Ultra High Performance BGA Cooling Solutions w/ Thermal Tape Attachment* DIGI-KEY PART # ATS1145-ND ATS PART # ATS-52425P-C2-R0 Features & Benefits D maxiFLOW™ design features a low profile, spread fin array that maximizes surface area for more effective convection (air) cooling C Fabricated from extruded aluminum, which minimizes thermal resistance from the base to the fins, reduces weight and keeps costs low Higher performance helps ensure reliable product life at a lower cost than other extruded heat sinks B A Thermal Performance Table Air Velocity THERMAL RESISTANCE FT/MIN M/S °C/W (UNDUCTED) °C/W (DUCTED) 200 1.0 1.9 1.5 300 1.5 1.5 400 2.0 1.3 500 2.5 1.2 600 3.0 1.1 700 3.5 1 800 4.0 1 Product Details† Dimension A Dimension B Dimension C§ Dimension D TIM‡ FINISH 42.5 42.5 17.5 72.86 C675 BLUE-ANODIZED For further technical information, please contact Advanced Thermal Solutions, Inc. at 1-781-769-2800 or www.qats.com * RoHS Compliant ‡ TIM = Thermal Interface Material † Dimensions are measured in millimeters ♦ Dimensions A & B refer to component size § Dimension C = the height of the heat sink shown above and does not include the height of the attachment method To place an order, please visit www.digikey.com