P850-G200-WH MDS

MATERIAL DECLARATION SHEET
Material Number
P850-G200-WH
Product Line
TBU
Compliance Date
January-2008
RoHS Compliant
Yes
No.
1
Construction
Element(subpart)
Semiconductor
Device
MSL
Homogeneous
Material
Silicon Chip
2
Lead Frame
Copper alloy with
silver plating
3
Bond wire
Gold wire
Die Attach
Adhesive
5
Mold compound
(halogen-free)
Epoxy resin
Matte tin plating
3.75
41.48
0.79
matte tin
40.11
2.78
Total weight
This Document was updated on:
Material
weight
[mg]
0.43
4
6
3
Homogeneous
Material\
Substances
CASRN
if applicable
Materials
Mass %
Material
Mass % of
total unit wt.
Subpart
mass of total
wt. (%)
4.2
Doped silicon
7440-21-3
100
4.2
Copper
Iron
Tin
Zinc
Silver (plating)
Gold
Di-ester resin
Functionalized ester
Polymeric compound
Silver
Silica fused
Epoxy resin
Phenolic resin
Carbon black
Tin
7440-50-8
7439-89-6
7440-31-5
7440-66-6
7440-22-4
95.645
2.185
0.034
0.135
2.0
100
3
7
3
87
90.5
4.7
4.7
0.1
100
44.41
1.01
0.02
0.06
0.93
0.48
0.03
0.06
0.03
0.76
40.63
2.11
2.11
0.05
3.11
7440-57-5
proprietary
proprietary
proprietary
7440-22-4
60676-86-0
proprietary
proprietary
1333-86-4
7440-31-5
46.43
0.48
0.88
44.9
3.11
89.34
January 12, 2010
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