Z4GP20JH

ZOWIE
Bridge Rectifier
(600V~1000V / 2A)
Z4GP20JH THRU Z4GP20MH
OUTLINE DIMENSIONS
FEATURES
Case : Z4PAK
Halogen-free type
Internal structure with GPRC (glass passivated rectifier chip) inside
Compliance to RoHS product
Lead less chip form, no lead damage
Low power loss, High efficiency
High current capability
Plastic package has Underwriters Laboratory Flammability
Classification 94V-0
Unit : mm
Mounting Pad Layout
5.30 ± 0.1
4.20
3.30 ± 0.05
5.82
REF.
~
1.60
MAX.
~
REF.
1.10 ± 0.1
5.80 ± 0.1
*
*
*
*
*
*
*
1.00
0.90 ± 0.05
MAX.
1.20 ± 0.15
APPLICATION
4
1
3
2
* AC/DC Power Supply
* Communication Equipment
MECHANICAL DATA
MARKING
Case : Packed with FRP substrate and epoxy underfilled
Terminals : Pure Tin plated (Lead-Free),
solderable per MIL-STD-750, Method 2026.
Polarity : Laser marking symbols
Weight : 0.11 gram
Z4GP = Series code
20 = Amps class (2.0A)
J = Voltage class
J = 600V
K = 800V
M = 1000V
Z4GP
20J
YWW .
~
~
PACKING
WW = Mfg week
Y = Last digit of the year
* 5,000 pieces per 13" (330mm ± 2mm) reel
* 2 reels per box
* 5 boxes per carton
. = Halogen-free type
o
Absolute Maximum Ratings (Ta = 25 C)
Rating
ITEM
Symbol
Repetitive peak reverse voltage
VRRM
Average forward current
IF(AV)
Peak forward surge current
IFSM
Operating junction and storage temperature Range
Conditions
Z4GP20JH
Z4GP20KH
Z4GP20MH
600
800
1000
Unit
V
2.0
8.3ms single half sine-wave
Tj,TSTG
A
50
A
o
-55 to +175
C
o
Electrical characteristics (Ta = 25 C)
ITEM
Forward voltage
Repetitive peak reverse current
Symbol
VF
IRRM
Conditions
Min.
Typ.
Max.
Unit
IF = 2.0A
-
0.95
1.00
V
VR = Max. VRRM , Ta = 25 oC
-
0.08
5
uA
Current squared time
I2t
t < 8.3ms , Ta = 25 oC
-
10.4
-
A s
Junction capacitance
Cj
VR = 4V, f = 1.0 MHz
-
25
-
pF
Rth(JA)
Junction to ambient (NOTE)
-
95
-
Rth(JL)
Junction to lead (NOTE)
-
15
-
2
o
Thermal resistance
C/W
NOTE : Thermal resistance, junction to ambient, measured on PC board with 5.0 x 5.0mm (0.03mm thick) land areas.
REV. 4
2015/11
ZOWIE
Z4GP20JH THRU Z4GP20MH
(600V~1000V / 2A)
FIG.1 - FORWARD CURRENT DERATING CURVE
FIG.2 - MAXIMUM NON-REPETITIVE
PEAK FORWARD SURGE CURRENT
60
PEAK FORWARD SURGE CURRENT,
AMPERES
AVERAGE FORWARD RECTIFIED
CURRENT, AMPERES
2.5
2.0
1.5
1.0
0.5
60 Hz Resistive or
Inductive load
Pulse Width 8.3ms
Single Half-Sire-Wave
50
40
30
20
10
0
0
0
25
50
75
100
125
150
1
175
10
FIG.3 - TYPICAL INSTANTANEOUS
FORWARD CHARACTERISTICS
FIG.4 - TYPICAL REVERSE CHARACTERISTICS
PER BRIDGE ELEMENT
100
INSTANTANEOUS REVERSE CURRENT,
MICROAMPERES
10.00
IINSTANTANEOUS FORWARD CURRENT,
AMPERES
100
NUMBER OF CYCLES AT 60Hz
o
CASE TEMPERATURE, C
1.00
TJ = 150℃
TJ = 125℃
TJ = 100℃
TJ = 25℃
0.10
TJ=150℃
10.0
TJ=125℃
1.0
0.10
TJ=25℃
0.01
0.3
0.01
0.4
0.5
0.6
0.7
0.8
0.9
1.0
0
1.1
20
40
60
80
100
120
140
PERCENT OF RATED PEAK REVERSE VOLTAGE,%
INSTANTANEOUS FORWARD VOLTAGE,
VOLTS
FIG.5 - TYPICAL JUNCTION CAPACITANCE
100
JUNCTION CAPACITANCE, pF
TJ = 25℃
10
1
.1
.2
.4
1.0
2
4
10
20
40
100
REVERSE VOLTAGE, VOLTS
REV. 4
2015/11
ZOWIE
Z4GP20JH THRU Z4GP20MH
(600V~1000V / 2A)
DESIGN AND MOUNTING FOR SURFACE MOUNT DIODES
1. In designing steps regarding PCB component layout, do not put surface mount device diodes near high voltage resistors etc, which may
generate heat to diode, nor in high-density board. when designing the PCB, implement protection for the surface mount device diode from
electrical damage like surge, heating source, magnetic and so on.
2. In any cases do not store diodes in the following conditions or places:
2.1 When transporting diodes, keep vibration to a minimum otherwise body of diode may be broken. Diode die may then be destroyed by
electrostatics.
2.2 High temperature or high humidity environment.
2.3 Where corrosive gas or liquid is present.
2.4 Where mechanical stress or vibration exisis.
2.5 Where electrosiatic charges are possible.
3. When using the ZOWIE Super chip diodes on assembly operation. Solder paste printing process is recommended and followed by pick
and place machine. Since it was designed successfully to achieve extremely thin size, so the parameters of height and location should
be adjusted on pick and place machine to avoid missing of parts during operation.
4. As ZOWIE SuperChip series are the surface mount devices with the exceptionally tiny package, whose package thickness is relatively much
thinner than that of the general surface mounmt device, so please appropriately set the parameters for the nozzle height as well as the device
thickness of the pick and place machine, which would diminish mostly the very normal stress applied upon the device by the nozzle so as to
keep the yield level while implementing th mounting operation.
0.3mm above PCB
Part thickness
Part pick up height
5. The following is a schematic drawing of recommended pick-up height of the SMT parts, the bottom of part above PCB is 0.3mm. If the parts
are rejected seriously, please adjust to reduce the height appropriately.
PCB
REV. 4
2015/11