
7 REF
6
NE
9 REF
5
Rev 0 9/05
1. Dimensioning and tolerancing per ASME Y14.5M-1994.
PIN #1 I.D.
2. Tiebar view shown is a non-functional feature.
3
3. Bottom-side pin #1 I.D. is a diepad chamfer as shown.
4. N is the total number of terminals on the device.
5. NE is the number of terminals on the ā€œEā€ side of the package
(or Y-direction).
(E2)
6. ND is the number of terminals on the ā€œDā€ side of the package
(or X-direction). ND = (N/2)-NE.
(N/2)
NE 5
7. Inward end of terminal may be square or circular in shape with
radius (b/2) as shown.
7
(D2)
BOTTOM VIEW
0.10 C
C
(c)
SEATING
PLANE
0.08 C
N LEADS
& EXPOSED PAD
b
-
0.50
NOTES:
1
2
3
e
0.45
0.10 M C A B
(N-2)
(N-1)
N
N LEADS
TOP VIEW
4.60 REF
L
C
2
A
(L)
SEE DETAIL "X"
A1
SIDE VIEW
DETAIL X
1
N LEADS