ZOWIE Bridge Rectifier (600V~1000V / 2A) Z4GP20JH THRU Z4GP20MH OUTLINE DIMENSIONS FEATURES Case : Z4PAK Halogen-free type Internal structure with GPRC (glass passivated rectifier chip) inside Compliance to RoHS product Lead less chip form, no lead damage Low power loss, High efficiency High current capability Plastic package has Underwriters Laboratory Flammability Classification 94V-0 Unit : mm Mounting Pad Layout 5.30 ± 0.1 4.20 3.30 ± 0.05 5.82 REF. ~ 1.60 MAX. ~ REF. 1.10 ± 0.1 5.80 ± 0.1 * * * * * * * 1.00 0.90 ± 0.05 MAX. 1.20 ± 0.15 APPLICATION 4 1 3 2 * AC/DC Power Supply * Communication Equipment MECHANICAL DATA MARKING Case : Packed with FRP substrate and epoxy underfilled Terminals : Pure Tin plated (Lead-Free), solderable per MIL-STD-750, Method 2026. Polarity : Laser marking symbols Weight : 0.11 gram Z4GP = Series code 20 = Amps class (2.0A) J = Voltage class J = 600V K = 800V M = 1000V Z4GP 20J YWW . ~ ~ PACKING WW = Mfg week Y = Last digit of the year * 5,000 pieces per 13" (330mm ± 2mm) reel * 2 reels per box * 5 boxes per carton . = Halogen-free type o Absolute Maximum Ratings (Ta = 25 C) Rating ITEM Symbol Repetitive peak reverse voltage VRRM Average forward current IF(AV) Peak forward surge current IFSM Operating junction and storage temperature Range Conditions Z4GP20JH Z4GP20KH Z4GP20MH 600 800 1000 Unit V 2.0 8.3ms single half sine-wave Tj,TSTG A 50 A o -55 to +175 C o Electrical characteristics (Ta = 25 C) ITEM Forward voltage Repetitive peak reverse current Symbol VF IRRM Conditions Min. Typ. Max. Unit IF = 2.0A - 0.95 1.00 V VR = Max. VRRM , Ta = 25 oC - 0.08 5 uA Current squared time I2t t < 8.3ms , Ta = 25 oC - 10.4 - A s Junction capacitance Cj VR = 4V, f = 1.0 MHz - 25 - pF Rth(JA) Junction to ambient (NOTE) - 95 - Rth(JL) Junction to lead (NOTE) - 15 - 2 o Thermal resistance C/W NOTE : Thermal resistance, junction to ambient, measured on PC board with 5.0 x 5.0mm (0.03mm thick) land areas. REV. 4 2015/11 ZOWIE Z4GP20JH THRU Z4GP20MH (600V~1000V / 2A) FIG.1 - FORWARD CURRENT DERATING CURVE FIG.2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 60 PEAK FORWARD SURGE CURRENT, AMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES 2.5 2.0 1.5 1.0 0.5 60 Hz Resistive or Inductive load Pulse Width 8.3ms Single Half-Sire-Wave 50 40 30 20 10 0 0 0 25 50 75 100 125 150 1 175 10 FIG.3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS FIG.4 - TYPICAL REVERSE CHARACTERISTICS PER BRIDGE ELEMENT 100 INSTANTANEOUS REVERSE CURRENT, MICROAMPERES 10.00 IINSTANTANEOUS FORWARD CURRENT, AMPERES 100 NUMBER OF CYCLES AT 60Hz o CASE TEMPERATURE, C 1.00 TJ = 150℃ TJ = 125℃ TJ = 100℃ TJ = 25℃ 0.10 TJ=150℃ 10.0 TJ=125℃ 1.0 0.10 TJ=25℃ 0.01 0.3 0.01 0.4 0.5 0.6 0.7 0.8 0.9 1.0 0 1.1 20 40 60 80 100 120 140 PERCENT OF RATED PEAK REVERSE VOLTAGE,% INSTANTANEOUS FORWARD VOLTAGE, VOLTS FIG.5 - TYPICAL JUNCTION CAPACITANCE 100 JUNCTION CAPACITANCE, pF TJ = 25℃ 10 1 .1 .2 .4 1.0 2 4 10 20 40 100 REVERSE VOLTAGE, VOLTS REV. 4 2015/11 ZOWIE Z4GP20JH THRU Z4GP20MH (600V~1000V / 2A) DESIGN AND MOUNTING FOR SURFACE MOUNT DIODES 1. In designing steps regarding PCB component layout, do not put surface mount device diodes near high voltage resistors etc, which may generate heat to diode, nor in high-density board. when designing the PCB, implement protection for the surface mount device diode from electrical damage like surge, heating source, magnetic and so on. 2. In any cases do not store diodes in the following conditions or places: 2.1 When transporting diodes, keep vibration to a minimum otherwise body of diode may be broken. Diode die may then be destroyed by electrostatics. 2.2 High temperature or high humidity environment. 2.3 Where corrosive gas or liquid is present. 2.4 Where mechanical stress or vibration exisis. 2.5 Where electrosiatic charges are possible. 3. When using the ZOWIE Super chip diodes on assembly operation. Solder paste printing process is recommended and followed by pick and place machine. Since it was designed successfully to achieve extremely thin size, so the parameters of height and location should be adjusted on pick and place machine to avoid missing of parts during operation. 4. As ZOWIE SuperChip series are the surface mount devices with the exceptionally tiny package, whose package thickness is relatively much thinner than that of the general surface mounmt device, so please appropriately set the parameters for the nozzle height as well as the device thickness of the pick and place machine, which would diminish mostly the very normal stress applied upon the device by the nozzle so as to keep the yield level while implementing th mounting operation. 0.3mm above PCB Part thickness Part pick up height 5. The following is a schematic drawing of recommended pick-up height of the SMT parts, the bottom of part above PCB is 0.3mm. If the parts are rejected seriously, please adjust to reduce the height appropriately. PCB REV. 4 2015/11