MATERIAL DECLARATION SHEET Material Number Product Line Compliance Date RoHS Compliant SMBJ400A~495A, SMBJ180CA~495CA Semiconductors 2011/01/01 Yes MSL 1 This Document was updated on: No. 1 2015/02/09 Construction Homogeneous Element(subpart) Material Dice Silicon Material weight [mg] 4.479 Homogeneous Material\ Substances Silicon Phosphorus Boron Nickel Lead-containing glass 2 High-melting point Solder paste solder paste 3.02 3 Lead frame / Leads / Disc N/A 33.50 4 5 Molding Compound Epoxy material (Plastic Package Only) Plating 51.00 Matte-Tin 1.011 Total Weight 93.01 Silicon dioxide Aluminum oxide Tin Lead Silver Copper Iron Phosphorus Silica Epoxy resin Phenolic resin-A,-B Hydroxide metal Carbon black Tin CASRN if applicable 7440-21-3 7723-14-0 7440-42-8 7440-02-0 7439-92-1 7631-86-9 1344-28-1 7440-31-5 7439-92-1 7440-22-4 7440-50-8 7439-89-6 7723-14-0 14808-60-7 25928-94-3 9003-35-4 21645-51-2 1333-86-4 7440-31-5 Material Mass Materials Subpart mass % of total unit Mass % of total wt. (%) wt. 60.18 2.8976 0.01 0.0005 0.01 0.0005 4.815 14.80 0.7126 12.50 0.6019 10.00 0.4815 2.50 0.1204 5.00 0.1623 3.247 92.50 3.0035 2.50 0.0812 99.80 35.946 36.018 0.15 0.054 0.05 0.018 76.00 41.673 9.00 4.935 54.833 8.00 4.387 6.00 3.290 1.00 0.548 100.00 1.087 1.087 (EU) RoHS Directive 2011/65/EU Application of lead which are exempted from the requirements: 7(a) Lead in high melting temperature type solders (i.e. lead- based alloys containing 85 % by weight or more lead) 7(c)-I Electrical and electronic components containing lead in a glass or ceramic other than dielectric ceramic in capacitors, e.g. piezoelectronic devices, or in a glass or ceramic matrix compound. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1