MATERIAL DECLARATION SHEET Material Number CD0603 Series Product Line Diode Products Compliance Date 1 Jan 2005 RoHS Compliant Yes No. 1 2 Construction Element (subpart) Homogeneous Material Substrate/ Terminal FR-5 BOARD Wafer MSL Diode 1 Material weight [mg] 1.357 0.029 3 Al Wire Conductor 0.001 4 Silver paste Welding 0.006 5 Molding Compound Outer Total weight 1.881 Homogeneous Material\ Substances Copper Nickel Gold Lead Epoxy resin Silicon Aluminum Titanium Gold Arsenic Aluminum Silicon Silver Epoxy Silica fused Epoxy resin Phenol resin Antimony Trioxide Brominated Epoxy resin Carbon Black Materials Mass % Material Mass % of total unit wt. 7440-50-8 29.34% 12.16 7440-02-0 4.762% 1.97 7440-57-5 0.155% 0.064 7439-92-1 0.002% 0.0008 68928-70-1 65.74% 27.249 7440-21-3 94.21% 0.838 7429-90-5 0.44% 0.0039 7440-32-6 0.08% 0.0007 7440-57-5 5.20% 0.046 7440-38-2 0.07% 0.0006 7429-90-5 99% 0.0297 7440-21-3 1% 0.0003 7440-22-4 78.5% 0.1413 9003-36-5 21.5% 0.0387 60676-86-0 85% 48.8325 68928-70-1 8% 4.596 29690-82-2 4% 2.298 1309-64-4 1.4% 0.8043 68541-56-0 1.4% 0.8043 1333-86-4 0.2% 0.1149 CASRN if applicable Subpart mass of total wt. (%) 41.45 0.89 0.03 0.18 57.45 3.274 This Document was updated on: Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2