ZOWIE Bridge Rectifier (600V / 2A) Z4GP20JLH OUTLINE DIMENSIONS Case : Z4PAK * * * * * * * Halogen-free type Internal structure with GPRC (glass passivated rectifier chip) inside Compliance to RoHS product Lead less chip form, no lead damage Low power loss, High efficiency High current capability Plastic package has Underwriters Laboratory Flammability Classification 94V-0 TM * Patented ZPAK Package Technology Unit : mm Mounting Pad Layout 5.30 ± 0.1 4.10 ± 0.1 ~ 1.5 ± 0.1 ~ 1.10 ± 0.1 5.80 ± 0.1 3.30 ± 0.05 5.72 ± 0.1 FEATURES 1.10 ± 0.1 0.90 ± 0.05 4 1 3 2 1.20 ± 0.15 APPLICATION * AC/DC Power Supply * Communication Equipment MECHANICAL DATA MARKING Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026. Polarity : Laser marking symbols Weight : 0.11 gram Z4GP = Series code 20 = Amps class (2.0A) Z4GP 20JL YWW ~ PACKING J = Voltage class (600V) L = Low VF ~ WW = Mfg week Y = Last digit of the year = Halogen-free type * 5,000 pieces per 13" (330mm ± 2mm) reel * 2 reels per box * 5 boxes per carton o Absolute Maximum Ratings (Ta = 25 C) Rating ITEM Symbol Conditions Unit Z4GP20JLH Repetitive peak reverse voltage VRRM 600 V Average forward current IF(AV) 2.0 A Peak forward surge current IFSM Operating junction and storage temperature Range 8.3ms single half sine-wave Tj,TSTG 60 A o -55 to +175 C o Electrical characteristics (Ta = 25 C) ITEM Forward voltage Repetitive peak reverse current Symbol VF IRRM Conditions Min. Typ. Max. Unit IF = 2.0A - 0.94 0.96 V o VR = Max. VRRM , Ta = 25 C - 0.08 5 uA Current squared time I 2t t < 8.3ms , Ta = 25 oC - 14.9 - A s Junction capacitance Cj VR = 4V, f = 1.0 MHz - 35 - pF Rth(JA) Junction to ambient (NOTE) - 95 - Rth(JL) Junction to lead (NOTE) - 15 - 2 o Thermal resistance C/W NOTES : Mounted on P.C.B. with 5.0 x 5.0mm copper pads. REV. 0 2015/09 ZOWIE Z4GP20JLH (600V / 2A) FIG. 1 - FORWARD CURRENT DERATING CURVE FIG. 2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 80 PEAK FORWARD SURGE CURRENT, AMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES 2.5 2.0 1.5 1.0 0.5 60 Hz Resistive or Inductive load Pulse Width 8.3ms Single Half-Sire-Wave 60 40 20 0 0 0 25 50 75 100 125 150 1 175 10 FIG.3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG. 4 - TYPICAL REVERSE CHARACTERISTICS PER BRIDGE ELEMENT 100 INSTANTANEOUS REVERSE CURRENT, MICROAMPERES 10.00 IINSTANTANEOUS FORWARD CURRENT, AMPERES 100 NUMBER OF CYCLES AT 60Hz o CASE TEMPERATURE, C TJ = 150℃ TJ = 125℃ TJ = 100℃ TJ = 25℃ 1.00 0.10 o TJ=150 C 10.0 o TJ=125 C 1.0 0.10 o TJ=25 C 0.01 0.3 0.01 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 0 INSTANTANEOUS FORWARD VOLTAGE, VOLTS 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE,% FIG. 5 - TYPICAL JUNCTION CAPACITANCE 100 o JUNCTION CAPACITANCE, pF TJ = 25 C 10 1 .1 1.0 2 4 10 20 40 100 REVERSE VOLTAGE, VOLTS REV. 0 2015/09 ZOWIE Z4GP20JLH (600V / 2.0A) DESIGN AND MOUNTING FOR SURFACE MOUNT DIODES 1. In designing steps regarding PCB component layout, do not put surface mount device diodes near high voltage resistors etc, which may generate heat to diode, nor in high-density board. when designing the PCB, implement protection for the surface mount device diode from electrical damage like surge, heating source, magnetic and so on. 2. In any cases do not store diodes in the following conditions or places: 2.1 When transporting diodes, keep vibration to a minimum otherwise body of diode may be broken. Diode die may then be destroyed by electrostatics. 2.2 High temperature or high humidity environment. 2.3 Where corrosive gas or liquid is present. 2.4 Where mechanical stress or vibration exisis. 2.5 Where electrosiatic charges are possible. 3. When using the ZOWIE Super chip diodes on assembly operation. Solder paste printing process is recommended and followed by pick and place machine. Since it was designed successfully to achieve extremely thin size, so the parameters of height and location should be adjusted on pick and place machine to avoid missing of parts during operation. 4. As ZOWIE SuperChip series are the surface mount devices with the exceptionally tiny package, whose package thickness is relatively much thinner than that of the general surface mounmt device, so please appropriately set the parameters for the nozzle height as well as the device thickness of the pick and place machine, which would diminish mostly the very normal stress applied upon the device by the nozzle so as to keep the yield level while implementing th mounting operation. 0.3mm above PCB Part thickness Part pick up height 5. The following is a schematic drawing of recommended pick-up height of the SMT parts, the bottom of part above PCB is 0.3mm. If the parts are rejected seriously, please adjust to reduce the height appropriately. PCB REV. 0 2015/09