Package Compliance Report

PQFN 4X6
RoHS Compliance Document
Contents:
1. Composition
2. Solder Reflow
3. Tin Whisker Report
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
April 2015
PQFN 4X6 Copper Clip BOM 1
Component
Chip
Encapsulant
Lead Frame
Material
Name
Silicon
Epoxy
Resin
Material
Mass (g)
0.00201
Copper
0.01840
0.03071
Wire bond
Clip
Soft
Solder
Gold
Copper
0.00050
0.00995
Lead Finish
Matte Tin
0.00235
Die Attach
0.00082
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Pb
Sn
Au
Cu
Sn
Total Weight
(g)
CAS #
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7439-92-1
7440-31-5
7440-57-5
7440-50-8
Substance
Mass (g)
0.00201
0.01996
0.01075
0.01785
0.00055
0.00080
0.00002
0.00050
0.00995
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
95%
5%
100%
100%
7440-31-5
0.00235
100%
% of Total
Weight
3.1%
30.8%
16.6%
27.6%
0.8%
1.2%
0.0%
0.8%
15.4%
3.6%
0.06474
* Tin whisker mitigation strategy is 150 C, 1 hour anneal within 24 hours of tin plating.
260 DEGREE REFLOW PROFILE
300
60 to 150 sec
> 217 C
DEGREE CELCIUS
250
200
150
10 to 30
sec
> 255 C
60 to 180 sec
150 C to 200 C
100
50
0
TIME
This part is compliant with EU Directive 2011/65/EU (RoHS) and does not contain lead, mercury,
cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as
permitted by Annex (7).
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
April 2015
PQFN 4X6 Copper Clip BOM 2
Material
Name
Silicon
Epoxy
Resin
Material
Mass (g)
0.00201
Lead Frame
Copper
0.01840
Die Attach
Soft
Solder
0.00082
Wire bond
Clip
Gold
Copper
0.00050
0.00995
Lead Finish
Matte Tin
0.00235
Component
Chip
Encapsulant
0.03071
Element
Name
Composition
Si
SiO2
Epoxy Resin
Cu
Fe
Pb
Sn
Ag
Au
Cu
Sn
Total Weight
(g)
CAS #
7440-21-3
7631-86-9
90598-46-2
7440-50-8
7439-89-6
7439-92-1
7440-31-5
7440-22-4
7440-57-5
7440-50-8
Substance
Mass (g)
0.00201
0.01996
0.01075
0.01785
0.00055
0.00076
0.00004
0.00002
0.00050
0.00995
Material
Analysis
Weight
(%)
100%
65%
35%
97%
3%
92.5%
5%
2.5%
100%
100%
7440-31-5
0.00235
100%
% of Total
Weight
3.1%
30.8%
16.6%
27.6%
0.8%
1.2%
0.06%
0.03%
0.8%
15.4%
3.6%
0.06474
* Tin whisker mitigation strategy is 150 C, 1 hour anneal within 24 hours of tin plating.
260 DEGREE REFLOW PROFILE
300
60 to 150 sec
> 217 C
DEGREE CELCIUS
250
200
150
10 to 30
sec
> 255 C
60 to 180 sec
150 C to 200 C
100
50
0
TIME
This part is compliant with EU Directive 2011/65/EU (RoHS) and does not contain lead, mercury,
cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as
permitted by Annex (7).
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
April 2015
PQFN 4X6 Copper Clip
Test Definition
Room
Temperature
Humidity
Storage
Temperature
Humidity
Unbiased
Test Conditions
o
30± 2 C/60± 3%RH
55± 3C/85±3% RH
o
Temperature
Cycling
Inspection
Interval
Class 1 and
2 Products
Total
Duration
Class 1 and
2 Products
Maximum
Whisker
Length
(um)
1000 hours
4000 hours
1000 hours
4000 hours
20
500 cycles
1500 cycles
45
20
o
-40 to 55 C to 80 to 95 C,
air to air, 10 min soak,
approx 3 cycles /hours
Tin Whisker testing per JESD201, Environmental Acceptance Requirements for
Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish
Tin Whisker Results (number of failing whiskers)
Test
1000 Hours
2000 Hours
3000 Hours
4000 Hours
0/24
0/24
0/24
0/24
0/24
0/24
0/24
0/24
Test
500 Cycles
1000 Cycles
1500 Cycles
Temperature Cycling
0/24
0/24
0/24
Room Temperature
Humidity Storage
Temperature Humidity
Unbiased
The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically
disclaims any and all liability, including but not limited to consequential or indirect damages.
April 2015