Plastic Packages for Integrated Circuits Thin Quad Flat No-Lead Plastic Package (TQFN) Micro Lead Frame Plastic Package (MLFP) L32.4x5A A 32 LEAD THIN QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220) D N (N-1) (N-2) B MILLIMETERS SYMBOL 1 2 3 PIN #1 I.D. MARK E (N/2) 2X 0.075 C 2X 0.075 C 0.10 M C A B b (N-2) (N-1) N N LEADS TOP VIEW L MIN NOMINAL MAX NOTES A 0.70 0.75 0.80 - A1 0.00 0.02 0.05 - D 4.00 BSC - D2 2.50 REF - E 5.00 BSC - E2 3.50 REF - L 0.35 0.40 0.45 - b 0.15 0.20 0.25 - c 0.20 REF - e 0.40 BSC - N 32 REF 4 ND 7 REF 6 NE 9 REF PIN #1 I.D. 5 Rev 2 8/06 3 NOTES: 1 2 3 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Tiebar view shown is a non-functional feature. 3. Bottom-side pin #1 I.D. is a diepad chamfer as shown. (E2) 4. N is the total number of terminals on the device. 5. NE is the number of terminals on the “E” side of the package (or Y-direction). NE 5 (N/2) 6. ND is the number of terminals on the “D” side of the package (or X-direction). ND = (N/2)-NE. 7 (D2) 7. Inward end of terminal may be square or circular in shape with radius (b/2) as shown. BOTTOM VIEW 0.10 C e C (c) SEATING PLANE 0.08 C N LEADS & EXPOSED PAD C 2 A (L) SEE DETAIL "X" A1 SIDE VIEW DETAIL X 1 N LEADS