INTERSIL TB435

Using the EL7516 Demo Board
®
Technical Brief
May 13, 2005
The complete schematic of EL7516 demo board is shown in
Figure 1. With different components stuffed, this demo board
can easily be configured into the applications shown in this
technical brief. The standard demo board being sent out is
the complete 5V to 12V converter shown in Table 1, which
occupies less than 0.4 in2 area with components on top side
only. Layout diagrams are given at the end of this document.
TB435.0
2. VO = 12V. Can be set according to the following formula:
R 

V O = V FB ×  1 + ------1-
R 2

where VFB is 1.294V.
3. IO - up to 750mA depending on input voltage, provided
that diode and inductor can handle the corresponding
currents (refer to data sheet for the chart)
1. VIN = 2.5V-5.5V. Can be higher with higher voltage rated
C1
4. Switching frequency - can be selected between 620KHz
(FSEL <0.6V) or 12.5MHz (FSEL >2.7V)
5. R3 and C5 are the compensation network.
SW
C5
1 COMP
R3
3.9kΩ
C6
R1
85.2kΩ
R2
10kΩ
4.7nF
2 FB
FSEL 7
3 SHDN
4 GND
SS 8
VDD 6
LX 5
R5
C4
R4
27nF
10kΩ
C2
2.7V TO 5.5V
+ C1
0.1µF
10kΩ
22µF
L1
10µH
D1
+ C3
12V
22µF
FIGURE 1. 3.3V TO 12V CONVERTER
TABLE 1. EL7516 BILL OF MATERIALS FOR VO = 12V
REFERENCE
DESIGNATOR
VALUE
MANUFACTURER
R1
85.2kΩ/1%, 0603
Any
R2
10kΩ/1%, 0603
Any
R3
3.9kΩ, 0603
Any
R4, R5
10kΩ/1%, 0603
Any
C1, C3
22µF, 16V, 1812
TDK
C2
0.1µF, 16V, 0805
Any
C4
27nF, 0603
Any
C5
OPEN
C6
4.7nF, 0603
Any
L1
10µH
Coilcraft
847-639-6400
DO1608C-103
D1
MBR0520
On Semiconductor
800-282-9855
MBR0520
1
MANUFACTURER’S
PHONE NUMBER
MANUFACTURER’S
PART NUMBER
C4532X5R1C226M
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
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Technical Brief 435
Demo Board Layout
1.5 in
1500 mil
1500 mil
1.5 in
FIGURE 2. TOP LAYER
FIGURE 4. TOP SILKSCREEN
Layout Guidelines
To achieve highest efficiency, best regulation and most
stable operation, a good printed circuit board layout is
essential. It is strongly recommended that the demo board
layout to be followed as closely as possible. Use the
following general guidelines when laying out the print circuit
board:
1500 mil
1. Place C4 as close to the VDD pin as possible. C4 is the
supply bypass capacitor of the device.
2. Keep the C1 ground, GND pin and C2 ground as close as
possible.
3. Keep the two high current paths a) from C1 through L1, to
the LX pin and GND and b) from C1 through L1, D1, and
C2 as short as possible.
1500 mil
FIGURE 3. BOTTOM LAYER
4. High current traces should be short and as wide as
possible.
5. Place feedback resistor close to the FB pin to avoid noise
pickup.
6. Place the compensation network close to the COMP pin.
The demo board is a good example of layout based on these
principles; it is available upon request.
Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to
verify that the Application Note or Technical Brief is current before proceeding.
For information regarding Intersil Corporation and its products, see www.intersil.com
2
TB435.0