ISL6209 ® Data Sheet High Voltage Synchronous Rectified Buck MOSFET Driver The ISL6209 is a high frequency, dual MOSFET driver, optimized to drive two N-Channel power MOSFETs in a synchronous-rectified buck converter topology in mobile computing applications. This driver, combined with an Intersil Multi-Phase Buck PWM controller, such as ISL6216, ISL6244, and ISL6247, forms a complete single-stage core-voltage regulator solution for advanced mobile microprocessors. The ISL6209 features 4A typical sink current for the lower gate driver. The 4A typical sink current is capable of holding the lower MOSFET gate during the PHASE node rising edge to prevent the shoot-through power loss caused by the high dv/dt of the PHASE node. The operation voltage matches the 30V breakdown voltage of the MOSFETs commonly used in mobile computer power supplies. The ISL6209 also features a three-state PWM input that, working together with most of Intersil multiphase PWM controllers, will prevent a negative transient on the output voltage when the output is being shut down. This feature eliminates the Schottky diode, that is usually seen in a microprocessor power system for protecting the microprocessor, from reversed-output-voltage damage. The ISL6209 has the capacity to efficiently switch power MOSFETs at frequencies up to 2MHz. Each driver is capable of driving a 3000pF load with a 8ns propagation delay and less than a 10ns transition time. This product implements bootstrapping on the upper gate with an internal bootstrap Schottky diode, reducing implementation cost, complexity, and allowing the use of higher performance, cost effective N-Channel MOSFETs. Programmable dead-time with gate threshold monitoring is integrated to prevent both MOSFETs from conducting simultaneously. March 2004 FN9132 Features • Drives Two N-Channel MOSFETs • Shoot-Through Protection - Active Gate Threshold Monitoring - Programmable Dead-Time • 30V Operation Voltage • 0.4Ω On-Resistance and 4A Sink Current Capability • Supports High Switching Frequency - Fast Output Rise Time - Propagation Delay 8ns • Three-State PWM Input for Power Stage Shutdown • Internal Bootstrap Schottky Diode • QFN Package: - Compliant to JEDEC PUB95 MO-220 QFN - Quad Flat No Leads - Package Outline - Near Chip Scale Package footprint, which improves PCB efficiency and has a thinner profile • Pb-Free Available as an Option Applications • Core Voltage Supplies for Intel and AMD® Mobile Microprocessors • High Frequency Low Profile DC-DC Converters • High Current Low Output Voltage DC-DC Converters • High Input Voltage DC-DC Converter Ordering Information PART # TEMP. RANGE (°C) PACKAGE PKG. DWG. # ISL6209CB -10 to 100 8 Ld SOIC M8.15 Related Literature ISL6209CBZ (Note) -10 to 100 M8.15 • Technical Brief TB363 “Guidelines for Handling and Processing Moisture Sensitive Surface Mount Devices (SMDs)” 8 Ld SOIC (Pb-free) ISL6209CB-T • Technical Brief TB389 “PCB Land Pattern Design and Surface Mount Guidelines for QFN Packages” ISL6209CR -10 to 100 8 Ld 3x3 QFN L8.3x3 ISL6209CRZ (Note) -10 to 100 8 Ld 3x3 QFN L8.3x3 (Pb-free) 8 Ld SOIC Tape and Reel ISL6209CBZ-T (Note) 8 Ld SOIC Tape and Reel (Pb-free) ISL6209CR-T 8 Ld QFN Tape and Reel ISL6209CRZ-T (Note) 8 Ld QFN Tape and Reel (Pb-free) NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which is compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J Std-020B. 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2004. All Rights Reserved. Intel® is a registered trademark of Intel Corporation. AMD® is a registered trademark of Advanced Micro Devices, Inc. All other trademarks mentioned are the property of their respective owners. ISL6209 Pinouts UGATE 1 8 PHASE BOOT 2 7 DELAY PWM 3 6 VCC GND 4 5 LGATE PHASE ISL6209 (QFN) TOP VIEW UGATE ISL6209 (SOIC) TOP VIEW 8 7 66 DELAY BOOT 1 PWM 2 5 VCC 4 LGATE GND 3 ISL6209 Block Diagram VCC BOOT DELAY UGATE CONTROL LOGIC PWM PHASE SHOOTTHROUGH PROTECTION VCC LGATE 10K GND THERMAL PAD (FOR QFN PACKAGE ONLY) FIGURE 1. BLOCK DIAGRAM 2 ISL6209 Typical Application - Two Phase Converter Using ISL6209 Gate Drivers VBAT +5V +5V VCC +5V FB +VCORE BOOT COMP UGATE VCC VSEN PWM1 PWM2 PGOOD PWM DRIVE ISL6209 DELAY PHASE LGATE MAIN CONTROL ISEN1 VID ISEN2 VCC FS VBAT +5V BOOT DACOUT GND UGATE PWM DELAY DRIVE ISL6209 PHASE LGATE FIGURE 2. TYPICAL APPLICATION 3 ISL6209 Absolute Maximum Ratings Thermal Information Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 7V BOOT Voltage (VBOOT). . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 33V Phase Voltage (VPHASE) (Note 1) . . . VBOOT - 7V to VBOOT + 0.3V Input Voltage (VPWM) . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V UGATE. . . . . . . . . . . . . . . . . . . . . . VPHASE - 0.3V to VBOOT + 0.3V LGATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to VCC + 0.3V Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-40°C to 125°C Thermal Resistance (Typical Notes 2, 3, 4) θJA (°C/W) θJC (°C/W) SOIC Package (Note 2) . . . . . . . . . . . . 110 N/A QFN Package (Notes 3, 4). . . . . . . . . . 80 15 Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C (SOIC - Lead Tips Only) Recommended Operating Conditions Ambient Temperature Range . . . . . . . . . . . . . . . . . . .-10°C to 100°C Maximum Operating Junction Temperature. . . . . . . . . . . . . . 125°C Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5V ±10% CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTES: 1. The Phase Voltage is capable of withstanding -7V when the BOOT pin is at GND. 2. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details. 3. θJA is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features. See Tech Brief TB379. 4. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside. Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS - 85 - µA POR Rising - 3.4 4.2 POR Falling 2.2 2.9 - - 500 - mV 0.40 0.60 0.65 V VPWM = 5V - 250 - µA VPWM = 0V - -250 - µA PWM Three-State Rising Threshold VVCC = 5V - - 1.8 V PWM Three-State Falling Threshold VVCC = 5V 3.1 - - V Three-State Shutdown Holdoff Time VVCC = 5V, temperature = 25°C - 150 - ns VCC SUPPLY CURRENT Bias Supply Current IVCC PWM pin floating, VVCC = 5V Hysteresis BOOTSTRAP DIODE Forward Voltage VF VVCC = 5V, forward bias current = 2mA PWM INPUT Input Current IPWM SWITCHING TIME UGATE Rise Time tRUGATE VVCC = 5V, 3nF Load - 8 - ns LGATE Rise Time tRLGATE VVCC = 5V, 3nF Load - 8 - ns UGATE Fall Time tFUGATE VVCC = 5V, 3nF Load - 8 - ns LGATE Fall Time tFLGATE VVCC = 5V, 3nF Load - 4 - ns UGATE Turn-Off Propagation Delay tPDLUGATE VVCC = 5V, 3nF Load, DELAY = VCC - 8 - ns LGATE Turn-Off Propagation Delay tPDLLGATE VVCC = 5V, 3nF Load, DELAY = VCC - 8 - ns UGATE Turn-On Propagation Delay tPDHUGATE VVCC = 5V, Outputs Unloaded, DELAY = VCC 5 8 12 ns LGATE Turn-On Propagation Delay tPDHLGATE VVCC = 5V, Outputs Unloaded, DELAY = VCC 5 8 12 ns 4 ISL6209 Electrical Specifications Recommended Operating Conditions, Unless Otherwise Noted. (Continued) PARAMETER SYMBOL TEST CONDITIONS MIN TYP MAX UNITS OUTPUT Upper Drive Source Resistance RUGATE 500mA Source Current - 1.0 2.5 Ω Upper Driver Source Current (Note 5) IUGATE VUGATE-PHASE = 2.5V - 2.0 - A Upper Drive Sink Resistance RUGATE 500mA Sink Current - 1.0 2.5 Ω Upper Driver Sink Current (Note 5) IUGATE VUGATE-PHASE = 2.5V - 2.0 - A Lower Drive Source Resistance RLGATE 500mA Source Current - 1.0 2.5 Ω Lower Driver Source Current (Note 5) ILGATE VLGATE = 2.5V - 2.0 - A Lower Drive Sink Resistance RLGATE 500mA Sink Current - 0.4 1.0 Ω Lower Driver Sink Current (Note 5) ILGATE VLGATE = 2.5V - 4.0 - A NOTE: 5. Guaranteed by design, not tested. Functional Pin Description UGATE (Pin 1 for SOIC-8, Pin 8 for QFN) The UGATE pin is the upper gate drive output. Connect to the gate of high-side power N-Channel MOSFET. BOOT (Pin 2 for SOIC-8, Pin 1 for QFN) DELAY (Pin 7 for SOIC-8, Pin 6 for QFN) The DELAY pin sets the dead-time between gate switching for the ISL6209. Connect a resistor to GND from this pin to adjust the dead-time, refer to Figure 5. Tie this pin to VCC to disable the delay circuitry. See Shoot-Through Protection section for more detail. BOOT is the floating bootstrap supply pin for the upper gate drive. Connect the bootstrap capacitor between this pin and the PHASE pin. The bootstrap capacitor provides the charge to turn on the upper MOSFET. See the Bootstrap Diode and Capacitor section under DESCRIPTION for guidance in choosing the appropriate capacitor value. PHASE (Pin 8 for SOIC-8, Pin 7 for QFN) PWM (Pin 3 for SOIC-8, Pin 2 for QFN) Operation The PWM signal is the control input for the driver. The PWM signal can enter three distinct states during operation, see the three-state PWM Input section under DESCRIPTION for further details. Connect this pin to the PWM output of the controller. In addition, place a 500kΩ resistor to ground from this pin. This allows for proper three-state operation under all start-up conditions. Designed for speed, the ISL6209 dual MOSFET driver controls both high-side and low-side N-Channel FETs from one externally provided PWM signal. GND (Pin 4 for SOIC-8, Pin 3 for QFN) GND is the ground pin. All signals are referenced to this node. LGATE (Pin 5 for SOIC-8, Pin 4 for QFN) LGATE is the lower gate drive output. Connect to gate of the low-side power N-Channel MOSFET. VCC (Pin 6 for SOIC-8, Pin 5 for QFN) Connect the VCC pin to a +5V bias supply. Place a high quality bypass capacitor from this pin to GND. 5 Connect the PHASE pin to the source of the upper MOSFET and the drain of the lower MOSFET. This pin provides a return path for the upper gate driver. Description A rising edge on PWM initiates the turn-off of the lower MOSFET (see Timing Diagram). After a short propagation delay [tPDLLGATE], the lower gate begins to fall. Typical fall times [tFLGATE] are provided in the Electrical Specifications section. Adaptive shoot-through circuitry monitors the LGATE voltage and determines the upper gate delay time [tPDHUGATE], based on how quickly the LGATE voltage drops below 1V. This prevents both the lower and upper MOSFETs from conducting simultaneously, or shootthrough. Once this delay period is completed, the upper gate drive begins to rise [tRUGATE], and the upper MOSFET turns on. ISL6209 PWM tPDHUGATE tRUGATE tPDLUGATE tFUGATE 1V UGATE LGATE 1V tFLGATE tRLGATE tPDLLGATE tPDHLGATE FIGURE 3. TIMING DIAGRAM A falling transition on PWM indicates the turn-off of the upper MOSFET and the turn-on of the lower MOSFET. A short propagation delay [tPDLUGATE] is encountered before the upper gate begins to fall [tFUGATE]. Again, the adaptive shoot-through circuitry determines the lower gate delay time tPDHLGATE. The upper MOSFET gate-to-source voltage is monitored, and the lower gate is allowed to rise, after the upper MOSFET gate-to-source voltage drops below 1V. The lower gate then rises [tRLGATE], turning on the lower MOSFET. This driver is optimized for converters with large step down ratio, such as those used in a mobile-computer core voltage regulator. The lower MOSFET is usually sized much larger.Timing Diagram This driver is optimized for converters with large step down compared to the upper MOSFET because the lower MOSFET conducts for a much longer time in a switching period. The lower gate driver is therefore sized much larger to meet this application requirement. The 0.4Ω on-resistance and 4A sink current capability enable the lower gate driver to absorb the current injected to the lower gate through the drain-to-gate capacitor of the lower MOSFET and prevent a shoot through caused by the high dv/dt of the phase node. Three-State PWM Input A unique feature of the ISL6209 and other Intersil drivers is the addition of a shutdown window to the PWM input. If the PWM signal enters and remains within the shutdown window for a set holdoff time, the output drivers are disabled and both MOSFET gates are pulled and held low. The shutdown state is removed when the PWM signal moves outside the shutdown window. Otherwise, the PWM rising and falling 6 thresholds outlined in the ELECTRICAL SPECIFICATIONS determine when the lower and upper gates are enabled. During start-up, PWM should be in the three-state position (1/2 VCC) until actively driven by the controller IC. Shoot-Through Protection The ISL6209 driver delivers shoot-through protection by incorporating gate threshold monitoring and programmable dead-time to prevent upper and lower MOSFETs from conducting simultaneously, thereby shorting the input supply to ground. Gate threshold monitoring ensures that one gate is OFF before the other is allowed to turn ON. During turn-off of the lower MOSFET, the LGATE voltage is monitored until it reaches a 1V threshold, at which time the UGATE is released to rise. Internal circuitry monitors the upper MOSFET gate-to-source voltage during UGATE turn-off. Once the upper MOSFET gate-to-source voltage has dropped below a threshold of 1V, the LGATE is allowed to rise. In addition to gate threshold monitoring, a programmable delay between MOSFET switching can be accomplished by placing a resistor from the DELAY pin to ground. This delay allows for maximum design flexibility over MOSFET selection. The delay can be programmed from 5ns to 50ns. If not desired, the DELAY pin must be tied to VCC to disable the delay circuitry. Gate threshold monitoring is not affected by the addition or removal of the additional dead-time. Refer to Figure 4 and Figure 5 for more detail. ISL6209 DELAY = VCC DELAY = RESISTOR TO GROUND GATE B GATE A GATE B GATE A tdelay = 5n - 50ns tPDHUGATE 1V 1V FIGURE 4. PROGRAMMABLE DEAD-TIME: TOTAL DELAY = tPDHUGATE + tdelay bootstrap capacitor can be chosen from the following equation: 4 50 45 Q GATE C BOOT ≥ -----------------------∆V BOOT DEAD-TIME (ns) 40 35 30 where QGATE is the amount of gate charge required to fully charge the gate of the upper MOSFET. The ∆VBOOT term is defined as the allowable droop in the rail of the upper drive. tDELAY 25 As an example, suppose an upper MOSFET has a gate charge, QGATE , of 25nC at 5V and also assume the droop in the drive voltage over a PWM cycle is 200mV. One will find that a bootstrap capacitance of at least 0.125µF is required. The next larger standard value capacitance is 0.22µF. A good quality ceramic capacitor is recommended. 20 15 10 5 0 0 50 100 150 200 250 300 RDELAY (kΩ) 2.0 FIGURE 5. ADDITIONAL PROGRAMMED DEAD-TIME (tDELAY) vs DELAY RESISTOR VALUE 1.8 1.6 The equation governing the dead-time seen in Figure 5 is expressed as: – 15 ) × R DELAY ] + 6ns The equation can be rewritten to solve for RDELAY as follows: CBOOT(µF) T DELAY = [ ( 160 × 10 1.4 1.2 1.0 0.8 0.6 ( T DELAY – 6ns ) R DELAY = ------------------------------------------160 × 10 – 15 0.4 Internal Bootstrap Diode 0.0 QGATE = 100nC 50nC 0.2 20nC This driver features an internal bootstrap Schottky diode. Simply adding an external capacitor across the BOOT and PHASE pins completes the bootstrap circuit. The bootstrap capacitor must have a maximum voltage rating above the maximum battery voltage plus 5V. The 7 0.0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 ∆VBOOT(V) FIGURE 6. BOOTSTRAP CAPACITANCE vs BOOT RIPPLE VOLTAGE ISL6209 Power Dissipation 1000 P = f sw ( 1.5V U Q + V L Q ) + I VCC V U L CC where fsw is the switching frequency of the PWM signal. VU and VL represent the upper and lower gate rail voltage. QU and QL is the upper and lower gate charge determined by MOSFET selection and any external capacitance added to the gate pins. The IVCC VCC product is the quiescent power of the driver and is typically negligible. 8 QU =50nC 900 QU =100nC 800 QL =100nC QU =50nC QL =50nC QL = 200nC 700 POWER (mW) Package power dissipation is mainly a function of the switching frequency and total gate charge of the selected MOSFETs. Calculating the power dissipation in the driver for a desired application is critical to ensuring safe operation. Exceeding the maximum allowable power dissipation level will push the IC beyond the maximum recommended operating junction temperature of 125°C. The maximum allowable IC power dissipation for the SO-8 package is approximately 800mW. When designing the driver into an application, it is recommended that the following calculation be performed to ensure safe operation at the desired frequency for the selected MOSFETs. The power dissipated by the driver is approximated as: 600 QU=20nC 500 QL =50nC 400 300 200 100 0 0 200 400 600 800 1000 1200 1400 1600 1800 2000 FREQUENCY (kHz) FIGURE 7. POWER DISSIPATION vs FREQUENCY ISL6209 Quad Flat No-Lead Plastic Package (QFN) Micro Lead Frame Plastic Package (MLFP) L8.3x3 8 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE (COMPLIANT TO JEDEC MO-220VEEC ISSUE C) MILLIMETERS SYMBOL MIN NOMINAL MAX NOTES A 0.80 0.90 1.00 - A1 - - 0.05 - A2 - - 1.00 A3 b 0.23 D 0.28 9 0.38 5, 8 3.00 BSC D1 D2 9 0.20 REF - 2.75 BSC 0.25 1.10 9 1.25 7, 8 E 3.00 BSC - E1 2.75 BSC 9 E2 0.25 e 1.10 1.25 7, 8 0.65 BSC k 0.25 L 0.35 L1 - - - 0.60 0.75 8 - 0.15 10 N 8 2 Nd 2 3 Ne 2 3 P - - 0.60 9 θ - - 12 9 Rev. 1 10/02 NOTES: 1. Dimensioning and tolerancing conform to ASME Y14.5-1994. 2. N is the number of terminals. 3. Nd and Ne refer to the number of terminals on each D and E. 4. All dimensions are in millimeters. Angles are in degrees. 5. Dimension b applies to the metallized terminal and is measured between 0.15mm and 0.30mm from the terminal tip. 6. The configuration of the pin #1 identifier is optional, but must be located within the zone indicated. The pin #1 identifier may be either a mold or mark feature. 7. Dimensions D2 and E2 are for the exposed pads which provide improved electrical and thermal performance. 8. Nominal dimensions are provided to assist with PCB Land Pattern Design efforts, see Intersil Technical Brief TB389. 9. Features and dimensions A2, A3, D1, E1, P & θ are present when Anvil singulation method is used and not present for saw singulation. 10. Depending on the method of lead termination at the edge of the package, a maximum 0.15mm pull back (L1) maybe present. L minus L1 to be equal to or greater than 0.3mm. 9 ISL6209 Small Outline Plastic Packages (SOIC) M8.15 (JEDEC MS-012-AA ISSUE C) N INDEX AREA 0.25(0.010) M H 8 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M E INCHES -B- 1 2 SYMBOL 3 L SEATING PLANE -A- h x 45o A D -C- µα e A1 B 0.25(0.010) M C C A M B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. MILLIMETERS MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.1890 0.1968 4.80 5.00 3 E 0.1497 0.1574 3.80 4.00 4 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 8o 0o N NOTES: MAX A1 e 0.10(0.004) MIN α 8 0o 8 7 8o Rev. 0 12/93 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10