Data Sheet

KMI25/2; KMI25/4
High performance rotational speed sensor
Rev. 1 — 29 April 2016
Product data sheet
1. Product profile
1.1 General description
Based on the Anisotropic MagnetoResistive (AMR) effect, the KMI25/2 and the KMI25/4
detect the rotational speed of target wheels. The KMI25/2 is used with active target
wheels (multipole encoders) and the KMI25/4 is used with passive target wheels
(ferromagnetic gear wheels). This design delivers secure speed information over a wide
range of speed, air gap and temperature. It delivers the speed information via a current
protocol at the supply pins.
CAUTION
Do not press two or more products together against their magnetic forces and do not let them
collide with each other.
1.2 Features and benefits










System in package
Two wire current interface
Rotational direction detection
Digital output protocol [ArbeitsKreis protocol (AK protocol)]
Large range of air gap
Large range of operating terminal voltage
Wide temperature range
High ElectroStatic Discharge (ESD) protection
Very low jitter
Automotive qualified in accordance with AEC-Q100 Rev-G (grade 0)
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
1.3 Quick reference data
Table 1.
Quick reference data
Symbol Parameter
Conditions
Min
Typ
Max
Unit
-
16
V
VCC
supply voltage
normal operation mode; Tamb  170 C;
referred to pin GND
6.8
Tamb
ambient temperature
normal operation mode
40
-
+150
C
ICCL
LOW-level supply current
5.88
7.0
8.4
mA
ICCM
MID-level supply current
11.7
14.0
16.8
mA
ICCH
HIGH-level supply current
23.5
28.0
33.6
mA
fH
magnetic field strength
frequency
0
-
2.5
kHz
HM
peak magnetic field
strength
KMI25/2
150
-
-
A/m
KMI25/4
190
-
-
A/m
after power-on; speed pulses latest after Ncy(H)
magnetic cycles; see characteristics in Table 10
2. Pinning information
Table 2.
Pin
Pinning
Symbol
Description
Simplified outline
KMI25/2
1
KMI25/4
supply pin
VCC
2
DI
digital input pin
3
GND
ground pin
3. Ordering information
Table 3.
Ordering information
Type number
Package
Name
Description
Version
KMI25/2
SIP3
plastic single-ended multi-chip package; magnetized ferrite magnet
(3.8  2  0.8 mm); 4 interconnections; 3 in-line leads
SOT477A
KMI25/4
SIP3
plastic single-ended multi-chip package; magnetized ferrite magnet
(5.2  4.25  2.95 mm); 4 interconnections; 3 in-line leads
SOT477E
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
2 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
4. Functional diagram
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Fig 1.
Functional diagram
5. Functional description
The KMI25/2 and the KMI25/4 are high performance AMR speed sensors, which are
dedicated to ABS applications. The difference between both product versions is the
stimulating element in the application, which is a magnetized multipole encoder (KMI25/2)
or a ferromagnetic gear wheel (KMI25/4).
5.1 System architecture
The functional principles of KMI25/2 and KMI25/4 are shown in Figure 2 and Figure 3,
respectively. For the KMI25/2, the magnetic poles lead to different magnetic stimuli at the
AMR bridge. For the KMI25/4, flux bending at the gear wheel teeth generates different
magnetic stimuli at the AMR bridge. In both cases, the electrical output voltage of the
AMR bridge depends on the position of the sensor relative to the encoder. As a
consequence, a rotating encoder generates a periodic output signal at the AMR bridge.
The KMI25/2 and the KMI25/4 are sensitive to movement in the y direction in front of the
sensor only. For definition of the coordinate axes, see Figure 4.
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
3 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
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Functional principle of KMI25/4
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Definition of coordinate system
The KMI25/2 and the KMI25/4 each comprise an AMR sensor chip, a Position Detector IC
(PDIC) and a Line Driver IC (LDIC). The PDIC comprises the signal conditioning circuits,
whereas the LDIC comprises the external interface and the supply for PDIC and AMR
bridge (see Figure 1). The AMR sensor chip carries four MR elements arranged as a
Wheatstone bridge. The AMR bridge converts the magnetic field, generated by the
encoder rotation, into an electrical output signal. This signal is nearly sinusoidally with
time.
KMI25_2_4
Product data sheet
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Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
4 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
The LDIC chip is fabricated using a robust high-voltage process. This measure shields the
other two dies from the harsh electrical environment on the supply line VCC. The constant
current source IL provides the LOW-level output signal of typically 7 mA and delivers the
supply current for the whole sensor system. Thus from IL the supply voltages for the PDIC,
the AMR bridge and the current source blocks IM and IH are derived. The switchable
current source IM also delivers typically 7 mA. Hence, if IM is active, the total supply
current is at its MID level of typically 14 mA. This current refers to a logic HIGH level at the
AK protocol. The switchable current source IH delivers typically 21 mA. Thus, IH being
active results in a total current of typically 28 mA, which is the level of a speed pulse. With
this current interface, safe sensor signal transport to the Electronic Control Unit (ECU)
using only a two-wire cable is provided. In addition, the digital input pin DI converts an
external resistance into a one-bit signal. This signal is passed on to the PDIC via a level
shifter.
Within the PDIC, the differential output voltage of the AMR sensor bridge leads as speed
signal into an analog signal chain. It comprises an amplifier with adjustable gain, followed
by an offset cancelation stage and finally, a smart comparator having adjustable
hysteresis levels. The latter converts the sinusoidal sensor signal into a rectangular output
signal. Via a one-shot, the rectangular signal controls the switchable current source IH on
the LDIC. The sensor system outputs HIGH-level speed pulses at each zero-crossing of
the magnetic input signal. As a result, the speed pulses occur at a repetition rate of twice
the magnetic field strength frequency. This repetition rate allows measuring the rotational
speed of the encoder wheel.
A peak detector within the digital control unit on the PDIC measures the amplitude and the
offset of the sensor signal. The peak detector has a resolution of 8 bit. This feature allows
the digital control unit on one hand, to eliminate the signal offset. This function is realized
with a dedicated Digital-to-Analog Converter (DAC). The DAC has a resolution of 12 bits.
On the other hand, it allows the digital control unit to optimize amplifier gain and
comparator hysteresis settings according to the actual signal amplitude. Due to these
measures, the sensor system can handle a wide amplitude range. This amplitude range in
turn allows the KMI25/2 and KMI25/4 to handle a wide range of air gaps between sensor
and encoder. The hysteresis of the smart comparator prevents erroneous multiple
switching due to mechanical vibrations of the encoder wheel. A further important feature
of the smart comparator is, that it switches its output level always at the zero-crossing of
its input signal. Thus, the phase of its rectangular output signal is independent of its
hysteresis setting and independent of the gain setting at the amplifier. For this reason,
adjustments of gain and hysteresis in the signal chain avoid the introduction of jitter into
the sensor output signal. The whole signal chain works even under DC conditions,
therefore having true zero Hertz capability.
The block labeled direction channel in Figure 1 within the PDIC builds the sum of the two
AMR half-bridge output signals, which is referred to as direction signal. As already
described above, the difference of the two half-bridge signals is processed as speed
signal. Due to the displacement of the two half bridges in direction of the y axis, there is a
phase shift between their output signals. The sign of this phase difference switches with
direction of rotation. As a mathematical fact, the difference and sum signals are phase
shifted to each other by either +90 or 90. The sign of this phase shift also depends on
the direction of rotation. Using these relations, the digital control unit detects the direction
information by measuring the phase relation between the difference signal and the sum
signal. For this purpose, also the offset at the sum signal is eliminated in the respective
offset cancelation block.
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
5 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
In order to display it at the AK protocol, the digital protocol unit processes the following
information:
•
•
•
•
Amplitudes of speed and direction signals
Detected direction
Actual operation mode of signal conditioning circuit
Status of pin DI
5.2 Speed signal conditioning algorithm
The digital control unit (see Figure 1) controls the speed signal conditioning algorithm.
The general purpose is, to control the analog blocks in the speed channel to optimize
signal conditions at the analog comparator input. Therefore, the algorithm characterizes
the sensor input signal, as observed within the digital domain. As a result, the algorithm
adjusts the amplifier gain, cancels the signal offset and sets the comparator hysteresis. To
fulfill this task, the digital control unit provides switching between different operating
modes. Depending on frequency and amplitude of the input signal, one of the following
modes is selected:
•
•
•
•
Start-up mode
Adaptation mode
Normal mode
Low-speed mode
Figure 5 depicts a flow chart summarizing the most important features of each mode and
the conditions for switching between modes. For each transition, all of the listed
conditions must be satisfied (logical AND), unless the notation ‘or’ is used. The latter
indicates a logical OR connection. In this case, the transition is performed if any of the
listed conditions is satisfied.
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
6 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
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Flow chart
The following sections describe the implemented measurement functions for offset,
amplitude and frequency as well as each operation mode.
5.2.1 Peak detector
The peak detector is part of the digital control unit. It samples the AMR input signal with a
resolution of 8 bits and detects the positive and negative peak values. From these values,
it calculates the signal offset and the signal amplitude. The offset is calculated as half of
the sum of opposite signal peaks. The amplitude is calculated as difference of opposite
signal peaks. Principally, a peak is detected, where the difference between succeeding
signal samples switches its sign. In order to cope with superimposed noise and spurious
spikes, the peak detector uses dedicated filter algorithms.
KMI25_2_4
Product data sheet
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Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
7 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
5.2.2 Frequency measurement
As pointed out above, the peak detector calculates the signal offset. This offset level is the
‘zero level’ of the sensor signal. Whenever the sensor signal crosses this ‘zero level’, the
comparator switches its state.
If a zero-crossing with a falling edge is detected first, then frequency measurements are
always made between falling edges. If a zero-crossing with a rising edge is detected first,
then frequency measurements are always made between rising edges. Thus always a
complete signal period is used and the result is independent of any duty cycle shifts.
The frequencies occurring in start-up mode and low-speed mode are very low. Thus, an
indirect frequency measurement is done here by counting the number of signal peaks
within 2 seconds.
5.2.3 Start-up mode
Usually the system enters this mode after power-on reset. At power-on, nothing is known
about the input signal properties. The function of the speed control algorithm in start-up
mode is to characterize the input signal and produce estimates of its amplitude, offset and
frequency. Therefore, once the sensor element has been supplied with voltage, all circuit
parts are set into defined initial conditions. These conditions comprise fixed amplifier gain
and fixed (but temperature-dependent) comparator hysteresis. Furthermore, there is still
no offset cancelation. This procedure may take up to 1 ms. The system starts then
applying an appropriate offset correction in the direction channel and then switches to the
speed channel. These initial conditions are used to process the sensor bridge signal in the
first instant. Thereafter the system is ready to react on the input voltage.
If the first speed signal samples are near the positive or negative signal range limit, a large
offset is assumed. In this case, an initial offset correction with a predefined level is
executed. This function is applied to speed up the signal recognition in case of small
signals superimposed on a large offset.
Generally, the ‘start-up’ performance strongly depends on the signal amplitude and its
offset. Because of the possibility of missing the second zero-crossing, the first
zero-crossing of the input signal is not used. So under normal conditions (offset is
relatively small w.r.t. amplitude), the sensor issues the first speed pulse at its output with
the second zero-crossing of the analog input signal. As there is no offset regulation during
start-up mode, the speed pulses issued during this mode may be shifted in time w.r.t. the
zero-crossings of the sensor signal. As a consequence, the duty cycle of the output signal
may not yet fulfill the specification, if an external magnetic offset is present. For small
amplitudes and large offsets, no zero-crossings may be detected during start-up mode
until offset compensation is performed in adaptation mode.
If the peak detector has found 8 signal peaks within 4 seconds, start-up mode is left and
adaptation mode is entered. However, if start-up mode has been entered coming from
adaptation mode, then 4 signal peaks within 2 seconds cause reentering adaptation
mode.
Even if no zero-crossing is detected, the sensor transmits the output protocol at a rate of
typically 150 ms. The output of an artificial speed pulse instead of a real speed pulse
indicates this condition (see Section 5.3.3).
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
8 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
5.2.4 Adaptation mode
The main purpose of adaptation mode is to optimize the signal conditions by adjusting
gain and offset, based on the estimates made in start-up mode. After standstill or in a
sudden change of signal offset, adaptation mode is entered as well.
In adaptation mode, offset compensation and gain setting are applied once per signal
cycle. Offset compensation first takes place in correcting 7⁄8 of the calculated offset per
step. It continues until the residual offset is below a threshold of 2 Least Significant Bit
(LSB). An exception occurs, if the remaining offset is larger than five times the signal
amplitude. In this case, the correction of that step is limited to the remaining offset level.
In order to avoid the generation of erroneous additional zero-crossings, the activity of the
offset compensation depends on the previous signal slope. Therefore, a positive offset is
only corrected after a falling slope and a negative offset is only corrected after a rising
slope.
If necessary, the amplifier gain is doubled or halfed, until the digital signal amplitude is
between 25 % and 75 % of its range. The temperature-dependent hysteresis level at the
comparator input is kept at the same percentage level w.r.t. to the signal range as in the
previous mode.
The number of steps required for the adaptation process depends on the relation between
offset and signal amplitude. Small amplitudes coming with a large offset require a
maximum number of steps. In such cases, the first zero-crossing may not be detected in
start-up mode, but in adaptation mode. As in start-up mode the second zero-crossing
could be missed under certain conditions also in adaptation mode. Therefore, in order to
ensure an uninterrupted pulse train, also in adaptation mode the first detected
zero-crossing is not used. Hence under normal conditions, the first output signal is issued
at the second detected zero-crossing.
The goal of the adaptations is a signal amplitude of 25 % to 75 % and an offset of maximal
2 LSB. If the frequency is greater than 1 Hz, the system then switches from adaptation
mode to normal mode. If the frequency falls below 1 Hz, the previous mode is entered
again (start-up mode or low-speed mode).
5.2.5 Normal mode
Normal mode is entered when the necessary adjustments to the gain and offset have
been completed in adaptation mode. The goal of the normal mode is, to keep duty cycle
and jitter of the output signal within specification. If normal mode is active, the mode bit
within the AK protocol is set to logic 0. The mode bit is set to logic 1 during all other
modes.
During normal mode, amplifier gain is still adapted proportional to signal amplitude as in
adaptation mode. Thus, the input signal amplitude is between 25 % and 75 % of the signal
range. The hysteresis control, which in start-up mode and adaptation mode is carried out
depending on temperature, is now carried out depending on signal amplitude. Applied
hysteresis levels are at 23 % to 52 % of the amplitude. Due to this measure, the
hysteresis levels are high enough to provide a high level of immunity to noise and signal
disturbances. On the other hand, the hysteresis is small enough to maintain continued
comparator switching, even when offset jumps occur. For very small amplitudes, the
hysteresis is not set below a fixed minimum level and the ratio hysteresis/amplitude can
become greater than 52 %.
KMI25_2_4
Product data sheet
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Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
9 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
In adaptation mode, the offset has been reduced down to maximum 2 LSB using few
coarse compensation steps. In normal mode however, the goal is to reach and maintain
zero offset by using a slow offset correction. For this purpose, the offset compensation
level is changed at a limited rate versus time, as long as a residual offset is detected. Due
to this slow offset correction, duty cycle deviations and jitter of succeeding output pulses
are minimized. If however offset changes at a faster rate than the slow correction can
compensate, an increasing residual offset occurs. The residual offset causes a shift of the
duty cycle o at the output signal. In order to prevent o from leaving the specified window
(see characteristics in Table 10) or even loss of signal, the system switches back to
adaptation mode. If the residual offset has become greater than 50 % of the amplitude,
the system switches to adaptation mode. In adaptation mode, the remaining offset is
minimized again, as described in Section 5.2.4.
If the signal frequency drops below 1 Hz, the system also leaves normal mode and enters
low-speed mode.
Only during normal mode, the AK protocol bits which reflect the signal amplitude (LR and
LM[2:0]) are updated at each zero-crossing. When switching from normal mode to another
mode, the last bit settings from normal mode are kept constant, until the system enters
normal mode again.
5.2.6 Low-speed mode
If during adaptation mode or normal mode, the frequency drops below 1 Hz low-speed
mode is entered. If the vehicle is stationary, no signal peaks can be detected in order to
calculate amplitude and offset. Thus, the algorithms for offset compensation and
adaptation of gain and hysteresis cannot be applied. Therefore, low-speed mode acts as a
standby mode. In this mode, some of the normal functions of the algorithms are
suspended until the frequency returns above 1 Hz.
The previously calculated offset and gain setting are maintained, until the system returns
to adaptation mode. The hysteresis thresholds of the comparator are lowered to 55 % of
their previous value (if not the lowest hysteresis was already present). This measure
allows an amplitude reduction up to 44 % without loss of comparator switching.
A special case is ‘signal clipping’ during low-speed mode. Signal clipping means, that the
sensor signal reaches the positive or negative edge of the signal range. In this case, slow
offset compensation, similar to normal mode is applied. The goal of this measure is to
prevent, that the offset drift moves the full signal outside of the signal range.
The system leaves low-speed mode and enters adaptation mode as soon as the peak
detector has found four signal peaks within two seconds. As an additional condition, the
signal amplitude must be greater than 37.5 % of the value measured when entering
low-speed mode.
If no zero-crossing has been detected for typically 150 ms, an output protocol with an
artificial speed pulse is transmitted. Thus, the protocol is transmitted at a rate of at least
150 ms.
KMI25_2_4
Product data sheet
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Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
10 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
5.3 Output signal
5.3.1 Physical representation of output signal
The output signal is shown in Figure 6. A short speed pulse is transmitted after the delay
td whenever a zero-crossing of the input signal is detected. After the speed pulse, the
digital protocol unit begins to transmit the data protocol bits. Between speed pulse and the
first data cell, there is a gap of tp/2.
The data protocol consists of 8 data bits and a parity bit. The meaning of each bit is given
in Table 4.
A short pulse at HIGH-level current (typically 28 mA) reflects the gear wheel structure.
Pulses at MID-level current of typically 14 mA reflect the subsequent protocol bits.
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Timing of output signal to input signal and definition of duty cycle o
Figure 7 shows the physical representation of the protocol data bits. The protocol data bit
has a bit length tp. It is divided into two half-signal parts by the current edge in the middle
of the data bit. A rising current edge defines logic 1 whereas a falling current edge defines
logic 0. A data bit without current edge in the middle is invalid. This Manchester code
transmission is chosen for easy clock recovery.
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Fig 7.
KMI25_2_4
Product data sheet
Representation of AK protocol bits
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
11 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
5.3.2 Definition of AK protocol
Table 4 summarizes the information coded by the AK protocol bits.
Table 4.
Definition of AK protocol bits
Bit Symbol Description
Remark
Bit value directly
after power-up
0
LR
field amplitude too
small
1 if field amplitude is too low to stay in
normal mode; see Table 5
0
1
M
mode state
0 during normal mode, 1 during other
modes
1
2
DI
0
state of digital input 1 if resistance between pin DI and
pin GND is lower than minimum value of
Rext; 0 if resistance between pin DI and
pin GND is higher than maximum value of
Rext; see characteristics in Table 10
3
VDR
validity of direction
recognition
1 if direction bit is valid, normal mode and
f < fH limit for valid direction detection;
see characteristics in Table 10
0
4
DR
direction
recognition
0 if direction is positive; see Figure 9 and
Figure 10
0
5
LM0
field amplitude
bit 0, LSB
6
LM1
7
LM2
field amplitude
bit 2, Most
Significant Bit
(MSB)
8
P
parity
0
the field amplitude is divided into
7 segments; see Table 6; valid output only
field amplitude bit 1 in normal mode
0
0
1 for even parity: P = XOR (bit 0 to bit 7)
1
Table 5 summarizes the typical magnetic field amplitudes at Tamb = 25 C, below which
the LR bit is set to logic 1.
Table 5.
Typical magnetic field amplitudes at Tamb = 25 C, below which bit LR is set to
logic 1
KMI25/2
KMI25/4
Unit
< 62
< 87
A/m
Table 6 summarizes the switching levels of typical magnetic field amplitudes at
Tamb = 25 C, coded by the LM bits.
Table 6.
KMI25_2_4
Product data sheet
Typical magnetic field amplitudes at Tamb = 25 C, coded by LM bits
LM2
LM1
LM0
KMI25/2
KMI25/4
Unit
0
0
0
< 73
< 104
A/m
0
0
1
> 73
> 104
A/m
0
1
0
> 135
> 191
A/m
0
1
1
> 243
> 345
A/m
1
0
0
> 424
> 603
A/m
1
0
1
> 735
> 1045
A/m
1
1
0
> 1331
> 1893
A/m
1
1
1
> 2447
> 3485
A/m
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
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KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
5.3.3 Operation at low speed
If the last detected zero-crossing of the input signal is older than Tstop, the same protocol
is transmitted as before. Tstop is typically 150 ms, see characteristics in Table 10. It is
repeated from there on every Tstop, until a new zero-crossing is detected. If no
zero-crossing is detected within 1 s or the relevant hysteresis level not passed within
250 ms, the system enters low-speed mode. If the system was in normal mode before, the
mode bit is set from logic 0 to logic 1. In the repeated protocol in place of the speed pulse,
an artificial speed pulse of amplitude ICCM is transmitted. A special case occurs, if the
system detects a new zero-crossing while a repeat transmission is running. In this case,
the repeat transmission is terminated, before the new speed pulse is issued. Due to the
delay time td, the running bit transmission can be finalized correctly. There is a gap of at
least tp/2 between the end of the last bit and the new speed pulse.
The situation depicted in Figure 8 shows how a running repeat protocol is terminated
because a new zero-crossing is detected. In this example, the bit values are: LR = 0,
M = 0, DI = 1, VDR = 1, DR = 1, LM[2:0] = 5 (see Table 4). With M = 0 and existing repeat
protocol, the system is operating between 6.67 Hz and 1 Hz.
LQSXWVLJQDO
]HURFURVVLQJ
WG
QHZ
VSHHGSXOVH
O&&+
DUWLILFLDO
VSHHGSXOVH
RXWSXWFXUUHQW
ELWFHOOQXPEHU
ELWYDOXH
O&&0
O&&/
•WS
Fig 8.
DDD
Timing of output signal at low speed
5.3.4 Operation at high speed
The number of data protocol bits transmitted by the digital protocol unit is dependent on
the input signal frequency. At high frequencies, not all 9 data bits can be sent between two
speed pulses. In that case, some protocol bits are omitted. However each bit, started
before a new zero-crossing of the input signal, is correctly finalized. This feature is due to
the introduced delay between the zero-crossing of the input signal and the start of the
speed pulse. The situation is as shown in Figure 8 except that there is always a speed
pulse. The protocol bits that are transmitted can be found in Table 7. Spreads shown are
due to the spread of the internal oscillator. The higher its frequency the more bits fit into
one signal period. If there is an uncorrected offset, the duty cycle is unequal 50 %. In this
case, the first and second half of an input signal cycle might be different.
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
13 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
Table 7.
Transmitted protocol bits at high speed
Encoder frequency up to which protocol bits are transmitted
Bit range
at 50 % duty cycle
inclusive 40 % to 60 % duty
cycle variation
minimum
signal
frequency
[Hz]
typical signal maximum
frequency
signal
[Hz]
frequency
[Hz]
minimum
signal
frequency
[Hz]
maximum
signal
frequency
[Hz]
Bit 0 to bit 8
768
921
1151
614
1382
Bit 0 to bit 7
844
1013
1266
675
1520
Bit 0 to bit 6
983
1125
1407
750
1688
Bit 0 to bit 5
1055
1266
1582
844
1899
Bit 0 to bit 4
1205
1446
1808
964
2169
Bit 0 to bit 3
1406
1687
2108
1124
2530
Bit 0 to bit 2
1686
2023
2529
1349
3034
5.3.5 Definition of positive direction of rotation
If the encoder rotation direction is according to Figure 9 and Figure 10, the direction bit of
the AK protocol (bit 4, see Table 4) is at logic 0. In the opposite direction, the direction bit
is at logic 1.
YLHZ
VLGH
WRS
\
9&&
',
*1'
[
]
DDD
Fig 9.
Positive direction of rotation with passive encoder (ferromagnetic gear wheel)
1
6
6
\
9&&
',
*1'
1
[
6
]
6
1
DDD
Fig 10. Positive direction of rotation with active encoder (multipole wheel)
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
14 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
5.4 Digital input pin
This pin allows the user to transfer one-bit information to the sensor device for arbitrary
diagnostic purposes. Physically, an external resistance Rext between pin DI and pin GND
represents this one-bit information. The status of this bit appears as bit DI in the AK
protocol (see Table 4). If Rext is lower than a given threshold Rext(min), bit DI outputs
logic 1. If Rext is greater than a given threshold Rext(max), bit DI outputs logic 0 (see
characteristics in Table 10).
The value of the external resistor is evaluated each time a speed pulse is present. The
result of this measurement is then used to update the status of bit DI at the AK protocol
transmission which belongs to that speed pulse. After power-on bit DI is set to logic 0 until
the first speed pulse is generated. If no speed pulse is generated, i.e. if the supply current
is at LOW-level or MID-level, Rext is not measured and bit DI keeps its status. This
behavior holds also for the transmission of artificial speed pulses at very low speed or
standstill.
The resistance measurement is carried out, while current source IH is active, i.e. during
output of a speed pulse. In this case, a current of typically 21 mA flows through the
parallel connection of Rext and the internal resistance Rint (see characteristics in Table 10).
In order to get the desired one-bit information, the resulting voltage drop is compared to a
reference voltage. If the pin DI is left open, the voltage drop Vo appears at this pin. Vo is
the voltage drop across Rint due to the current of 21 mA (see characteristics in Table 10).
If pin DI is not used, it should be connected to pin GND.
6. Limiting values
Table 8.
Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134). Voltages are referred to pin GND.
Symbol Parameter
VCC
supply voltage
IDI
current on pin DI
Tamb
ambient temperature
Conditions
Min
Max
Unit
40 C < Tamb < +60 C; t < 2 minutes
-
24
V
40 C < Tamb < +60 C
-
18
V
40 C < Tamb < +150 C
-
16
V
150 C < Tamb < 175 C; 10  10 minutes during total
life time; none destructive but no functionality granted
-
16
V
normal operation mode
VCC and GND incidentally swapped
16.5 -
V
40 C < Tamb < +25 C; t < 2 minutes
80
+80
mA
40
+150 C
for 10  10 minutes during total life time; VCC < 16 V
40
+175 C
Tstg
storage temperature
no voltage applied
50
+150 C
Tsld
soldering temperature
for maximum 5 s
-
260
C
Hext
external magnetic field strength
-
30
kA/m
KMI25_2_4
Product data sheet
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Rev. 1 — 29 April 2016
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15 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
7. Recommended operating conditions
Table 9.
Operating conditions
Voltages are referred to pin GND.
Symbol
Parameter
Conditions
Min
Max
Unit
VCC
supply voltage
normal operation mode; Tamb  175 C
6.8
16
V
-
50

normal operation mode
40
+150
C
0
2.5
kHz
KMI25/2
150
-
A/m
KMI25/4
190
-
A/m
KMI25/2
200
-
A/m
KMI25/4
210
-
A/m
KMI25/2
-
528
A/m
KMI25/4
-
911
A/m
non-recurring changes
40
+100
%
periodic changes
10
+10
%
RL
load resistance
Tamb
ambient temperature
fH
magnetic field strength frequency
HM
peak magnetic field strength
after power-on; speed pulses latest
after Ncy(H) magnetic cycles; see
characteristics in Table 10
after power-on; valid direction output
signal latest after Ncy(H) magnetic
cycles; see characteristics in Table 10
Hoffset(ext)
HM
external magnetic field strength
offset (absolute value)
peak magnetic field strength
variation
to allow correct start-up after power-on
allowable sudden change of magnetic
signal peak level without loss of speed
pulses
8. Characteristics
Table 10. Characteristics
Characteristics are valid for the operating conditions specified in Section 7; voltages are referred to pin GND; unless
otherwise specified.
Symbol
Parameter
Conditions
Min
Typ
Max
Unit
Supply voltage and current
VCC(swon)
switch-on supply voltage
[1]
5.8
6.3
6.8
V
td(on)
turn-on delay time
[2]
-
-
1
ms
VCC(swoff)
switch-off supply voltage
[1]
4.0
4.5
5.0
V
VCC(hys)
supply voltage hysteresis
switch-on/switch-off
1.6
1.8
2.8
V
ICC(swoff)
switch-off supply current
VCC < 4 V
1.0
3.0
3.8
mA
ICCL
LOW-level supply current
5.88
7.0
8.4
mA
ICCM
MID-level supply current
11.7
14.0
16.8
mA
ICCH
HIGH-level supply current
23.5
28.0
33.6
mA
ICCM/ICCL
MID-level supply current to
LOW-level supply current ratio
1.8
2.0
-
-
KMI25_2_4
Product data sheet
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Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
16 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
Table 10. Characteristics …continued
Characteristics are valid for the operating conditions specified in Section 7; voltages are referred to pin GND; unless
otherwise specified.
Symbol
Parameter
ICCH/ICCL
dICC/dt
Conditions
Min
Typ
Max
Unit
HIGH-level supply current to
LOW-level supply current ratio
3.6
4.0
-
-
rate of change of supply current ICCL to ICCH and ICCL to ICCM (10 % to 90 %
and 90 % to 10 %)
6
-
28
mA/s
Timing parameters
td
delay time
delay between magnetic zero-crossing and
output switching; see Figure 6
70
-
121
s
tp
pulse duration
duration of speed pulses and AK protocol
bits; see Figure 6
40
50
60
s
Tstop
stop period
stand still period
105
150
195
ms
(T)
period jitter
one-sigma value; required peak level of
magnetic signal: HM = 280 A/m (KMI25/2)
HM = 398 A/m (KMI25/4)
0.1
-
+0.1
%
one-sigma value; required peak level of
magnetic signal: HM = 55 A/m (KMI25/2)
HM = 78 A/m (KMI25/4)
0.5
-
+0.5
%
o
output duty cycle
required peak level of magnetic signal:
HM = 55 A/m (KMI25/2)
HM = 78 A/m (KMI25/4)
[3]
30
-
70
%
required peak level of magnetic signal:
HM = 75 A/m (KMI25/2)
HM = 107 A/m (KMI25/4)
[3]
40
-
60
%
Digital input
Rint
internal resistance
pin DI to pin GND
-
10
-

Vo
output voltage
open circuit for pin DI; pin DI to pin GND;
only present during output of speed pulse,
i.e. ICC = ICCH
-
210
-
mV
Rext
external resistance
pin DI to pin GND; AK protocol
bit DI = 1
-
-
20

bit DI = 0
150
-
-

2
-
Direction detection
Nspd
number of speed pulses
until direction indication is valid after
power-on or change in direction
-
-
fH
magnetic field strength
frequency
limit for valid direction detection
800
1000 -
Hz
hysteresis for direction detection
28
40
52
Hz
Start-up performance after power-on, if magnetic field amplitude > minimum value of HM and fH > 1 Hz
Ncy(H)
number of magnetic field cycles no external magnetic offset; duty cycle
within specification
KMI25_2_4
Product data sheet
-
-
15
-
no external magnetic offset; mode bit set to
logic 0
-
-
16
-
maximum allowed external magnetic offset;
duty cycle within specification
-
-
23
-
maximum allowed external magnetic offset;
mode bit set to logic 0
-
-
24
-
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
17 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
[1]
Once VCC has exceeded VCC(swon), the sensor switches on and current levels and current ratios are maintained until VCC falls below
VCC(swoff).
[2]
After supplying more than VCC(swon) to the device, it needs a turn-on delay time of td(on) to reach stable operation. A stable supply current
indicates stable operation.
[3]
During normal mode; for definition of duty cycle see Figure 6.
9. ElectroMagnetic Compatibility (EMC)
The following tests by an independent and certified test laboratory have verified EMC:
9.1 Emission
• CISPR 25 (2008, third edition), Chapter 6.2: conducted emission, voltage method
• CISPR 25 (2002, second edition), Chapter 6.4: radiated emission, Absorber-Lined
Shielded Enclosure (ALSE) method
9.2 Immunity to electrical transients
Tests were carried out with external protection circuit.
• ISO 7637-3: electrical transient transmission by capacitive coupling
9.3 Immunity to radiated disturbances
• ISO 11452-2: antenna in ALSE, including radar pulses
• ISO 11452-4: Bulk Current Injection (BCI)
– Substitution method
• ISO 11452-5: strip line
10. ElectroStatic Discharge (ESD)
The following tests have verified ESD:
10.1 Human body model (AEC-Q100-002)
8 kV at external pins (VCC, DI and GND)
500 V at internal AMR bridge pins
10.2 Machine model (AEC-Q100-003)
400 V at external pins (VCC, DI and GND)
100 V at internal AMR bridge pins
10.3 Charged-device model (AEC-Q100-011)
1 kV at external pins (VCC, DI and GND)
500 V at internal AMR bridge pins
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
18 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
11. Application information
9&&
6(1625
',
*1'
VXSSO\
,&&
5/
RXWSXW
VLJQDO
DDD
Fig 11. Test and application circuit (pin DI unused)
9&&
6(1625
',
5H[W
*1'
VXSSO\
,&&
5/
RXWSXW
VLJQDO
DDD
Fig 12. Test and application circuit (pin DI used)
12. Test information
12.1 Quality information
This product has been qualified in accordance with the Automotive Electronics Council
(AEC) standard Q100 Rev-G (grade 0) - Failure mechanism based stress test qualification
for integrated circuits, and is suitable for use in automotive applications.
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
19 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
13. Marking
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QQQQQ
EDWFK
QXPEHU
EDWFK
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.0,
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;<<<=
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PRYLQJGLUHFWLRQ
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PRYLQJGLUHFWLRQ
HQFRGHU
DDD
DDD
X: product manufacturing code; m for manufacturing Manila and p for manufacturing Hong Kong
YYY: day of year
Z: year of production (last figure)
a. KMI25/2
b. KMI25/4
Fig 13. Marking
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
20 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
14. Package outline
3ODVWLFVLQJOHHQGHGPXOWLFKLSSDFNDJH
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Fig 14. Package outline SOT477A (SIP3)
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
21 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
3ODVWLFVLQJOHHQGHGPXOWLFKLSSDFNDJH
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Fig 15. Package outline SOT477E (SIP3)
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
22 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
15. Handling information
5PLQ
DDD
Dimensions in mm
(1) No bending allowed.
(2) Plastic body and interface plastic body - leads: application of bending forces not allowed.
Fig 16. Bending recommendation
16. Solderability information
The solderability qualification is according to AEC-Q100 Rev-G. Recommended soldering
process for leaded devices is wave soldering. The maximum soldering temperature is
260 C for maximum 5 s. Device terminals are compatible with laser and electrical
welding. The device is reflow capable.
17. Revision history
Table 11.
Revision history
Document ID
Release date
Data sheet status
Change notice
Supersedes
KMI25_2_4 v.1
20160429
Product data sheet
-
-
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
23 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
18. Legal information
18.1 Data sheet status
Document status[1][2]
Product status[3]
Definition
Objective [short] data sheet
Development
This document contains data from the objective specification for product development.
Preliminary [short] data sheet
Qualification
This document contains data from the preliminary specification.
Product [short] data sheet
Production
This document contains the product specification.
[1]
Please consult the most recently issued document before initiating or completing a design.
[2]
The term ‘short data sheet’ is explained in section “Definitions”.
[3]
The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status
information is available on the Internet at URL http://www.nxp.com.
18.2 Definitions
Draft — The document is a draft version only. The content is still under
internal review and subject to formal approval, which may result in
modifications or additions. NXP Semiconductors does not give any
representations or warranties as to the accuracy or completeness of
information included herein and shall have no liability for the consequences of
use of such information.
Short data sheet — A short data sheet is an extract from a full data sheet
with the same product type number(s) and title. A short data sheet is intended
for quick reference only and should not be relied upon to contain detailed and
full information. For detailed and full information see the relevant full data
sheet, which is available on request via the local NXP Semiconductors sales
office. In case of any inconsistency or conflict with the short data sheet, the
full data sheet shall prevail.
Product specification — The information and data provided in a Product
data sheet shall define the specification of the product as agreed between
NXP Semiconductors and its customer, unless NXP Semiconductors and
customer have explicitly agreed otherwise in writing. In no event however,
shall an agreement be valid in which the NXP Semiconductors product is
deemed to offer functions and qualities beyond those described in the
Product data sheet.
18.3 Disclaimers
AK protocol — Supply of this product providing an implementation of the AK
protocol does not convey a license nor imply a right under any patent, or any
other industrial or intellectual property right of Continental Teves AG & Co.
oHG to use the AK protocol. It is hereby notified that a license for the use of
this product is required from Continental Teves AG & Co. oHG.
Limited warranty and liability — Information in this document is believed to
be accurate and reliable. However, NXP Semiconductors does not give any
representations or warranties, expressed or implied, as to the accuracy or
completeness of such information and shall have no liability for the
consequences of use of such information. NXP Semiconductors takes no
responsibility for the content in this document if provided by an information
source outside of NXP Semiconductors.
In no event shall NXP Semiconductors be liable for any indirect, incidental,
punitive, special or consequential damages (including - without limitation - lost
profits, lost savings, business interruption, costs related to the removal or
replacement of any products or rework charges) whether or not such
damages are based on tort (including negligence), warranty, breach of
contract or any other legal theory.
Notwithstanding any damages that customer might incur for any reason
whatsoever, NXP Semiconductors’ aggregate and cumulative liability towards
customer for the products described herein shall be limited in accordance
with the Terms and conditions of commercial sale of NXP Semiconductors.
KMI25_2_4
Product data sheet
Right to make changes — NXP Semiconductors reserves the right to make
changes to information published in this document, including without
limitation specifications and product descriptions, at any time and without
notice. This document supersedes and replaces all information supplied prior
to the publication hereof.
Applications — Applications that are described herein for any of these
products are for illustrative purposes only. NXP Semiconductors makes no
representation or warranty that such applications will be suitable for the
specified use without further testing or modification.
Customers are responsible for the design and operation of their applications
and products using NXP Semiconductors products, and NXP Semiconductors
accepts no liability for any assistance with applications or customer product
design. It is customer’s sole responsibility to determine whether the NXP
Semiconductors product is suitable and fit for the customer’s applications and
products planned, as well as for the planned application and use of
customer’s third party customer(s). Customers should provide appropriate
design and operating safeguards to minimize the risks associated with their
applications and products.
NXP Semiconductors does not accept any liability related to any default,
damage, costs or problem which is based on any weakness or default in the
customer’s applications or products, or the application or use by customer’s
third party customer(s). Customer is responsible for doing all necessary
testing for the customer’s applications and products using NXP
Semiconductors products in order to avoid a default of the applications and
the products or of the application or use by customer’s third party
customer(s). NXP does not accept any liability in this respect.
Limiting values — Stress above one or more limiting values (as defined in
the Absolute Maximum Ratings System of IEC 60134) will cause permanent
damage to the device. Limiting values are stress ratings only and (proper)
operation of the device at these or any other conditions above those given in
the Recommended operating conditions section (if present) or the
Characteristics sections of this document is not warranted. Constant or
repeated exposure to limiting values will permanently and irreversibly affect
the quality and reliability of the device.
Terms and conditions of commercial sale — NXP Semiconductors
products are sold subject to the general terms and conditions of commercial
sale, as published at http://www.nxp.com/profile/terms, unless otherwise
agreed in a valid written individual agreement. In case an individual
agreement is concluded only the terms and conditions of the respective
agreement shall apply. NXP Semiconductors hereby expressly objects to
applying the customer’s general terms and conditions with regard to the
purchase of NXP Semiconductors products by customer.
No offer to sell or license — Nothing in this document may be interpreted or
construed as an offer to sell products that is open for acceptance or the grant,
conveyance or implication of any license under any copyrights, patents or
other industrial or intellectual property rights.
Suitability for use in automotive applications — This NXP
Semiconductors product has been qualified for use in automotive
applications. Unless otherwise agreed in writing, the product is not designed,
authorized or warranted to be suitable for use in life support, life-critical or
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
24 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
safety-critical systems or equipment, nor in applications where failure or
malfunction of an NXP Semiconductors product can reasonably be expected
to result in personal injury, death or severe property or environmental
damage. NXP Semiconductors and its suppliers accept no liability for
inclusion and/or use of NXP Semiconductors products in such equipment or
applications and therefore such inclusion and/or use is at the customer's own
risk.
Quick reference data — The Quick reference data is an extract of the
product data given in the Limiting values and Characteristics sections of this
document, and as such is not complete, exhaustive or legally binding.
Export control — This document as well as the item(s) described herein
may be subject to export control regulations. Export might require a prior
authorization from competent authorities.
Translations — A non-English (translated) version of a document is for
reference only. The English version shall prevail in case of any discrepancy
between the translated and English versions.
18.4 Trademarks
Notice: All referenced brands, product names, service names and trademarks
are the property of their respective owners.
19. Contact information
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
KMI25_2_4
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 29 April 2016
© NXP Semiconductors N.V. 2016. All rights reserved.
25 of 26
KMI25/2; KMI25/4
NXP Semiconductors
High performance rotational speed sensor
20. Contents
1
1.1
1.2
1.3
2
3
4
5
5.1
5.2
5.2.1
5.2.2
5.2.3
5.2.4
5.2.5
5.2.6
5.3
5.3.1
5.3.2
5.3.3
5.3.4
5.3.5
5.4
6
7
8
9
9.1
9.2
9.3
10
10.1
10.2
10.3
11
12
12.1
13
14
15
16
17
18
18.1
Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1
General description . . . . . . . . . . . . . . . . . . . . . 1
Features and benefits . . . . . . . . . . . . . . . . . . . . 1
Quick reference data . . . . . . . . . . . . . . . . . . . . 2
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Functional diagram . . . . . . . . . . . . . . . . . . . . . . 3
Functional description . . . . . . . . . . . . . . . . . . . 3
System architecture . . . . . . . . . . . . . . . . . . . . . 3
Speed signal conditioning algorithm . . . . . . . . . 6
Peak detector . . . . . . . . . . . . . . . . . . . . . . . . . . 7
Frequency measurement . . . . . . . . . . . . . . . . . 8
Start-up mode . . . . . . . . . . . . . . . . . . . . . . . . . . 8
Adaptation mode. . . . . . . . . . . . . . . . . . . . . . . . 9
Normal mode . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Low-speed mode . . . . . . . . . . . . . . . . . . . . . . 10
Output signal . . . . . . . . . . . . . . . . . . . . . . . . . 11
Physical representation of output signal . . . . . 11
Definition of AK protocol . . . . . . . . . . . . . . . . . 12
Operation at low speed. . . . . . . . . . . . . . . . . . 13
Operation at high speed . . . . . . . . . . . . . . . . . 13
Definition of positive direction of rotation . . . . 14
Digital input pin . . . . . . . . . . . . . . . . . . . . . . . . 15
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Recommended operating conditions. . . . . . . 16
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 16
ElectroMagnetic Compatibility (EMC) . . . . . . 18
Emission . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Immunity to electrical transients . . . . . . . . . . . 18
Immunity to radiated disturbances . . . . . . . . . 18
ElectroStatic Discharge (ESD) . . . . . . . . . . . . 18
Human body model (AEC-Q100-002). . . . . . . 18
Machine model (AEC-Q100-003) . . . . . . . . . . 18
Charged-device model (AEC-Q100-011) . . . . 18
Application information. . . . . . . . . . . . . . . . . . 19
Test information . . . . . . . . . . . . . . . . . . . . . . . . 19
Quality information . . . . . . . . . . . . . . . . . . . . . 19
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 21
Handling information. . . . . . . . . . . . . . . . . . . . 23
Solderability information. . . . . . . . . . . . . . . . . 23
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 23
Legal information. . . . . . . . . . . . . . . . . . . . . . . 24
Data sheet status . . . . . . . . . . . . . . . . . . . . . . 24
18.2
18.3
18.4
19
20
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . .
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . .
Trademarks . . . . . . . . . . . . . . . . . . . . . . . . . .
Contact information . . . . . . . . . . . . . . . . . . . .
Contents. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
24
24
25
25
26
Please be aware that important notices concerning this document and the product(s)
described herein, have been included in section ‘Legal information’.
© NXP Semiconductors N.V. 2016.
All rights reserved.
For more information, please visit: http://www.nxp.com
For sales office addresses, please send an email to: [email protected]
Date of release: 29 April 2016
Document identifier: KMI25_2_4