MATERIAL DECLARATION SHEET Material Number TBU-PL Series Product Line TBU Products Compliance Date 1/1/2010 RoHS Compliant No. 1. 2 3 Construction Element (subpart) Wafer Lead Frame Die attach material Yes L C955401 MSL Homogeneous Material Silicon A194 84LMISR4 1 Material weight [mg] 2.951 Gold Bond wire Headquarters Riverside CA Au CASRN if applicable Materials Mass % Material Mass % of total unit wt. Silicon 7440-21-3 100% 3.87723% 33.534 Cu 7440-50-8 95.65% 44.05933% 0.766 Fe 7439-89-6 2.18% 1.006425% 0.012 Sn 7440-31-5 0.03% 0.015766% 0.047 Zn 7440-66-6 0.13% 0.06175% 0.701 Silver 7740-22-4 2.01% 0.921023% 0.029 Epoxy resin 2.99% 0.038102% 7.01% 0.089343% 2.99% 0.038102% 0.844 Functionalized ester Polymeric compound Ag Trade secret Trade secret Trade secret 7440-22-4 87.01% 0.462 Au 7440-57-5 100% 1.108907% 0.607008% 0.068 0.029 4 Homogeneous Material\ Substances www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society Subpart mass of total wt. (%) 3.88% 46.06% 1.27% 0.61% page 1 of 2 MATERIAL DECLARATION SHEET 5 6 Mold compound Tin plating 31.873 Silica fused 1.655 Epoxy resin 1.655 Phenol resin 0.037 Carbon black 1.448 Tin G770 Sn Total weight 60676-86-0 Trade Secret Trade Secret 1333-86-4 7440-31-5 90.49% 41.87701% 4.70% 2.174455% 4.70% 2.174455% 0.11% 0.048613% 100% 1.902484% 46.28% 1.90% 76.111 mg This Document was updated on: 3-June-2010 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2