MATERIAL DECLARATION SHEET Material Number C650-180-WH Product Line TBU Compliance Date January-2008 RoHS Compliant Yes No. 1 Construction Element(subpart) Semiconductor Device MSL Homogeneous Material Silicon Chip 2 Lead Frame Copper alloy with silver plating 3 Bond wire Gold wire Die Attach Adhesive 5 Mold compound (halogen-free) Epoxy resin Matte tin plating 6.68 47.28 1.74 matte tin 37.02 2.94 Total weight This Document was updated on: Material weight [mg] 0.23 4 6 3 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Subpart mass of total wt. (%) 6.96 Doped silicon 7440-21-3 100 6.96 Copper Chromium III Tin Zinc Silver (plating) Gold Di-ester resin Functionalized ester Polymeric compound Silver Silica fused Epoxy resin Phenolic resin Carbon black Tin 7440-50-8 7440-47-3 7440-31-5 7440-66-6 7440-22-4 97.29 0.25 0.25 0.22 2.0 100 3 7 3 87 90.5 4.7 4.7 0.1 100 47.97 0.12 0.12 0.11 0.99 0.24 0.05 0.13 0.05 1.58 34.94 1.81 1.81 0.04 3.07 7440-57-5 proprietary proprietary proprietary 7440-22-4 60676-86-0 proprietary proprietary 1333-86-4 7440-31-5 49.31 0.24 1.81 38.6 3.07 95.89 January 12, 2010 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1