Advanced Driver Assistance (ADAS) Solutions Guide www.ti.com/adas2015 Advanced driver assistance (ADAS) Table of contents Texas Instruments commitment to automotive safety Advanced driver assistance systems (ADAS) are one of the fastest-growing application areas in vehicles today as ADAS features are incorporated into even the middle and lower ends of the car market. A multitude of features can now warn drivers, allow better visibility into what is going on outside the car and support features like park assist and adaptive cruise control — these are achieved with radar-, camera-, light detection and range (LIDAR)- and ultrasoundbased systems. Advanced ADAS functions and autonomous driving do require the use of multiple systems together. TI provides both analog and digital solutions and has a strong road map to support the evolution and growth of this exciting application space. During the past 10 years, safety has become as much of a selling point in the automotive market as fuel economy and performance. Today’s safety systems are designed to help vehicle passengers not only escape injury during an accident, but actually help prevent the accident in the first place. Texas Instruments (TI) is committed to providing industry-leading technologies for ADAS solutions, complete with excellent product documentation, which meets increasingly demanding OEM specifications and makes the road a safer place. From lanedeparture warnings to drowsiness monitoring, ultrasonic park assist, advanced braking systems and other ADAS applications, TI’s power-management and control solutions, robust processors, communication interfaces, display components and microcontrollers help you deliver world-class ADAS features. 2 Advanced driver assistance systems (ADAS) 3Overview Camera-based systems 4Overview 5 8 8 9 10 TDAx ADAS SoC FPD-link LMH6551Q-Q1 LP3907-Q1 TPS62170-Q1 Radar-based systems 11Overview 13AFE5401 14 TPS65310A-Q1 15 TPS65381-Q1 16 C2000™ 17 PGA450-Q1 Sensor fusion 18 Overview Hercules™ safety MCUs 19Overview 20 Hercules™ TMS570LS safety MCU 21 Hercules™ evaluation and development kits 22 Hercules™ tools and software Selection tables 23 Operational amplifiers 23 Thermal management 23 Data converters 24Interface 24 Standard logic 24 DDR terminators 24Sequencers 25 Power management 27 Load switches 28 FPD-link II and III SERDES 28 TMS570 family 29 TDAx system-on-chip (SoC) family 29 Legacy ADAS SoCs Automotive-qualified products (Q1) TI’s automotive-qualified products are indicated by the Q1 suffix. The Q1 indicates that a product has met | Advanced Driver Assistance Systems (ADAS) Guide 2015 TI’s stringent automotive standards and includes: • 180-day product-change notification from final notice • Extended temperature qualification • Automotive documentation service • Target zero defects Texas Instruments Advanced driver assistance (ADAS) Overview Today most advanced driver assistance system (ADAS) functions are basically their own independent system, with radar, camera and ultrasound the most common sensor types. Going forward, TI sees an increasing trend to use multiple, different sensor inputs and combine them to make more accurate decisions and identify critical situations. • Clocks with low jitter and phase noise, voltage-controlled oscillators with up to 38 GHz, PLLs with 10 GHz+, and synthesizers with waveform generation are needed to achieve the required radar system performance • Low-noise RF supplies increase and enable performance of the radar and analog signal chain Vision • Strong trends in the various ADAS systems lead to a need for new and advanced semiconductor components • Digital signal communication replaces analog to allow higherbandwidth and image processing • Reduced solution size and reduced power dissipation are critical for reducing camera module size • Reduced weight and complexity of the wiring harness savescost and fuel • DSP performance increases to run multiple and higher-performance vision algorithms General ADAS requirements • Safety-critical systems (e.g., autonomous braking and steering) need to have ISO26262 certification • Sensor fusion (camera, radar, ultrasound) achieves higher system performance than independent systems • Lower power consumption • Car safety ratings (NCAP, NHTSA), government mandates and consumer safety awareness drive the rapid growth of the ADAS market Radar • Integration of the analog front end, phase-locked loop (PLL) and synthesizers — as well as RF components — reduce system cost and lower total power consumption and board space Application/sensor type Video Infrared Long range radar 76 to 81 MHz Short/mid range radar 24 to 26 GHz/ 76 to 81 GHz Adaptive front light (AFL) X Night vision (NV) X X Adaptive cruise control (ACC) X X Lane-departure warning (LDW) X Low-speed ACC, emergency brake assist (EBA), lane-keep support (LKS) X X X Pedestrian detection X X X Blind-spot detection (BSD), rear collision warning (RCW), lane-change Assist (LCA) X X Park assist (PA) X X Traffic-sign-recognition (TSR) X Ultrasound 48 kHz X X ADAS embedded main processors DSP, ADAS accelerator and ARM-based processors Sensor fusion Scalable performance for sensor data fusion and safety related decision making Front camera Park assist/fusion Radar Scalable performance low power safety processors Integrated performance scalable from rear to 3D surround view Scalable performance for SRR, MRR, LRR safety • Optimal mix of performance and power to run >5 ADAS apps at <3 W • Optimal mix of integration, performance and power for single to complex multicamera apps • Optimal mix of performance and power to run entry radar at ~1 W and high-end radar at <3 W • Scalable single to multicore architecture with C6x DSPs, ADAS accelerators and ARM cores • Scalable single to multicore architecture with C6x DSPs, ADAS Accelerators, ARM, video and graphics cores • Scalable single to multicore architecture with C6x DSPs, FFT accelerators and ARM cores • SafeTI support from QM to ASIL B • Small footprint for miniaturization Texas Instruments • POP memory and MCU integration for rear camera miniaturization • SafeTI support from QM to ASIL B • Seamless AFE radar interfaces Advanced Driver Assistance Systems (ADAS) Guide 2015 | 3 Camera-based systems Overview The use of camera-based systems ranges from advanced driver assistance systems (ADAS) features like backupcamera and surround-view systems, to driver-drowsiness warning, lane-departure warning and collision avoidance. The image from a CMOS camera sensor is processed and either displayed to the driver or used for machine vision. Depending on the application, the complexity and number of cameras varies. Design considerations LVDS interfaces are used to transfer large amounts of data via a high-speed serial connection to an external location like a video screen or from the video source (digital camera chip). General-purpose microcontrollers handle system-control functions as well as communication with other modules in the car. The core digital function comes from the DSP, processing the data from the digital input source (e.g., a CMOS camera). Depending on the required performance, from simply driving a screen to performing complex digital algorithms, pattern recognition may be necessary. Basic analog camera module Basic analog camera modules are used in backup camera and surround-view systems. Vision Sensor SOC (CMOS or CCD) Communication CAN/ LIN Video Amplifier MCU LDO High-Voltage DC/DC Converter Smart camera module Smart camera modules are used in more advanced backup camera and park-assist systems. LDO Vision Sensor SOC (CMOS or CCD) LDO DC/DC Converter Vision Sensor SOC MCU SERDES SERDES MCU Vision Sensor SOC DC/DC Converter Battery Logic, Comp/Amps SERDES DSP or MPU | Ambient Light Sensor DC/DC Converter CAN MCU LDO 4 5-V Option CAN Ser-Des Ser-Des Ser-Des LDO DC/DC Converter Battery Option Front camera module For applications that need high data processing for machine vision, camera modules include a powerful DSP to process the video data. Examples are lane-departure warning, adaptive front lights, traffic-sign recognition and pedestrian/object detection. Other uses would be blind-spot detection and driver-drowsiness warning. LDO Multi camera module Camera systems with multiple cameras can provide surround view and process video data for warnings and additional driver information. DC/DC Converter Safety MCUs offer an ARM Cortex-R4F-based solution and are certified for use in systems that need to achieve ISO26262 ASIL-D safety levels. These MCUs also offer integrated floating-point, 12-bit ADCs, CAN and FlexRay interfaces. Hercules™ safety MCUs can also be used to implement scalar and vector-control techniques and support a broad range of performance requirements. DSP or MPU Battery SERDES DSP or MPU DC/DC Converter DC/DC Converter Battery Logic, Comp/Amps Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Camera-based systems TDAx ADAS SoC TDA2x system-on-chip (SoCs) family TDA2x architecture Overview The TDA2x SoC incorporates a heterogeneous, scalable architecture that includes a mix of TI’s fixed- and floating-point TMS320C66x digital signal processor (DSP) generation cores, Vision AccelerationPac, ARM Cortex-A15 MPCore and dual Cortex-M4 processors. The integration of video for decoding multiple video streams over Ethernet audio-video bridging (AVB) networks, along with graphics accelerators for rendering virtual views, allows for a 3-D viewing experience. And the TDA2x SoC integrates a host of peripherals, including multicamera interfaces (both parallel and serial) for LVDS-based surround-view systems, displays, CAN and Gigabit Ethernet AVB. TI’s TDA2x system-on-chips(SoCs) is a highly optimized and scalable device family designed to meet the requirements of leading advanced driver assistance systems (ADAS). The TDA2x family empowers broad ADAS applications in today’s automobiles by integrating an optimal mix of performance, low power and ADAS vision-analytics processing that aims to facilitate a more autonomous and collision-free driving experience. The TDA2x SoC makes possible sophisticated embedded vision technology, providing the industry’s broadest range of ADAS applications such as front camera, park assist, surround view and sensor fusion on a single architecture. Front-camera applications include high-beam assist, lane-keep assist, adaptive cruise control, traffic-sign recognition, pedestrian/ object detection and collision avoidance. Park-assist applications include intelligent 2-D and 3-D surround view and rear-collision warning and detection. The TDA2x SoC is also capable of handling the fusion of radar and camera sensor data, allowing for a more robust ADAS decisionmaking process. Specifically, vision-oriented applications are partitioned into low-, middle- and high-level processing. With the TDA2x, TI has efficiently mapped out the ARM general-purpose processing cores to manage core control processing. Mid- to high-level processing is performed by one or more DSP cores optimized for real-time functions such as object detection, and low- to mid-level processing is handled by the Vision AccelerationPac. The Vision AccelerationPac was specifically designed to offload the processing of vision algorithms from the TDA2x DSP and ARM cores, yielding the best performance for low- to mid-level vision processing at the lowest-power footprint. Heterogenous SoC concept for the highest processing performance and power efficiency • Vision accelerationPac (EVE) - Vector processing - Highest data bandwidth General-Purpose System Control ARM • DSP - Pipelined processing - General purpose • ARM - System control - High-level postprocessing DSP EVE Specialized Vector Processing High-Bandwidth Processing Texas Instruments Advanced Driver Assistance Systems (ADAS) Guide 2015 | 5 Camera-based systems TDAx ADAS SoC The TDA2x SoC includes TI’s Vision AccelerationPac, which delivers up to a 10× improvement in performance for advanced vision analytics over existing ADAS systems at similar power levels. The Vision AccelerationPac for this family of products includes multiple embedded vision engines (EVEs) offloading the vision-analytics functionality from the application processor. The Vision AccelerationPac is optimized for vision processing with a 32-bit RISC core for efficient program execution and a vector coprocessor for specialized vision processing. With each core operating a 16 MAC-per-cycle computing engine up to 650 MHz (8 bit or 16 bit), the Vision AccelerationPac is able to deliver more than 10.4 GMACs per core, for a total of > 40 GMACs for quad EVEs devices. This provides the most efficient vision analytics for real-time vision-based automotive applications and allows the most 16 × 16-bit multiplies compared to other processor architectures. The TDA2x SoC includes a broad range of cores. It includes dual next-generation C66x fixed-/floating-point DSP cores that operate at up to 750 MHz to support high-level signal processing and a 750 MHz Cortex-A15 core for control and general-purpose processing. With 200 MHz of processing performance, the Cortex-M4 cores deliver efficient control and processing camera streams. TI’s IVA-HD core is an imaging and video codec accelerator running at up to 532 MHz to facilitate full HD video encoding and decoding. The TDA2x SoC has up to 2.5 MB of on-chip L3 RAM with single error correct and double error detect (SECDED) support to minimize the impact of soft error rate (SER). Each of the DSP cores has 32 KB of both L1 data and programming memory as well as a unified 256 KB L2 cache. The ARM cores have 32 KB of L1 data and programming memory as well as a combined 2 MB L2 cache. The integrated peripherals are another key component of the TDA2x SoC. Three video input ports, each with two 16-bit supports, provide four to six camera inputs needed for surround-vision applications. The integrated highperformance Gigabit Ethernet with AVB enables systems using Ethernet for the surround view. TI’s versatile display subsystem offers three video overlays and one graphic overlay. Two high-end CAN controllers allow communications within the vehicle without the need for a host computer, reducing system cost and footprint. Four SPIs deliver fast booting times for instantaneous video display when the vehicle is started. TDA3x ADAS system-on-chip (SoC) Family Overview TI’s new TDA3x device family extends TI’s System-on-Chip (SoC) offerings in the Advanced Driver Assistance Systems (ADAS) space. TI announced the TDA2x device last year, 6 | Advanced Driver Assistance Systems (ADAS) Guide 2015 to target front, surround and fusion ADAS solutions. The TDA3x SoC device family builds on that offering to scale sophisticated innovation into ADAS solutions for entry- to mid-segment automobiles for front, rear, surround, radar and fusion applications. Front Cam Surround View Fusion Rear Cam Radar High Mid Entry Scalability between TDA2 and TDA3x SoCs for various ADAS applications With the TDA3x SoC, car manufacturers can develop sophisticated ADAS applications that meet or exceed NCAP requirements, reduce collisions on the road and enable a more autonomous driving experience in entry- to mid-level automobiles. TDA3x architecture The TDA3x SoC is based on a heterogeneous, scalable architecture that includes TI’s fixed- and floating-point dualTMS320C66x generation of DSP cores, a fully programmable Vision AccelerationPac (EVE) and dual ARM® Cortex®-M4 cores along with an image signal processor (ISP). The TDA3x SoC also integrates a host of peripherals including displays, CAN and multi-camera interfaces (both parallel and serial) for LVDS-based surround view systems. High-Speed Interconnect * ARM M4 ARM M4 Parallel Video Input Port + EVE << – C66x DSP * + << – C66x DSP Imaging Sub System CSI2/HiSPI Interface ISP System Mailbox Module ×2 Spinlock Module ×1 Display Subsystem+VENC 2× video, 1× GFX, 1× write-back pipeline Safety 512 kB L3 RAM w/ ECC CRC LPDDR2/DDR2/3 32b w/ ECC 7× DCC 5× RTI ESM TESOC System Services EDMA – 2TC 8 Timers McASP JTAG Connectivity and I/O GMAC UART ×3 10-Bit 8-Ch. ADC MMU PWMSS PRCM DCAN ×2 Control Module SDIO ×1 GPMC SPI ×4 IC ×2 QSPI 2 GPIO TDA3x SoC block diagram Texas Instruments Camera-based systems TDA2x/3x ADAS SoCs The TDA3x SoC broad range of cores is aimed at supporting and delivering the fastest and most efficient processing. It includes two, next-generation TMS320C66x fixed-/floatingpoint DSP cores that operate at up to 500 MHz to support high-level signal processing. With 200 MHz of processing performance, the M4 cores deliver efficient control and processing camera stream. Additionally, the TDA3x SoC has 512KB of on-chip L3 RAM with single error correct and double error detect (SECDED) support to minimize impact of soft error rate (SER). Each of the DSP cores has 32 KB of L1D data and 32 KB L1P programming memory as well as 288 KB of L2 memory (L1 and L2 memory can be configured as either flat memory or cache). The TDA3x SoC offers a rich set of integrated peripherals: • Video input port providing 4×8-bit or 2×16-bit camera inputs • TI’s versatile display subsystem offering video and graphic overlay • Two high-end CAN controllers allowing communications within the vehicle without the need for a host computer, thus reducing system cost and footprint • QSPI delivers fast booting times for instantaneous video display when the vehicle is started The TDA3x SoC introduces the automotive industry to the first package-on package (POP) including DDR memory, enabling miniaturization of the ADAS camera or radar systems. Having the capability to mount memory on top of the TDA3x SoC package reduces both the footprint and board complexity. This adds processing capability without increasing the size of the module. Multiple memory vendors including Micron, ISSI and Winbond will provide custom POP memory for the TDA3xSoC. Unlike anything else available on the automotive market today, the TDA3x 12 mm ×12 mm POP solution can be leveraged to create the smallest ADAS system. ISP integration reducing system cost, complexity and size By integrating an ISP that enables raw/Bayer sensors, the TDA3x processor delivers improved image quality without increasing the size, cost or complexity of the solution. Variants of the TDA3x SoC have full featured ISP including noise filters, color filter array (CFA), video noise temporal filtering (VNTF), exposure and white balance controls, as well as optional support for wide dynamic range (WDR) and lens distortion correction (LDC). The ISP can support a range of combinations for mono, stereo and up to four camera inputs providing an industry leading integrated solution. Texas Instruments Enhanced design for functional safety to help customers develop safer vehicles TI’s TDA3x processor is being developed to meet the relevant requirements of the ISO 26262 functional safety standard. The TDA3x SoC leverages a wide range of diagnostics from TI’s award-winning Hercules™ TMS570 safety MCU family to enhance the existing TDA2x platform safety concept. The combination of hardware, software, tools and support helps TDA3x processor customers develop systems to meet challenging functional safety requirements and achieve system level functional safety certification more efficiently. Scalability with the TDA3x device family The TDA3x SoC scalable architecture allows for significant reuse. Variations of TDA3x are available for front camera, surround view, rear view, radar and CMS (camera mirror replacement systems). As shown below, front camera application uses 1–2 camera inputs and both DSP and EVE to enable 3–5 algorithms. Surround view systems can use CSI-2 or parallel camera inputs with ISP and DSP processing for low to- mid-segment surround view. DSP1 DSP2 EVE CSI input ISP VOUT VIN1a VIN1b VIN2a VIN2b Front Camera Surround view CSI Surround view parallel Rear view ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ ✔ (24b) ✔ (8b) ✔ ✔ ✔ ✔ ✔ ✔ TDA3x SoC processor and video input/output usage for different applications Tools and software for quickly getting started TI’s ADAS-related Vision Software Design Kit (SDK) enables customers to quickly and easily integrate the Vision AccelerationPac (EVE) and DSP algorithms and then benchmark and partition them across multiple processing elements. The TI Vision SDK is a set of software development APIs, framework, tools and documentation allowing the creation of vision and analytics applications for the TI TDA3x SoC hardware platform. In addition to the SDK, TI also has a number of libraries available for vision kernels on Vision AccelerationPac (EVE) and DSP. The SDK and libraries reduce development efforts and time to market while enabling customers to innovate and differentiate on their solution. Advanced Driver Assistance Systems (ADAS) Guide 2015 | 7 Camera-based systems FPD-link/LMH6551Q-Q1 FPD-link • DS90UB913A/914A serializer/deserializer (SERDES) • Supports megapixel image sensors • No compression for best video quality • Small camera module size No microcontroller needed Video, control and power over one cable/connector ISP companion chip can be located away from camera in ECU >2 MHz FSW microSMD optional LMxxxx tiny DC/DC TPS2xxx switch/protect 12C 48 MHz OSC Control Logic GPI03 GPI02 100 µH 4.7 µH 4.7 µH 100 nF video + control framesync + power 47 nF 50 Ω 50 Ω 47 nF CDR PLL R[11:0] Built-In Self Text 100 nF 100 µH RBS Deserializer RBS Serializer PCLK Frame Sync Built-In Self Test D[11:0] HS VS Power DS90UB914AQ DS90UB913AQ Sensor TPS/LM DC/DC Adaptive Equalizer Power • Low cost Inexpensive coax cable Low component count Fits on one PCB • Very low < 15-µs latency • Supports power-over-coax data cable • Low power consumption Less heat for better low-light performance HS VS PCLK Frame Sync Control Logic OMAP/ Vision SoC (under NDA) 1 2C isolated from chassis ground +2 5 x 5 mm package Differential, high-performance operational amplifier LMH6551Q-Q1 The LMH6551-Q1 is a high-performance voltage feedback differential amplifier. The LMH6551-Q1 has the high speed and low distortion necessary for driving high-performance ADCs as well as the current-handling capability to drive signals over balanced transmission lines like CAT 5 data cables. The LMH6551-Q1 can handle a wide range of video and data formats. With external gain set resistors, the LMH6551-Q1 can be used at any desired gain. Gain flexibility coupled with high speed makes the LMH6551-Q1 suitable for use as an IF amplifier in high-performance communications equipment. Key features • 370 MHz to 3-dB bandwidth (VOUT = 0.5 VPP) • 50 MHz 0.1 dB bandwidth • 2400-V/µs slew rate • 18 ns settling time to 0.05% • –94/–96 dB HD2/HD3 at 5 MHz • LMH6551-Q1 is AEC-Q100 Grade 1 qualified and is manufactured on an automotive grade flow Applications • Fully differential video driving • Video over twisted pair RF AV, RIN RS VS VI V+ RG VCM RT + — VO + — RM RG RO IN— ADC IN+ RO V— RF Functional block diagram 8 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Camera-based systems LP3907-Q1 Dual high-current step-down DC/DC and dual linear regulator with I2C-compatible interface LP3907-Q1 The LP3907-Q1 is a multifunctional, programmable power-management unit, optimized for low-power FPGAs, microprocessors and DSPs. This device integrates two highly efficient 1 A/600 mA step-down DC/DC converters with dynamic voltage management (DVM), two 300 mA linear regulators and a 400 kHz I2C compatible interface to allow a host controller access to the internal control registers of the LP3907-Q1. The LP3907-Q1 additionally features programmable power-on sequencing. Package options include a tiny 4 mm x 4 mm x 0.8 mm WQFN 24-pin package and an even smaller 2.5 mm x 2.5 mm DSBGA 25-bump package. ULVO 10 19 10 µF 13 VIN1 1 µF VIN2 24 1 µF VINLDO1 1 1 µF AVDO 1 µF VINLDO2 VINLDO12 Cwdd 4.7 µF 10 µF 6 Lsw1 2.2 µH 1.2V 5 VBUCK1 OSC VIN OK ENLDO1 ENLDO2 10 µF Lsw1 2.2 µH 3.3V 14 VBUCK2 Power On-Off Logic 12 AVDO BUCK2 SW 2 10 µF VFB2 11 2 Thermal Shutdown Reset I2C_SDA SW 1 VFB2 8 7 EN_T I2C_SCL BUCK1 22 ENSW1 ENSW2 AVDO 21 Key features • Compatible with advanced application processors and FPGAs • Two LDOs for powering internal processor functions and I/Os • High-speed serial interface for independent control of device functions and settings • Precision internal reference • Thermal overload protection • Current overload protection • 24-lead 4 mm × 4 mm × 0.8 mm WQFN or 25-bump 2.5 mm x 2.5 mm DSBGA package • Software-programmable regulators • External power-on reset function for Buck1 and Buck2 • Under-voltage lock out detector to monitor the input supply voltage • LP3907-Q1 is an automotive-grade product that is AECQ-100 Grade 1 qualified Applications • FPGA, DSP core power • Application processors • Peripheral I/O power VINLDO1 LDO1 LDO1 20 3.2V Code1 0.47 µF VINLDO12 VINLDO2 17 Bias PC 16 LDO2 Logic Control and Registers GND_SW1 4 15 GND_SW2 RDY1 LDO2 23 RDY2 sPCR Power On Reset 9 GND_G 1.5V Code2 0.47 µF VDO 100k 3 15 GND_L Functional block diagram Texas Instruments Advanced Driver Assistance Systems (ADAS) Guide 2015 | 9 Camera-based systems TPS62170-Q1 Ultra-small power supply for COAX-powered cameras 0.5 A, step-down converter in 2 x 2 SON package TPS62170-Q1 The TPS62170-Q1 family includes easy-to-use synchronous step down DC/DC converters optimized for automotive applications with high power density. A high switching frequency of typically 2.25 MHz allows the use of small inductors and provides fast transient response as well as high output voltage accuracy by utilization of the DCS-Control™ topology. With its operating input voltage range of 3 V to 17 V, these devices are ideally suited for coax-powered camera systems. 100 VIN=5 V (3.17) V Efficiency (%) 90 80 70 VIN=12 V VIN=17 V 10 µF 60 50 40 VOUT=3.3 V L=2.2 µH Cout=22 µF TPS62171 VIN SW EN VOS AGND PG PGND FB 2.2 µH 100 k 1.8 V/0.5 A 22 µF Applications • Ultra-small ADAS camera modules powered over coax • Infotainment • Other automotive POL TI designs • TIDA-00262: ADAS camera with APTINA sensor • PMP9758: generic CMOS sensor power supply 0 0.1 0.2 0.3 0.4 0.5 Output Current (A) Coax Cable 5 to 10 V TI SerDes DS90UB913 CMOS sensor Key features • Smallest solution size: only 70 mm2 including all passives • DCS-Control™ topology: fast AC line and load transient response • Small inductor and low ESR capacitors • 100% duty cycle • 17 uA typ Iq • Power good output • 2 x 2 SON package 1.2 V TPS62170-Q1 1.8 V TPS62170-Q1 3.3 V TPS62170-Q1 10 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Radar-based systems Overview Radar systems As cost decreases, radar systems (to use in blind-spot detection, for example), are being installed in more classes of vehicles. Automotive radar systems can be classified in two sets: long-range radar systems and medium/short-range radar systems. Long-range radar systems are always mounted in the front of the car and look forward. These systems see distances of more than 100 m and are typically used for adaptive cruise control, brake assistance and collision warning. Driving factors in the development of long-range radar systems include: • A reduction in system size • Lower system power dissipation (allowing for smaller packages and less cooling effort) • Low-noise components and design (for high signal performance) • Antenna designs that allow more resolution and better object detection/differentiation capabilities • DSPs to run the complex software algorithms In systems where the radar can impact functions of the car, safety functionality is also important. Vbatt DC/DC Converter Multi Rail DC/DC Converter Low Noise Supply uC or DSP CAN Programmable Clock/PLL with Ramp Generator LDO Safety uC RAM LVDS Embedded processor C28xx C6xxx m x RF RX LNA Long-range radar system diagram Due to their longer vision range, higher resolution, and ability to identify and distinguish multiple objects, long-range radar systems need more processing power on the DSP side, precise signal conditioning and in many cases a safety microcontroller. As applications like adaptive cruise control begin to take control over some functions in the car (such as the accelerator/brakes), they require higher safety levels than pure warning functions like blind-spot detection or side-impact warning. Texas Instruments Optional Flash n x RF TX Radar Solution Integrated Analog Frontend (Amplifier, Filter ACD) Optional CAN Transceiver FlexRay Transceiver Safety MCU TMS570 Ethernet Transceiver Optional TPS65381 Supervisors, Watchdog, Power Supply Ethernet Transceiver Optional Automotive Safety Solution Automotive safety system diagram Advanced Driver Assistance Systems (ADAS) Guide 2015 | 11 Radar-based systems Overview TI supports radar trends with highly integrated baseband and analog front ends, as well as integrated synthesizers/ ramp pulse generators, high-performance DSPs and safety microcontroller and (low-noise) power-supply solutions. The other group of radar systems is medium-/ short-rangeradar. Light detection and range (LIDAR) LIDAR is used in adaptive cruise control, accident avoidance and mitigation and object detection. It is important for autonomous driving features. Vbatt DC/DC MCU CAN FlexRay Vbatt DC/DC Low-Noise Supply CAN C2000 MCU/DSP DAC DSP VCO Driver 8-16 ADC 8-16 Trans Imp. Amp PIN Diode Array 2-4 RF RX LDO ADC Op Amp LNA Short-and medium-range radar system diagram These systems typically include blind-spot detection, side-collision warning, cross-traffic alert and lane-change assistance. The overall performance of these systems is lower compared to their long-range brethren; they are even available in some mid-range cars as standard equipment. Medium-/short-range radar systems are mounted in different locations of the car, depending on their function. Because of their use and functionality, system size and cost are important. The lower performance often allows the use of microcontrollers instead of DSPs. TI’s portfolio offers the right mix of catalog and differentiated ICs to help you be successful and meet your design, space and price targets. 12 LED 1-2 RF TX PMIC DC/DC Diode Driver | Advanced Driver Assistance Systems (ADAS) Guide 2015 Ultrasonic park assist Ultrasound is used in park-assist applications and has already reached high maturity and broad market acceptance. System-on-chip is the preferred solution for ultrasound sensors. LDO LIN Oscillator Driver MCU Driver ADC SAR Low-Noise Amp Texas Instruments Radar-based systems AFE5401 Baseband analog receive front-end for broadband FMCW radar AFE5401 The next generation of frequency-modulated/continuous wave (FMCW) automotive radars will use faster chips that require wider broadband receivers, thus making the AFE5401, with four parallel channels at 25 MSPS, an ideal solution. The simultaneous sampling also benefits digital beamforming architectures, while its very low power enables smaller, more compact solutions. Each of the four differential input pairs of the AFE5401 is amplified by a low-noise amplifier (LNA) and is followed by a programmable-gain amplifier (PGA) with a range from 0 dB to 30 dB. A third-order antialias low-pass filter is also integrated between the PGA and ADC, together with a bypassable equalizer. The antialias filter drives the on-chip 12-bit, 25-MSPS ADC. The four ADC outputs are multiplexed into a single 12-bit parallel CMOS output bus, which includes auxiliary signals for the seamless interface/control of the video port of a DSP like the TDA2x. Key features • Quad LNA, equalizer, PGA, AAF, ADC • Four auxiliary channels • Differential input • 3.5 nV/rtHz input noise at max gain • LNA: 12 dB, 15 dB, 18 dB settings • PGA: 0 dB to 30 dB in 3 dB steps • Integrated optional equalizer • Third order adjustable elliptic anti alias filter • Quad 12 bit 25 MSPS ADC • Power dissipation: 65 mW/channel • 100 MSPS CMOS parallel output glueless interface to DSP video port • 64-pin QFN (9 mm2 x 9 mm2) • 1.8-V analog and digital supply • 3.3-V analog supply Samples available – release 1Q14 Texas Instruments Advanced Driver Assistance Systems (ADAS) Guide 2015 | 13 Radar-based systems TPS65310A-Q1 Power Management unit for advanced driver assistance systems TPS65310A-Q1 The TPS65310A-Q1 device is a power-management unit, meeting the requirements of DSP-controlled automotive systems like advanced driver assistance systems (ADAS). It is ideally suited for camera- or radar-based vision systems to support features like lane-departure warning, collision avoidance systems, blind-spot detection, park assist and traffic-sign detection. The device includes one high-voltage buck controller for preregulation, combined with two buck controllers and one boost converter for post regulation. A further integrated low dropout (LDO) rounds up the power-supply concept and offers a flexible system design with five independent voltage rails. The device offers a low-power state (LPM0 with all rails off) to reduce current consumption in case the system is constantly connected to the battery line. All outputs are protected against overload and overtemperature. The integrated window watchdog and SPI for control and diagnosis enables safety-related applications in ADAS systems. Safety levels up to ASIL-B can be realized using the TPS65310A-Q1. LED Driver Switch Off Comparator Protection FET Linear Regulator 1.x-xxV (VL28) Boost Regulator 5V (VB5) SPI Window Watchdog Wake DC/DC Converter 1.2V (VBU12) DC/DC Converter 1.8V (VBU18) DC/DC Converter 3.3V (VBU33) Key features • –40°C to 125°C ambient operating temperature • Device HBM ESD classification level H1B • Device CDM ESD classification level C3B • Input voltage range: 4 V to 40 V, transients up to 60 V; 80 V • Single-output synchronous buck controller • Peak gate drive current 0.6 A • 490 kHz fixed switching frequency • Pseudo-random frequency hopping spread-spectrum or triangular mode • Dual synchronous buck converter • Designed for output currents up to 2 A • Out-of-phase switching • Switching frequency: 0.98 MHz • Adjustable 350 mA linear regulator • Adjustable asynchronous boost converter • 1 A integrated switch • Switching frequency: 0.98 MHz • Soft-start feature for all regulator outputs • Independent voltage monitoring • Undervoltage (UV) detection and overvoltage (OV) protection TPS65310 McBSP or HPI SPI or EMIF Video Output LVDS VBU33 VB5 MCU (e.g., TMS570) CAN XCVR CAN Bus Display Video DAC ADC AREF VBU33 VBU18 EMIF EMIF DVDDR2 VBU18 VBU12 GPIO GPIO Video Input DSP (e.g., DM6437) Ethernet MAC Video Input AREF VBU33 VBU18 Video Input ADC Watchdog, LED VBU33 CAN VBU12 VL28 VBAT FlexRay Analog Reference 3.3 V (AREF) DVDDIO DDR2/ SRAM Flash/ EEPROM VBU33 Functional block diagram 14 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Radar-based systems TPS65381-Q1 Power-management unit for safety critical advanced driver assistance systems TPS65381-Q1 Today’s automotive systems often require ever-higher levels of safety (such as ASIL-D), as well as increased computation power delivered by safety microcontroller units (MCUs). The TPS65381-Q1 provides a high level of integration of all main power rails required by safety MCUs in safety systems. It enables easy implementation and quick verification of functional safety in a small footprint. The TPS65381-Q1 integrates multiple supply rails to power the MCU, CAN or FlexRay and an external sensor. An asynchronous buck switch-mode power-supply converter with an internal field-effect transistor converts the input battery voltage to a 6 V preregulator output. Furthermore, the device supports wakeup from ignition or from a CAN transceiver. 1 VBAT_SAFING 2 ENDRV 32 VCP SEL_VDD3/5 31 3 CP1 IGN 30 4 CP2 VBATP 29 5 PGND SDN6 28 6 NRES VDD6 27 7 DIAG_OUT VDD1_G 26 8 NCS PGND 25 9 SDI VDD1_SENSE 24 10 SDO GND 23 11 SCLK VDDIO 22 12 RSTEXT VDD3/5 21 13 ERROR/WDI VDD5 20 14 CANWU GND 19 15 VSFB1 VTRACK1 18 16 VSIN VSOUT1 17 Texas Instruments TPS65381-Q1 Key features • Input voltage range: 5.8 V to 36 V (CAN, I/O, MCU core and sensor supply regulators functional) 4.5 V to 5.8 V (3.3 V I/O and MCU core voltage functional) 6 V asynchronous switch-mode pre-regulator 5 V (CAN) supply voltage 3.3 V or 5 V MCU I/O voltage 0.8 V to 3.3 V adjustable MCU core voltage • Sensor supply • Charge pump • Power supply/system monitoring • Microcontroller interface • SPI interface Advanced Driver Assistance Systems (ADAS) Guide 2015 | 15 Radar-based systems TMS320F2837xD C2000™ real time 32-bit floating point MCU/DSP for advanced driver assistance systems TMS320F2837xD The C2000 family of high-performance microcontrollers with integrated analog and control peripherals provide a real-time engine targeted at applications requiring heavy signal processing like advanced driver assistance systems (ADAS). These MCUs provide up to 800 MIPS of DSP performance with available dual C28x CPUs and dual CLA (control law accelerator) co-processors. The integrated trigonometric math unit (TMU) and Viterbi complex unit (VCU) enhance the performance of the C28x CPU by reducing the number of instruction cycles necessary to perform calculations commonly made in ADAS applications. There is also up to 1 MB of integrated Flash memory with ECC in addition to 204 KB of integrated RAM in the device. Two external memory interface (EMIF) ports are available to connect to additional external memory. In additional a universal parallel port (uPP) is available for interfacing with other processors or FPGAs in the system. There are also a number of integrated peripherals that are optimized for real time control tasks commonly found in ADAS applications. Up to 4 separate 16-bit and 12-bit ADCs with 12 channels each enable fast and precise data acquisition from sensors. Enhanced PWM modules offer sophisticated shadowing, synchronization, edge positioning and trip logic in addition to duty cycle edge placement down to 55 ps time unit increments. 12-bit buffered DACs are also available to provide enhanced control capabilities. Key features • –40°C to 125°C ambient operation temperature • AEC Q100 qualification • Up to 800 MIPS of performance • Up to 200 MHz CPU frequency • IEEE 754 single-precision floating-point unit • Up to 1 MB of flash memory w/ECC • Up to 204 KB of RAM w/parity • Dual 6-channel DMA controller • 2 CAN ports/2 I2C ports/3 SPI ports • 4 UARTs • 4 16-bit ADCs w/ up to 12 ch each • 3 12-bit buffered DAC outputs • 24 PWM channels • 6 enhanced capture modules • Dual external memory interfaces • Universal parallel port C2000 MCUs also include an array of communication peripherals necessary for communication with board level and module level nodes in the automobile. There are a total of 4 UARTs, 3 SPI , 2 I2C and 2 CAN modules available. There are also many C28x optimized CAN protocol stacks/drivers commonly used in automotive available including CANopen, SAE J1939 and ISO 15765. Delfino™ F2837xD Temp options 106°C 125°C Q100/125°C C28 x 32-Bit CPU C28 x 32-Bit CPU Memory Power & Clocking 32 x 32-Bit HW Multiplier RMW Atomic ALU 32 x 32-Bit HW Multiplier RMW Atomic ALU Up to 1 MB Flash w/ ECC Dual 10-MHz OS Floating-Point Unit Floating-Point Unit Up to 204 kb SRAM w/ parity VCU II Accelerator VCU II Accelerator TMU Accelerator TMU Accelerator 200 MHz 200 MHz 2 x 128-Bit Secure Zones Boot ROM CLA-1 Co-Processor 200 MHz Control Peripherals ePWM x 24 16x eHRPWM Fault Trip Zones x 12 eCAP x 6 CLA-2 Co-Processor 200 MHz Real-Time JTAG Communication Peripherals I2C/PM Bus x 2 POR/Brown-Out System Modules Dual 6Ch DMA Dual 32-Bit CPU Timer x 3 Dual NMI Watchdog Timer Dual -192 Interrupt PIE Analog Control Modules uPP SPI x 3 EMIF x 2 McBSP x 2 CAN 2.0 x 2 UART x 4 16-Bit ADC x 4 1MSPS or 12-Bit ADC x 4 3.5 MSPS Comparators x 8 (Window or PCM) 12-Bit DAC x 3 eQEP x 3 Sigma delta I/F x 8 Debug 4-20-MHz Ext OSC USB 2.0 OTG FS MAC & PHY Temperature Sensor 16 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Radar-based systems Ultrasonic park assist Key features • Dual NMOS low-side drivers • Configurable burst generator • Low-noise amplifier • 12-bit SAR ADC • Configurable digital band-pass filter • Digital signal envelope detect • On-chip 8-bit microprocessor • LIN 2.1 physical Interface and protocol • Watchdog timer • Four-Wire SPI for testability/programming • 8 K bytes OTP • 768 bytes of FIFO RAM • 256 bytes scratchpad RAM • 8 K bytes of development RAM • 32 bytes of EEPROM PGA450-Q1 ultrasonic sensor interface PGA450-Q1 Ultrasonic sensors are mainly used in park assist applications and are now high in volume shipment with broad market acceptance. Typically a car would have eight to twelve of these sensors. The PGA450-Q1 is a fully integrated interface device for ultrasonic transducers used in these park assist applications. It is designed to be configurable and also customizable for processing the transducer echo signals and for calculating the distance between the transducer and objects. Its MCU and program memory allow for this full configurability for the specific end application. It also has an integrated LIN 2.1 communication protocol to transmit data. The LIN 2.1 physical layer is slave-only and does not implement the LIN wake-up feature. All other LIN 2.1 features can be implemented. This device can measure distances from 10 cm to more than 6 m. 4 rear sensors 4 front sensors 2 side sensors 2 side sensors PGA450-Q1 Battery Linear Regulator Transformer & Transducer Pair OSC 7-40V (Load Dump) ISO 7637 Compatible 8-Bit MCU Drive A Drive B Digital & Data Path ECU Texas Instruments LIN Analog Block SAR LNA Advanced Driver Assistance Systems (ADAS) Guide 2015 | 17 Sensor fusion Overview Advanced driver assistance systems (ADAS) are still treated as separate systems, independent from each other. Each system has its own purpose and either displays information or performs an activity (such as a chime) without consideration for any other ADAS systems. Depending on the type of sensor technology (radar, camera, ultrasound, light detection or range), this allows certain functionality, but does not make the best use of the systems. To build fully autonomous cars, it will be necessary to combine the information and data from different sensors, exploiting their individual advantages and making up for the weaknesses each individual system always has. This is called sensor fusion. Instead of multiple, completely independent systems, the various ADAS systems feed their information into a central sensor fusion engine control unit Radar Camera Interfacing Ultrasound Power Processing Most systems developed today have a mix of centralized and decentralized data processing. Due to the high impact a fusion ECU has on the safety of a car and its passengers, a fusion ECU should have ASIL certification. This has an impact not only on the ECU and system design, but also on IC selection. Safety Interfacing LIDAR (ECU) that can combine all of the information to provide better situational awareness. Depending on the system partitioning chosen, either raw data (e.g., uncompressed video) or preprocessed data (e.g., object data from the radar) is provided to the fusion ECU. This has a big impact on the processing power demands of the fusion ECU, as well as the power-supply needs and type of communication interfaces to the subsystems (the individual ADAS modules supplying the sensor data). Powertrain, Braking Warning System Infotainment system or display 18 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Hercules™ safety MCUs Overview Hercules microcontrollers are based on TI’s 20+ years of safety-critical system expertise, industry collaboration and proven hardware for the automotive market. The platform consists of two ARM® Cortex®-based microcontroller families (RM and TMS570) that deliver scalable performance, connectivity, memory and safety features. Unlike many microcontrollers that rely heavily on software for safety capabilities, Hercules microcontrollers implement safety in hardware to maximize performance and reduce software overhead. The Hercules RM family provides the highest level of perform ance for broad safety applications, including medical and industrial, and are developed to the IEC 61508 SIL-3 safety standard. The Hercules TMS570 family provides high performance for transportation applications and is well suited for applications that need to meet IEC 61508 SIL-3 or ISO 26262 ASIL-D requirements. The RM and TMS570 dual-CPU lockstep architectures simplify development while eliminating redundant system requirements to reduce cost. CPU hardware built-in self test (BIST) detects latent defects without complex safety software and code-size overhead. Hardware comparison of CPU outputs provides nearly instant safety response time without any additional performance impact. ECC logic is integrated in the CPU to protect both memories and busses. All RAM memories can be tested using HW BIST for high diagnostic coverage and an integrated memory protection unit (MPU) helps protect against deterministic errors in application software. Hercules MCUs are also an integral part of many SafeTI™ functional safety design packages (www.ti.com/safeti). SafeTI design packages help enable compliance with safety standards by including functional safety-enabled semiconductor components, safety documents, tools and software, complementary embedded processing and analog components, quality manufacturing process and a safety development process. Texas Instruments Hercules safety support and certification SafeTI and companion ICs SafeTI design packages for functional safety provide standards specific solution bundles: • SafeTI-61508 • SafeTI-26262 • SafeTI-60730 • SafeTI-QM www.ti.com/safeti Functional safety is made easy with Hercules Safety documentation Documents provided by TI assist in the safety certification process: • Component Safety Manual (SM) Product safety architecture and recommended usage • Safety Analysis Report (SAR) FIT rate and device FMEDA • Safety Report Summary of compliance to IEC 61508 and/or ISO 26262 Safety certification Hardware development process and component certification: • TÜV-SÜD certification for functional safety development process SafeTI-61508 SafeTI-26262 • Device safety assessment and certificates Exida Hercules safeTI tools and software • SafeTI Compiler Qualification Kit • SafeTI Diagnostic Library Advanced Driver Assistance Systems (ADAS) Guide 2015 | 19 Hercules™ safety MCUs TMS570LS Hercules™ TMS570LS safety MCU TMS570LS Key features • ARM Cortex-R CPU in lockstep (fixed- and floating-point options) The Hercules TMS570 microcontroller family enables customers to easily develop • From 80 MHz up to 300 MHz safety-critical products for transportation applications. Developed to the require• Integrated safety features simplify ments of the ISO 26262 ASIL-D and IEC 61508 SIL-3 safety standards and SIL-3/ASIL D applications qualified to the AEC-Q100 automotive specification this ARM® Cortex®-R-based • From 256 KB up to 4 MB flash with ECC family offers several options of performance, memory and connectivity. This family • From 32 KB up to 512 KB RAM with ECC includes options with Cortex-R4 and Cortex-R5 CPUs. Dual-core lockstep CPU • Memory protection units in CPU and architecture, hardware BIST, MPU, ECC and on-chip clock and voltage monitoring DMA are some of the key functional safety features available to meet the needs of • Multiple communication peripherals: automotive, railway and aerospace applications. Ethernet, FlexRay™, CAN, LIN, SPI • Motor control and programmable timer interfaces Memory Hercules™ TMS570 MCU • 12-bit analog/digital converter 256KB to 4MB Power, Clock, & Safety ® • External memory interface Flash w/ ECC ARM ® ARM ® ARM™ Cortex-R Up to 220 MHz Cortex-R 160MHz Up to 300 MHz 32KB to 512KB RAM w/ ECC 16KB to 128KB Data Flash w/ ECC OSC PLL POR PBIST CRC LBIST RTI/DWWD Memory Protection Memory Interface Core Compare SDRAM EMIF JTAG/Trace Error Signaling DMA System Bus and Vectored Interrupt Module Serial I/F Network I/F MibSPI Multi-Buffered SPI(s) 10/100 EMAC FlexRay™ ADC MibADC1 Multi-Buffered 12-bit ADC Targeted transportation applications • Braking systems (ABS and ESC) • Electric power steering (EPS) • HEV/EV inverter systems • Battery management systems • Active driver assistance systems • Aerospace and avionics control systems • Railway control, communications and signaling • Off-road vehicles Timers / IO High-End Timer(s) (N2HET) ePWM SPI(s) 2 IC CAN(s) LIN MibADC2 Multi-Buffered 12-bit ADC eCAP eQEP GIO/INT Packages: 100 QFP (14 × 14), 144 QFP (20 × 20), 337 nfBGA (16 mm × 16 mm, 0.8 mm) 20 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Hercules™ safety MCUs Hercules™ evaluation and development kits Quick-start Hercules LaunchPad LAUNCHXL-RM42 – RM42 LaunchPad L AUNCHXL-TMS57004 – TMS570 LaunchPad Hercules LaunchPad features: • USB powered • On-board USB XDS100v2 JTAG debug • On-board SCI-to-PC serial communication • 40-pin BoosterPack XL header for add-on BoosterPacks • Footprint for an additional expansion header (not populated) • LEDs and light sensor • Available CCStudio IDE, HALCoGen and code examples for download $19 99 Evaluation Low-cost USB stick evaluation/development kits TMDXRM48USB – RM48 USB stick kit TMDX570LS31USB – TMS570 USB stick kit $79 USB stick kit features: • USB powered • On-board USB XDS100v2 JTAG debug • On-board SCI-to-PC serial communication • Access to select signal pin test points • LEDs, temp sensor and light sensor • CAN transceiver • Includes code composer studio™ (CCStudio) IDE, HALCoGen and code examples SafeTI evaluation eits Development Hercules development kits TMDX570LS31HDK – TMS570LS31x/21x development kit TMDX570LS12HDK – TMS570LS12x/11x development kit TMDX570LS04HDK – TMS570LS04x/03x development kit TMDX570LC43HDK – TMS570LC43x development kit TMDXRM48HDK – RM48 development kit TMDXRM46HDK – RM46 development kit TMDXRM42HDK – RM42 development kit TMDXRM57LHDK – RM57 development kit Hercules development kit features: • On-board USB XDS100v2 JTAG debug • On-board SCI-to-PC serial communication • External JTAG and 32-bit ETM trace (RM48 and TMS570LS31) • Access to signal pin test points • LEDs, temp sensor and light sensor • 2 CAN transceivers • RJ-45 10/100 Ethernet interface (RM48/RM46 and TMS570LS31/12) • USB-A host and USB-B device interfaces (RM48) • Includes CCStudio IDE, HALCoGen, and code examples $199 SafeTI™ Hitex safety kits SAFETI-HSK-RM48 – RM48 SafeTI Hitex safety kit SAFETI-HSK-570LS31 – TMS570 SafeTI Hitex safety kit SafeTI Hitex safety kit features: • Cost-effective platform to ease evaluation of SafeTI components – Hercules MCU and TPS65381 PMIC for use in safety-critical applications requiring compliance to functional safety standards such as ISO 26262 and IEC 61508 • Accelerometer, temperature sensor, CAN transceiver and LCD module Texas Instruments • Software and host GUI with capabilities for hardware fault injection, application and run-time profiling of fault diagnostics, and system response monitoring in real-time • On-board USB XDS100v2 JTAG debug • Includes CCStudio IDE, HALCoGen, SafeTI diagnostic library and evaluation version of SAFERTOS® $599 Advanced Driver Assistance Systems (ADAS) Guide 2015 | 21 Hercules safety MCUs Hercules™ tools and software Development tools Integrated development environment Compilers and debuggers: • TI Code Composer Studio™ (CCStudio) IDE • Green Hills MULTI® • IAR Workbench® • ARM® DS-5 • iSystem winIDEA • Lauterbach GUI-based code generation tools HALCoGen: • GUI to configure peripherals, interrupts, clocks and other µC parameters • Generates device init and peripheral drivers • Import into CCStudio, IAR and ARM DS-5 HET IDE • Graphical programming environment • Output simulation tool • Generates CCStudio IDE-ready software • Includes functional examples from TI Development software TI MotorWare™ software for Hercules 22 | • Sensorless InstaSPIN™-BLDC • Speed and torque control loops • TI MotorWare and HALCoGen conventions • Leverages ARM® CMSIS Math Library • Source code CCStudio IDE projects • Field oriented/vector control (FOC) • Encoder sensor driver example • Sliding mode observer (SMO) based “virtual encoder” • Comparison of encoder and SMO derived angles • Included in Hercules motor control kits Safety-certifiable RTOS and AUTOSAR Real-time operating system support: • SAFERTOS®: High Integrity Systems • μC/OS II/III™: Micrium • SCIOPTA RTOS: SCIOPTA • Mentor Graphics: Nucleus • MicroDigital: SMXRTOS Advanced Driver Assistance Systems (ADAS) Guide 2015 AUTOSAR RTE and MCAL support: • Vector MICROSAR Safe • Safe AUTOSAR from TTTech/Vector • AUTOSAR: ElektroBit tresos • MCAL from TI Texas Instruments Selection tables Operational amplifiers/thermal management/data converters Operational amplifiers Applications Device Product description Camerabased systems LIDAR Radar Sensor fusion 370-MHz to 3-dB bandwidth (VOUT = 0.5 VPP), 50-MHz 0.1 dB bandwidth, 2,400 V/µs slew rate; 18-ns settling Time to 0.05%, –94/–96 dB HD2/HD3 at 5 MHz 200-MHz wide bandwidth, high speed, CMOS inputs, rail-to-rail output, designed for video processing applications (i.e., ADAS camera systems) x — — — x — x — Key specifications Operational amplifiers LMH6551Q-Q1 High-performance voltage feedback differential amplifier OPA356-Q1 2.5-V, 200-MHz GBW, CMOS single THS4121 High-speed fully differential I/O amplifier 3.3 V, 100 MHz, 43 V/us, fully differential CMOS amplifier — x x x THS4541 High-speed low-power, voltage-feedback, fully differential amplifier (FDA) architecture Negative rail input, rail-to-rail output, precision, 850-MHz fully differential amplifier — x x x OPA2836 High-speed dual, very low power, rail to rail out, negative rail in, VFB op amp — x x x TLV274-Q1 550-µA/ch 3-MHz rail-to-rail output opertional amplifier x — — — TLC084-Q1 Wide-bandwidth high-output-drive single-supply operational amplifiers Q1 advanced LinCMOS rail-to-rail operational amplifier 250-MHz, rail-to-rail I/O, CMOS Dual operational amplifier — — x — — — x — x — x — TLC2274A-Q1 OPA2354A-Q1 Very low power, Iq: 1 mA/ch, power-down: < 1 uA, +2.5 V to +5 V single supply, bandwidth: 205 MHz, slew rate: 560 V/μs, HD2: –120 dBc and HD3: –130 dBc at 100 kHz 3-MHz bandwidth, 2.7-V to 16-V supply-voltage range, rail-to-rail output, CMOS inputs that enable use in high-impedance sensor interfaces, low power to enable battery-powered operation 10-MHz bandwidth, 4.5-V to 16-V supply-voltage range, 1.9-mA low-supply current per channel and low-input noise voltage 2.2-MHz bandwidth, 4.4-V to 16-V supply-voltage range, rail-to-rail output, high-input impedance and low power dissipation 250-MHz wide bandwidth (per channel), high speed, CMOS inputs, rail-to-rail output, designed for video processing applications (i.e., ADAS camera systems) Amplifiers for analog video drivers LMH6601Q High-speed DG: 0.06%, DP: 0.1 deg x — — — LMH664xQ High-speed, low-power RRO op amp DG: 0.16%, DP: 0.05 deg x — — — LMH6619Q High-speed, low-noise RRIO op amp DG: 0.1%, DP: 0.1 deg x — — — Thermal management Applications Device Product description 1.8-V, resistor-programmable temperature switch and analog-out temperature sensor TMP300-Q1 Key specifications Camerabased systems LIDAR Radar Sensor fusion Digital temp switch with open drain output, resistor-programmable, 1.8-V to 18-V supply-voltage range, low power — — x x Data converters Applications Device Product description Key specifications Camerabased systems LIDAR Radar Sensor fusion — — x — — — x — — — x — — — — — — — — — — — x — — — x — — x x — DAC DAC5311-Q1 8-bit, low-power, single-channel DAC DAC7551-Q1 12-bit, ultra-low glitch, single-channel voltage-output DAC DAC8562/63-Q1 16-bit, ultra-low glitch, dual-channel DAC with internal reference DAC8162/63-Q1 16-/14-/12-bit, ultra-low glitch, dualchannel DAC with internal reference DAC7562/63-Q1 16-/14-/12-bit, ultra-low glitch, dualchannel DAC with internal reference 8-bit, single-channel DAC, MicroPower operation, 1.8-V to 5.5-V supply range, serial SPI interface, 6-μs settling time, ±0.25 LSB INL, 80 μA at 1.8 V, –40°C to +85°C 2.7-V to 5.5-V operation, ±0.3 5LSB INL, 0.1-nV-s glitch, 100 μA at 2.7 V, –40°C to +105°C, SPI digital interface, small form factor and low power operation, 5-μs settling time 2.7-V to 5.5-V operation, ±0.4 LSB INL, 0.1-nV-s glitch, 4 ppm/°C internal reference, –40°C to +125°C 16-/14-/12-bit, dual-channel DAC, 4ppm/˚C internal reference, 2.7 V to 5.5 V operation, serial SPI interface, 7 µs settling time, ±4 LSB INL (16-bit), 0.1 nV-s glitch, 0.73 mA at 2.7 V, -40˚C to +125˚C 16-/14-/12-bit, dual-channel DAC, 4ppm/˚C internal reference, 2.7 V to 5.5 V operation, serial SPI interface, 7 µs settling time, ±4 LSB INL (16-bit), 0.1 nV-s glitch, 0.73 mA at 2.7 V, –40˚C to +125˚C ADC ADS7955-Q1 Dual 10-bit 40-MSPS low-power ADC with PGA 10-bit, 1-MSPS, 8-channel, single-ended, MicroPower, sr i/f, SAR ADC ADC3422 Quad-channel, 12-bit, 25-MSPS to 125-MSPS, analog-to-digital converter ADS5204-Q1 Texas Instruments 10-bit dual-channel pipeline ADC with on-chip programmable gain amp, up to 40-MSPS sampling, 3.3-V single-supply operation, low power 10-bit, 8-channel SAR ADC, 2.7-V to 5.25-V supply range, 1-MSPS sampling with serial SPI interface, 0.5-LSB INL Quad-channel, 12-bit, 25-MSPS to 125-MSPS, flexible input clock buffer with divide-by 1, 2, 4; SNR = 70.2 dBFS, SFDR = 87 dBc; ultra-low power consumption: – 98 mW/ch at 125 MSPS; channel Isolation: 105 dB Preview Devices are listed in bold teal. Advanced Driver Assistance Systems (ADAS) Guide 2015 | 23 Selection tables Interface/standard logic/DDR terminators/sequencers Interface Applications Device Product description TPD2E001-Q1 TPD4E001-Q1 USB 2.0, Ethernet, LVDS ESD protection USB 2.0, Ethernet, SD card, LVDS ESD protection USB 3.0, HDMI 1.4, cap touch, Ethernet, LVDS, ESD protection TPD4E05U06-Q1 Key specifications Camerabased systems LIDAR Radar Sensor fusion 2 ch, 8/15 kV (contact/air), 1.5 pF, SOT-533 4 ch, 8/15 kV (contact/air), 1.5 pF, SOT-23 x x x x x x x x 4 ch, 12/15 kV (contact/air), 0.5 pF, USON x x x x Key specifications Camerabased systems Standard logic Applications Device Product description LIDAR Radar Sensor fusion IPD TPD2E001-Q1 USB 2.0, Ethernet, LVDS ESD protection 2 ch, 8/15 kV (contact/air), 1.5 pF, SOT-533 x x x x TPD4E001-Q1 USB 2.0, Ethernet, SD Card, LVDS ESD protection USB 3.0, HDMI 1.4, cap touch, Ethernet, LVDS, ESD protection 4 ch, 8/15 kV (contact/air), 1.5 pF, SOT-23 x x x x 4 ch, 12/15 kV (contact/air), 0.5 pF, USON x x x x SN74AHC244-Q1 Octal buffers/drivers with 3-state outputs 8-bit buffer, 2-V to 5.5-V supply voltage, 40-µA max Iq x — — x SN74LVC125A-Q1 Quadruple bus buffer gate with 3-state outputs 4-bit buffer, 1.65-V to 3.6-V supply voltage, 10-µA max Iq, 4.8-ns max Tpd x — — x Single-pole, double-throw switch, 1.65-V to 5.5-V supply voltage, 50-Ω Rdson x — — — Dual single-pole, double-throw switch, 1.65-V to 5.5-V supply voltage, 15-Ω Rdson Single two-input OR gate, 2-V to 5.5-V supply voltage, 10-µA max Iq, 7.5-ns max Tpd Single two-input XOR gate, 2-V to 5.5-V supply voltage, 10-µA max Iq, 10-ns Max Tpd x — — — x — — x x — x x Single-pole, single-throw switch, 1.65 V to 5.5 V supply voltage, 35 Ω Rdson x — x x LIDAR Radar Sensor fusion x x x x x x TPD4E05U06-Q1 Logic SN74LVC1G3157-Q1 Single-pole, double-throw analog switch TS5A23157-Q1 Dual single-pole, double-throw analog switch SN74AHC1G32-Q1 Single two-input positive-OR gate SN74AHC1G86-Q1 Single exclusive-OR gate SN74LVC1G66-Q1 Single-pole, single-throw analog switch DDR terminators Applications Device Product description Key specifications Camerabased systems LP2998-Q1 TPS51200-Q1 DDR termination LDO DDR termination LDO VIN range 1.35 V to 5.5 V; IOUT up to 1.5 A; DDR1, 2 and 3 memories VIN range 1.1 V to 3.5 V; IOUT up to 3A; DDR1, 2, 3, LV3 and LP3 memories x x Sequencers Applications Device Product description LM3880-Q1 Power sequencer for both power up and down 24 | Key specifications VIN range 2.7 V to 5.5 V; many timing options available, 6 released; 1 enable input, 3 open drain sequence outputs Advanced Driver Assistance Systems (ADAS) Guide 2015 Camerabased systems LIDAR Radar Sensor fusion x x x x Texas Instruments Selection tables Power management Power management Applications Device Product description Key specifications Camerabased systems LIDAR Radar Sensor fusion DC/DC converters and regulators TPS62090-Q1 3-A synchronous step-down converter with DCS control 6 VIN, 97% efficiency, 3 mm x 3 mm QFN x — x x TPS62065-Q1 2-A synchronous step-down converter 6 VIN, 3 MHz, 2 x 2 SON package, smallest total solution size x — x x LM25011AQ 6-V to 42-V input voltage range current-limit-adjustable to 2 A switching frequency adjustable to 2 MHz, no loop compensation required x x x x 2.2-MHz switching-frequency option (LM26420X) x — x x 3-MHz switching-frequency option (LM2830Z) x — x x x x x x — — — LM34919BQ Ultra-small 40-V, 600-mA constant on-time buck-switching regulator 0.8-V reference with 1% accuracy, 200 kHz to 2 MHz switching frequency, frequency synchronization, PG, EN 0.8-V reference with 1% accuracy, 100 kHz to 2.5 MHz switching frequency, frequency synchronization, PG, EN Enables “off-battery” application via wide-input voltage range (6 V to 40 V), ideal for small camera modules, 2 mm x 2 mm footprint (uSMD package), up to 2.6-MHz switching frequency to minimize interference, no loop compensation required 2.9 V to 32 V input voltage, frequency adjustable from 100 kHz to 1.2 MHz, frequency synchronization, 2.7 uA shutdown current, VOUT adjustable to 38 V, PG, EN Input voltage range: 5.5 V to +65 V; less than 15-μA quiescent current in disabled mode; 10-lead VSSOP Wide VIN range: 5.5 V to 65 V (LM5117), 4.5 V to 42 V (LM25117), current monitoring output (IOUT), low 15-µA shutdown mode quiescent current x TPS54040-Q1 42-V, 2-A constant on-time buck converter with adjustable current limit Dual 2-A, high-frequency synchronous step-down DC/DC regulator High-frequency 1-A step-down DC/DC regulator 2.95 V to 6 V input, 3 A synchronous buck converter in 3 mm x 3 mm QFN package 3.5 V to 42 V input, 0.5 A buck converter in 10 MSOP or 3 mm x 3 mm SON Packages x — — — x — — x x x x x x x x LM26420 LM2830 TPS54618-Q1 LM5117Q Integrated 5-A MOSFET, wide-input range boost/flyback/SEPIC converter in 14 HTSSOP or 16 QFN packages High-side protection controller with low quiescent current 65-synchronous buck controller with current monitor TPS62260-Q1 Step down buck converter 6 VIN, 600 mA, 2.25 MHz, 2x 2 SON package x — — x TPS62130A-Q1 Step down buck converter 17 VIN, 3 A, 2.25 MHz, 3 x 3 QFN package x — — — TPS62150A-Q1 Step down buck converter 17 VIN, 1 A, 2.25 MHz, 3 x 3 QFN package x — — — TPS62160-Q1 Step down buck converter 17 VIN, 1 A, synchronous, 2 x 2 SON package — — — — TPS62170-Q1 Step down buck converter 17 VIN, 0.5 A, synchronous, 2 x 2 SON package — — — — x x x x x x x x 0.8-V reference with 1% accuracy , frequencyadjustable up to 2 MHz, 3 mm x 3 mm 16-pin QFN package — — x x 60 VIN, 200 mA, synchronous DC/DC converter in small VSON-8 DRB 3 mm x 3 mm package, 50 MHz to 1.1 MHz switching frequency, 90 µA x x x — Integrated 200-mΩ high-side MOSFET, 100-kHz to 2.5-MHz switching frequency x — x — 100-kHz to 2.5-MHz switching frequency, integrated boot recharge MOSFET for low VIN dropout regulation x x x x 100-kHz to 2.5-MHz switching frequency, integrated boot recharge MOSFET for low VIN dropout regulation x x x x 100-kHz to 2.5-MHz switching frequency, integrated boot recharge MOSFET for low VIN dropout regulation x x — x 2.9 V to 32 V input voltage, frequency adjustable from 100 kHz to 1.2 MHz, frequency synchronization, 2.7 uA shutdown current, VOUT adjustable to 38 V, PG, EN x — — x TPS55340 LM5060-Q1 LP3907 LP8728 TPS54618-Q1 TPS54061-Q1 TPS54240-Q1 TPS5434/60-Q1 TPS5434/60-Q1 TPS5454/60-Q1 TPS55540-Q1 Dual high-current step-down DC/DC and dual linear regulator with I2C-compatible interface Quad high-current step-down synchronous DC/DC 2.95-V to 6-V input, 6-A synchronous buck SWIFT™ converter, integrated 12-mΩ HS and LS MOSFETs Fully synchronous automotive AEC-Q100 grade 1-qualified, wide VIN DC/DC converter, 200 mA 4.5 V to 42 V, 2.5-A automotive DC/DC converter, peak current-mode control with Eco-mode™ control scheme, small SON 3 mm x 3 mm package 4.5-V to 42-V/60, 3.5-A automotive DC/DC converter, peak CMC with Eco-mode™ control scheme in 5 mm x 6 mm thermally enhanced SOIC package 4.5-V to 42-V/60, 3.5-A automotive DC/DC converter, peak CMC with Eco-mode™ control scheme in 5 mm x 6 mm thermally enhanced SOIC package 4.5-V to 42-V/60, 5.0-A automotive DC/DC converter, peak CMC with Eco-mode™ control scheme in 5 mm x 6 mm thermally enhanced SOIC package Integrated 5-A MOSFET, wide-input range boost/flyback/SEPIC converter in 14 HTSSOP or 16 QFN packages Two 1-A/600-mA step-down DC/DC converters with dynamic voltage management (DVM), two 300-mA linear regulators, 2.1-MHz PWM switching frequency Two 1-A synchronous step-down, two 600-mA synchronous step-down, 3.3-MHz switching frequency, spread spectrum for EMI reduction New Devices are listed in bold red. Preview Devices are in bold teal. Texas Instruments Advanced Driver Assistance Systems (ADAS) Guide 2015 | 25 Selection tables Power management Power management (continued) Applications Device Product description Key specifications Camerabased systems LIDAR Radar Sensor fusion Power supply Automotive catalog low Iq 30 µA, high VIN Dual-buck regulator controller, single-buck regulator converter quad-output power supply and single LDO Six-channel power management IC with three Three DC/DC converters with 1.5-A, 1.2-A and 1-A current limits, DC/DCs, three LDOs, I2C interface and DVS 2x 200-mA LDOs, I2C interface 40 V step-down converter with EcoMode™ 40 V, 3.2 A, 2 MHz buck converter and 280 mA LDO and LDO regulator Dual 150 kHz to 600 kHz buck controllers Dual 150 kHz to 600 kHz buck controllers with with spread-spectrum functionality on the spread-spectrum functionality on the TPS43351-Q1 TPS43351-Q1 Fixed-frequency, 99% duty cycle peak Dual synchronous buck regulator controller, dual LDOs, 99% duty cycle, current-mode power controller 200-kHz to 1-MHz switching frequency Power management IC (PMIC) for ARM Cortex Power management IC with seven buck converters, six LDOs, A15 processors diagnostics, and power sequencing 2.25-MHz 400-mA + 600-MHz 2.5-V to 6-V input dual synchronous step-down converter, Dual step-down converter up to 95% efficiency High-voltage power-management IC for Single 490-kHz DC/DC controller, dual 0.98-MHz automotive safety applications DC/DC buck converter, single adjustable 350-mA linear regulator High-voltage power-management IC for Single 490-kHz DC/DC controller, dual 2.45-MHz automotive safety applications DC/DC buck converter, single adjustable 350-mA linear regulator Automotive 3-MHz step-down regulator, triple 3-MHz step-down regulator, single linear regulator linear regulators and dual linear regulator controllers Multirail power supply for microcontrollers in Wide-input voltage buck converter, LDOs including sensor supply, safety-critical applications question-and-answer watchdog, enhanced diagnostics and BIST Multirail power supply with three DC/DC Three DC/DC converters, control signal for external converters and eight LDOs DC/DC converter, eight LDOs, I2C interface, watchdog timer Automotive catalog dual switcher and linear Wide-voltage supply range from 5 V to 30 V (up to 40-V transient), dual regulators multirail power supply adjustable output voltage, step-down controllers and dual programmable LDOs x — x x x — — x x — — x x — — x x — — — x x — x x — x x x x x x x x x x x x x x x x x x x — — x x — — x LP5907-Q1 250 mA ultra-low-noise LDO for RF/analog power 6.5 μVRMS, 82 dB PSRR, 2.5 V to 5.5 V VIN, stable with ≥ 0.47-μF ceramic caps, output discharge and very small soln. size (< 1 mm2) x x x x LP3990-Q1 150 mA linear Voltage regulator for digital applications 1% accuracy, low Iq (disabled) < 10 nA, fast turn on/off (105/175 μS), 55 dB PSRR, 2.0 V to 6.0 V VIN, output discharge and tiny package (1.3 mm x 1 mm) x x x x Low Iq, 1 µA when IOUT = 0 mA, 8 µA when IOUT = 150 mA, low-dropout voltage: 130 mV at 150 mA, VIN 2.2 V to 5.5 V, stable with 1-µF ceramic capacitors, thermal shutdown and overcurrent protections x x x x Adjustable output voltage: 0.7 V to 5.5 V, input voltage 2.7 V to 10 V, 27-μA quiescent current at 100 mA,1 µA in standby mode, overcurrent protection x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x x TPS43340-Q1 TPS65023-Q1 TPS65320-Q1 TPS4335x-Q1 TPS51220A-Q1 TPS659039-Q1 TPS62402-Q1 TPS65310A-Q1 TPS65311-Q1 TPS65300-Q1 TPS65381-Q1 TPS659119-Q1 TPS43331-Q1 LDOs mA, ultra-low quiescent current, 1-μA Iq TPS78225/27/28/ 150 low-dropout linear regulator with EN function, 30-Q1 fixed voltage options: 2.5 V, 2.7 V, 2.8 V, 3 V Low-output, adjustable, ultra-low-power, TPS76201-Q1 100-mA low-dropout linear regulator with EN function TPS75201-Q1 TPS74801-Q1 TPS74701-Q1 TPS73601-Q1 TPS73433-Q1 TPS73201/50-Q1 TPS71501/25/ 30/33/50-Q1 Adjustable output voltage 1.5 V to 5 V, input voltage 2.7 V to 5.5 V, typically 210-mV dropout voltage at 2 A, ultra-low 75-μA quiescent current, thermal shutdown protection VOUT range 0.8 V to 3.6 V, 5.5-V max input voltage, 1.5-A low-dropout linear regulator with 60-mV low-dropout voltage at 1.5 A, programmable soft start, stable with programmable soft start any output cap > = 2.2 µF, good transient response under low VIN V range 0.8 V to 3.6 V, 5.5-V max input voltage, 50-mV low-dropout voltage OUT 500-mA low-dropout linear regulator with at 500 mA, programmable soft start, stable with any programmable soft start output cap > = 2.2 µF, good transient response under low VIN VIN range from 1.7 V to 5.5 V, stable with no output cap, Cap-free, NMOS, 400-mA low-dropout 75-mV ultra-low dropout voltage, excellent load transient, regulator with reverse current protection low noise: 30 μVRMS (10 KHz to 100 KHz), adjustable output voltage: 1.2 V to 5.5 V, thermal shutdown protection VIN range from 2.7 V to 6.5 V, 125-mV dropout voltage when IOUT = 150 mA, 250-mA, low quiescent current, ultra-low stable with a Low ESR, 2.2-µF output cap, fast startup time: 45 μS, noise, high PSRR low-dropout linear regulator high PSRR: 60 dB at 1 kHz, low noise: 28 μVRMS, low Iq: 44 μA, adjustable output voltage: 1.25 V to 6.2 V VIN range from 1.7 V to 5.5 V, stable with no output cap, 40-mV ultra-low Cap-free, NMOS, 250-mA low-dropout dropout voltage at 250 mA, excellent load transient, regulator with reverse current protection low noise: 30 μVRMS (10 KHz to 100 KHz), adjustable output voltage: 1.2 V to 5.5 V, thermal shutdown protection 50-mA, 24-V, 3.2-μA supply current VIN 2.5 V to 24 V, 3.2-μA typical low Iq at 50 mA, adjustable output voltage: low-dropout linear regulators in SC70 package 1.2 V to 15 V, stable with any capacitor > 0.47 μF Fast transient response 2-A low dropout voltage regulator with reset 26 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Selection tables Power management Power management (continued) Applications Device Product description Key specifications Camerabased systems LIDAR Radar Sensor fusion LDOs (continued) TLV70012/18-Q1 TLV70025/30-Q1 TPS79912/15/ 18/25/27/33-Q1 300-mA, low-Iq, low-dropout regulator with EN 200-mA low-Iq low-dropout regulator for portable devices with EN 200-mA, low quiescent current, ultra-low noise, high PSRR, low-dropout, linear regulators with EN function, fixed-voltage options: 1.2 V, 1.5 V, 1.8 V, 2.5 V, 2.7 V, 3.3 V TPS79633-Q1 Ultra-low-noise, high PSRR, fast, RF, 1-A linear regulator TPS79501-Q1 Low-dropout linear regulator with EN function, 3.3-V fixed-output voltage TPS79328-Q1 Ultra-low noise, high PSRR, fast, RF, 500-mA low-dropout linear regulator with EN function, output voltage 1.2 V to 5.5 V TPS72301/25-Q1 200-mA low-noise, high-PSRR, negative-output, low-dropout linear regulators TPS71750-Q1 Low-noise, high-bandwidth PSRR low-dropout 150-mA linear regulator with EN function TPS7A6601/ 33/50-Q1 150 mA 40 V high-voltage ultra-low Iq LDO TPS7A6933/50-Q1 150 mA 40 V high-voltage ultra-low Iq LDO VIN 2 V to 5.5 V, 35-μA typical low Iq, high PSRR: 68 dB at 1 kHz, thermal shutdown and overcurrent protection, stable with effective cap of 0.1 μF VIN 2 V to 5.5 V, 31-μA typical low Iq, high PSRR: 68 dB at 1 kHz, thermal shutdown and overcurrent protection, stable with effective cap of 0.1 μF 40-μA low quiescent current, VIN 2.7 V to 6.5 V, 100-mV dropout voltage when IOUT = 200 mA, 66-dB PSRR at 1 kHz, excellent load/line transient response, fast startup time: 45 μs High PSRR: 53 dB at 10 kHz, VIN 2.7 V to 5.5 V, ultra-low noise, 40 μVRMS, fast startup time: 50 μs, stable with 1-μF ceramic capacitor, very low dropout voltage: 250 mV at full load High PSRR: 50 dB at 10 kHz, VIN 2.7 V to 5.5 V, ultra-low noise: 33 μVRMS, fast startup time: 50 μs, stable with 1-μF ceramic capacitor, very low dropout voltage: 110 mV at full load High PSRR: 70 dB at 10 kHz, VIN 2.7 V to 5.5 V, ultra-low noise: 32 μVRMS, fast startup time: 50 μs, stable with 2.2-μF ceramic capacitor, very low dropout voltage: 112 mV at full load VIN range from –2.7 V to –10 V, 280-mV dropout voltage when IOUT = 200 mA, adjustable output voltage: –1.2 V to –10 V, stable with a Low ESR, 2.2-μF output cap, high PSRR: 65 dB at 1 kHz, low noise: 60 μVRMS, thermal shutdown protection VIN 2.5 V to 6.5 V, 45-µA typical low Iq, adjustable output voltage: 0.9 V to 6.2 V, ultra-high PSRR: 70 dB at 1 kHz, 67 dB at 100 kHz and 45 dB at 1 MHz 4, low noise: 30 μV typical (100 Hz to 100 kHz), stable with 1-µF ceramic output cap, 170-mV dropout at 150 mA 12 uA Iq and wide ouput capacitor ESR range support, full function with EN and RESET in MSOP-8 package 12 uA Iq and wide ouput capacitor ESR range support, Adjustable input voltage monitoring threshold in SOIC-8 package 15 uA Iq and wide ouput capacitor ESR range support, full function with EN and RESET in HTSSOP-20 package x x x x x x x x — — x — — — x — — — x — — — x — — — x — — — x — — — x — — — x — — — x — TPS7B6701/ 33/50-Q1 450 mA 40 V high-voltage ultra-low Iq LDO TPS51200-Q1 3 A DDR termination LDO for DDR, DDR2, DDR3, and low power DDR3/DDR4 Input voltage supports both 2.5 V and 3.3 V, built-in soft start, UVLO and OCL x x x x Ultra-low-power 3.1-GHz frac-N PLL Dual PLL RF and IF 5-mA operating current at 3-V digital lock detect output — — x — Ultra-high-performance 13.5 GHz frac-N PLL with ramping generation Wide operating frequency range from 500 MHz to 13.5 GHz flexible ramp generation direct modulation 200-MHz maximum PDF frequency-227 dBc/Hz phase noise performance — — x — xRF PLL LMX2485Q LMX2492Q Load switches Applications Device TPS22965-Q1 TPS22966-Q1 TPS22968-Q1 Product description 5.5 V, 4 A, 16 mΩ automotive catalog load switch with quick output discharge and adjustable rise time 5.5 V, 4 A, 18 mΩ, 2-channel automotive catalog load switch with quick output discharge and adjustable rise time 5.5 V, 4 A, 27 mΩ, 2-channel automotive catalog load switch with quick output discharge and adjustable rise time Texas Instruments Key specifications Camerabased systems 8-WSON package (2.0 mm x 2.0 mm x 0.75 mm with 0.5 mm pitch) AEC-Q100 grade 2 x — x x 14-WSON package (3.0 mm x 2.0 mm x 0.75 mm with 0.4 mm pitch) AEC-Q100 grade 2 x — x x 10-WSON wettable flanks package (3.0 mm x 2.0 mm x 0.75 mm with 0.5 mm pitch), AEC-Q100 grade 1 x — x x LIDAR Radar Sensor fusion Advanced Driver Assistance Systems (ADAS) Guide 2015 | 27 Selection tables FPD-link II & III Ser/Des/TMS570 family FPD-link II & III Ser/Des Device Applications Parallel data Pixel clock Equalization Spread spectrum Other features ESD FPD-Link III with embedded bidirectional control bus DS90UB913/4 Camera 10 or 12 CMOS 10 to 100 MHz Adaptive Yes 2:1 Input mux 8-kV HBM, ISO 10605 DS90UB901/2 Camera 14 (16) CMOS 10 to 43 MHz Yes Yes — 8-kV HBM, ISO 10605 TMS570 family Device RAM (kB) Date flash (kB) EMAC FlexRay 32 16 — 32 16 32 128 1MB 1MB 128 128 64 64 1MB 1MB 128 128 64 64 — 1MB 1MB 128 128 64 64 1MB 1MB 128 128 1MB 1MB 128 128 180 2MB 2MB 192 192 160 180 2MB 2MB 192 192 64 64 — 160 180 3MB 3MB 256 256 64 64 160 180 3MB 3MB 256 256 160 180 3MB 3MB 256 256 Speed (MHz) Flash TMS570LS04x/03x series TMS5700332 80 256KB PZQQ1 TMS5700432 80 384KB PZQQ1 TMS570LS0232 80 256KB TMS570LS12x/11x series TMS5701114 PGEQQ1 160 180 TMS5701114 ZWTQQ1 TMS5701115 160 PGEQQ1 180 TMS5701115 ZWTQQ1 TMS5701224 160 PGEQQ1 180 TMS5701224 ZWTQQ1 TMS570LS31x/21x series TMS5701225 160 PGEQQ1 180 TMS5701225 ZWTQQ1 TMS5701227 160 PGEQQ1 180 TMS5701227 ZWTQQ1 TMS570LS31x/21x series TMS5702124 APGEQQ1 160 TMS5702124 AZWTQQ1 TMS5702125 APGEQQ1 TMS5702125 AZWTQQ1 TMS5703134 APGEQQ1 TMS5703134 AZWTQQ1 TMS5703135 APGEQQ1 TMS5703135 AZWTQQ1 TMS5703137 APGEQQ1 TMS5703137 AZWTQQ1 Mib ADC HET PWM CAP/ 12 bit EMIF (Ch) (Ch) QEP (Ch) (16 Bit) Total GIO (interrupt) TRACE (EMT/ RTP/ DMM) Package Temp range (°C) CAN MibSP (cs) SPI (cs) I2C UART (L(N) — 2 1(4) 2(8) — 1(1) 19 — –/2 1(16) — 45(8) — 100 QFP –40 to 125 — — 2 1(4) 2(8) — 1(1) 19 — –/2 1(16) — 45(8) — 100 QFP –40 to 125 — — 2 1(4) 2(8) — 1(1) 19 — –/2 1(16) — 45(8) — 100 QFP –40 to 125 — — 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) 14 14 6/2 6/2 2(24) 2(24) Yes 64(10) 101(16) — — 144 QFP –40 to 125 337 BGA –40 to 125 2 ch 2 ch 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) 14 14 6/2 6/2 2(24) 2(24) Yes 58(4) 101(16) — — 144 QFP –40 to 125 337 BGA –40 to 125 — — 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) 14 14 6/2 6/2 2(24) 2(24) Yes 64(10) 101(16) — — 144 QFP –40 to 125 337 BGA –40 to 125 64 64 — 2 ch 2 ch 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) 14 14 6/2 6/2 2(24) 2(24) Yes 58(4) 101(16) — — 144 QFP –40 to 125 337 BGA –40 to 125 64 64 10/100 10/100 2 ch 2 ch 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) 14 14 6/2 6/2 2(24) 2(24) Yes 58(4) 101(16) — — 144 QFP –40 to 125 337 BGA –40 to 125 64 64 — 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) — — — — 2(24) 2(24) Yes 64(10) 120(16) Yes 144 QFP –40 to 125 337 BGA –40 to 125 2 ch 2 ch 3 3 3(12) 3(16) 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) — — — — 2(24) 2(24) Yes 58(4) 120(16) Yes 144 QFP –40 to 125 337 BGA –40 to 125 — — 3 3 3(12) 3(16 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) — — — — 2(24) 2(24) Yes 64(10) 120(16) Yes 144 QFP –40 to 125 337 BGA –40 to 125 64 64 — 2 ch 2 ch 3 3 3(12) 3(16 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) — — — — 2(24) 2(24) Yes 58(4) 120(16) Yes 144 QFP –40 to 125 337 BGA –40 to 125 64 64 10/100 10/100 2 ch 2 ch 3 3 3(12) 3(16 1(1) 2(3) 1 1 2(1) 2(1) 2(40) 2(44) — — — — 2(24) 2(24) Yes 58(4) 120(16) Yes 144 QFP –40 to 125 337 BGA –40 to 125 Note: Above reflects max configuration of each module – some functions are multiplexed. 28 | Advanced Driver Assistance Systems (ADAS) Guide 2015 Texas Instruments Selection tables TDAx SoC family for camera, radar, lidar and fusion applications TDAx system-on-chip (SoC) family Device TDA2x Description SoC with scalable DSP, EVE and ARM Cortex-A15 and M4, video input and output, low power, automotive qualified DSP C66x 1 or 2 MPU A15 Accelerator EVEs 1, 2 or 4 TDA3x SoC with scalable DSP, EVE and ARM Cortex-M4, video input and output, low power, automotive qualified C66x 1 or 2 — EVE 1 Frequency A15: 1 or 2 500 MHz – 1176 MHz C66x DSP: 500 MHz –750 MHz EVE: 500 MHz – 650 MHz C66x DSP: 250 MHz – 650 MHz EVE: 250 MHz – 600 MHz L1P/ L1D(3) SRAM L2/ SRAM (bytes) (bytes) DSP: 32 KB L1D, 32 KB L1P ARM: 32 KB L1D, 32 KB L1P DSP: unified 256 KB L2 cache ARM: combined 2 MB L2 cache DSP: 32 KB L1D, 32 KB L1P ARM: 32 KB L1D, 32 KB L1P DSP: unified 256 KB L2 cache ARM: combined 64 KB L2 cache L3/ SRAM Up to 2.5 MiB Up to 512 KiB Video ports (hardware support) Up to 10 Program /data storage Async SRAM, SDRAM, DDR2/3, QSPI, NAND Flash, NOR Voltage core (V) 1.0 I/O 1.8/3.3 V Package 23 x 23 mm, BGA 17 x 17 mm BGA Up to 4 Async SRAM, SDRAM, DDR2/3, LPDDR2, QSPI, NAND Flash, NOR 1.0 1.8/3.3 V 15 x 15 mm BGA 12 x 12 mm PoP Legacy ADAS SoCs Device TMS320DM6437 TMS320DM648-Q7 TMS320C6747BZKBT3 TMS320C6748BQ4/Q3/Q2 Description SoC with scalable DSP, single video input and output, low power, automotive qualified SoC with highperformance DSP and accelerator, multiple video inputs, automotive qualified SoC with entry-level DSP, low power, automotive qualified SoC with scalable DSP, video input and output, low power, automotive qualified L1P/ L1D(3) SRAM L2/ SRAM (Bytes) (Bytes) 32 K/ 80 K 64 K128 K DSP C64x MPU — C64x — VICP at 365 MHz Q7: 730 MHz 32 K/ 32 K 1408 K — 5x video ports Program /data storage Async SRAM, DDR2 SDRAM, NAND Flash 4 C674x — — 375 MHz 32 K/ 32 K L2: 256 K 128 K — 4 3.3 100QFP BGA/ 17 x 17 mm (ZKB) C674x — — Q4: 400 MHz Q3: 300 MHz 32 K/ 32 K L2: 256 K 128 K Video in: 2x 8-bit SD (BT.656), OR 1x 16 bit, OR 1x raw (8/10/12 bit) video out: 2x 8-bit SD (BT.656), OR 1x 16 bit 1.3 1.8/ 3.3 BGA/ 16 x 16 mm (ZWT) BGA/ 13 x 13 mm (ZCE) Video in: 2x 8-bit SD (BT.656), OR 1x 16-bit, OR 1x raw (8-/10-/12- bit) video out: 2x 8-bit SD (BT.656) OR 1x 16-bit Video in: 2x 16/24-bit, 1x 8/16 bit video out: 2x SD-DAC, 2x digital Async SRAM, SDRAM, DDR2, mDDR, NAND Flash, NOR Async SRAM, SDRAM, DDR2, mDDR, NAND Flash, NOR 1.3 1.8/ 3.3 BGA/ 16 x 16 mm (ZWT) BGA/ 13 x 13 mm (ZCE) — — BGA/ 23 x 23 mm (CYE) Accelerator — Frequency 300 MHz to 660 MHz L3/ SRAM — OMAPL138BQ4/Q3 SoC with scalable DSP and ARM 926, video input and output, low power, automotive qualified C64x ARM926 EJ-S — Q4: DSP at 400 MHz ARM at 400 MHz Q3: DSP at 300 MHz ARM at 300 MHz ARM9: 16 K/ 16 K DSP: 32 K/ 32 K L2: 256 K 128 K TDA1MSVQ4/Q5 SoC with scalable DSP and ARM Cortex-A8, video input and output, low power, automotive qualified C674x CortexA8 VICP at 400 MHz Q4: DSP at 450 MHz ARM at 600 MHz Q5: DSP at 550 MHz ARM at 600 MHz DSP at 450 MHz — — — Texas Instruments Video ports (hardware support) 1x input 10/16 bit 1x output (digital/analog) — Voltage core (V) 1.05/ 1.2 1.2 1.8/ 3.3 I/O 1.8/ 3.3 Package BGA/ 16 x 16 mm (ZWT)BGA/ 13 x 13 mm 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