MECHANICAL CASE OUTLINE PACKAGE DIMENSIONS HSOP28HC (375mil) CASE 943AE ISSUE A DATE 08 NOV 2013 15.55 MAX 15.2±0.1 0~10° (6.2) 1 2 2.0 0.8 0.3±0.1 HEAT SPREADER 0.65±0.2 10.5±0.3 0.25 0.12 +0.1 −0.05 2.7±0.1 0.10 0.1±0.1 (2.25) 2.45 MAX (0.8) 7.9±0.1 (4.9) 28 1.15 SOLDERING FOOTPRINT* 9.75 (Unit: mm) 0.80 0.42 NOTES: 1. The measurements are not to guarantee but for reference only. 2. Land pattern design in Fin area to be altered in response to customers’ individual application. *For additional information on our Pb−Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. DOCUMENT NUMBER: STATUS: 98AON65469E ON SEMICONDUCTOR STANDARD NEW STANDARD: © Semiconductor Components Industries, LLC, 2002 October, DESCRIPTION: 2002 − Rev. 0 HSOP28HC (375 MIL) http://onsemi.com 1 Electronic versions are uncontrolled except when accessed directly from the Document Repository. Printed versions are uncontrolled except when stamped “CONTROLLED COPY” in red. Case Outline Number: PAGE 1 OFXXX 2 DOCUMENT NUMBER: 98AON65469E PAGE 2 OF 2 ISSUE REVISION DATE O RELEASED FOR PRODUCTION FROM SANYO ENACT# S−034 TO ON SEMICONDUCTOR. REQ. BY D. TRUHITTE. 30 NOV 2011 A ADDED SOLDER FOOTPRINT INFORMATION. REQ. BY D. TRUHITTE. 08 NOV 2013 ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC owns the rights to a number of patents, trademarks, copyrights, trade secrets, and other intellectual property. A listing of SCILLC’s product/patent coverage may be accessed at www.onsemi.com/site/pdf/Patent−Marking.pdf. SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. “Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. © Semiconductor Components Industries, LLC, 2013 November, 2013 − Rev. A Case Outline Number: 943AE