RGF10A THRU RGF10M SURFACE MOUNT GLASS PASSIVATED JUNCTION FAST RECOVERY RECTIFIER Reverse Voltage - 50 to 1000 Volts Forward Current - 1.0 Ampere TTEEDD N N E E T T A A PP SMA/DO-214AC FEATURES 0.115(2.92) 0.064(1.63) 0.090(2.28) 0.050(1.27) * * * * * * * GPRC (Glass Passivated Rectifier Chip) inside Glass passivated cavity-free junction Ideal for surface mount automated applications Fast switching for high efficiency Built-in strain relief Easy pick and place o High temperature soldering guaranteed: 260 C/10 seconds, at terminals * Plastic package has Underwriters Laboratory Flammability Classification 94V-0 0.181(4.60) 0.157(4.00) 0.016(0.41) 0.006(0.15) 0.096(2.43) 0.078(1.99) Max. 0.203 0.050(1.27) 0.030(0.77) MECHANICAL DATA 0.220(5.60) 0.191(4.84) Case : JEDEC DO-214AC molded plastic over passivated chip Terminals : Tin plated, solderable per MIL-STD-750, Method 2026 Polarity : Color band denotes cathode end Weight : 0.002 ounes , 0.064 gram *Dimensions in inches and (millimeters) TM MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS o Ratings at 25 C ambient temperature RGF10 SYMBOLS unless otherwise specified. UNITS A B D G J JA K KA M MA Maximum repetitive peak reverse voltage VRRM 50 100 200 400 600 600 800 800 1000 1000 Volts Maximum RMS voltage VRMS 35 70 140 280 420 420 560 560 700 700 Volts VDC 50 100 200 400 600 600 800 800 1000 1000 Volts Maximum DC blocking voltage o Maximum average forward rectified current TL=100 C I (AV) 1.0 Amps IFSM 30 Amps VF 1.3 Volts IR 5 30 50 uA Peak forward surge current 8.3ms single half sine-wave superimposed on rated load (JEDEC Method) Maximum instantaneous forward voltage at 1.0 A o Maximum DC reverse current at rated DC blocking voltage TA=25 C o TA=125 C o TA=150 C Maximum reverse recovery time (NOTE 1) trr Typical junction capacitance (NOTE 2) CJ Typical thermal resistance (NOTE 3) Operating junction and storage temperature range R R JA JL TJ,TSTG 150 250 150 500 300 500 nS 300 pF 15 o 75 29 C/W o -65 to +175 C NOTES : (1) Reverse recovery test condition : IF 0.5A, IR=1.0A, Irr=0.25A (2) Measured at 1.0 MHz and applied reverse voltage of 4.0 Volts (3) Thermal resistance from junction to ambient and from junction to lead P.C.B. mounted on 0.2 x 0.2" (5.0 x 5.0mm) copper pad areas. REV. 1 Zowie Technology Corporation RATINGS AND CHARACTERISTIC CURVES RGF10A THRU RGF10M FIG.1 - FORWARD CURRENT DERATING CURVE FIG.2 - MAXIMUM NON-REPETITIVE PEAK FORWARD SURGE CURRENT 30 60Hz RESISTIVE OR INDUCTIVE LOAD PEAK FORWARD SURGE CURRENT, AMPERES AVERAGE FORWARD RECTIFIED CURRENT, AMPERES 1.00 0.75 0.50 0.25 0 8.3ms SINGLE HALF SINE-WAVE (JEDEC Method) 25 20 15 10 5 0 50 75 100 125 150 175 1 200 10 o FIG.4 - TYPICAL REVERSE CHARACTERISTICS FIG.3 - TYPICAL INSTANTANEOUS FORWARD CHARACTERISTICS 100 INSTANTANEOUS REVERSE LEAKAGE CURRENT, MICROAMPERES IINSTANTANEOUS FORWARD CURRENT, AMPERES 10.00 PULSE WIDTH=300uS 1% DUTY CYCLE 1.00 0.10 0.01 10 o TJ = 150 C o TJ = 125 C 1 o TJ = 25 C 0.1 0.4 0.6 0.8 1.0 1.2 1.4 0 1.6 FIG.5 - TYPICAL JUNCTION CAPACITANCE 40 60 80 100 110 FIG.6 - TYPICAL TRANSIENT THERMAL IMPEDANCE TRANSIENT THERMAL IMPEDANCE( C/W) 200 o TJ = 25 C 100 100 o JUNCTION CAPACITANCE, pF 20 PERCENT OF RATED PEAK REVERSE VOLTAGE,% INSTANTANEOUS FORWARD VOLTAGE, VOLTS 60 40 20 10 6 4 2 10 1 0.1 1 .1 .2 .4 1.0 2 4 10 REVERSE VOLTAGE, VOLTS REV. 1 100 NUMBER OF CYCLES AT 60Hz LEAD TEMPERATURE, C 20 40 100 0.01 0.10 1.0 10 100 t , PULSE DURATION, sec Zowie Technology Corporation