MATERIAL DECLARATION SHEET CD214C-R SERIES Material Number Product Line Semiconductor Products Compliance Date RoHS Compliant 1 Jan 2005 Yea MSL No. Construction Element(subpart) Homogeneous Material Material weight [mg] 1 Dice Silica compound 10.40 2 Solder Paste High-melting point solder 4.20 3 Lead frame &clip Copper Alloy 88.30 4 Epoxy material Green molding compound 105.00 Sn plating cover 2.10 5 Plating cover Total weight This Document was updated on: Headquarters Riverside CA 1 Homogeneous Material\ Substances CASRN if applicable Materials Mass % Material Mass % of total unit wt. Silicon Lead* Nickel Lead* Tin Silver Copper Zinc Iron Phosphorus Silica fused 7440-21-3 7439-92-1 7440-02-0 7439-92-1 7440-31-5 7440-22-4 7440-50-8 7440-66-6 7439-89-6 7723-14-0 7631-86-9 96.5% 2.5% 1.0% 92.5% 5.0% 2.5% 99.950% 0.004% 0.010% 0.034% 68.7% 4.779% 0.124% 0.050% 1.85% 0.10% 0.05% 42.027% 0.002% 0.004% 0.014% 34.35% Silica quartz 14808-60-7 25.0% 12.50% Phenolic resin Carbon black 9003-35-4 1333-86-4 6.0% 0.3% 3.00% 0.15% Tin 7440-31-5 99.5% 1.00% Subpart mass of total wt. (%) 4.953% 2.00% 42.047% 50.00% 1.00% 210.0 2015-4-24 www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 2 MATERIAL DECLARATION SHEET Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. * 7(a)-Lead in high melting temperature type solders (i.e. lead- based alloys containing 85% by weight or more lead) 7(c)-I.Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 2 of 2