PQFN 2X2 RoHS Compliance Document Contents: 1. Composition 2. Solder Reflow 3. Tin Whisker Report The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. Dec. 2014 PQFN 2X2 BOM 1 (single or dual die) Component Material Name Material Mass (g) Chip Silicon 0.00054 Encapsulant Epoxy Resin 0.00371 Lead Frame Copper 0.00511 Die Attach Silver Epoxy 0.00043 Wire Bond Lead Finish Copper Matte Tin* 0.00043 0.00021 Element Name Composition Si SiO2 Epoxy Resin Cu Fe Ag Ag Epoxy Resin Cu Sn Total Weight (g) CAS # Substance Mass (g) 7440-21-3 60676-86-0 90598-46-2 7440-50-8 7439-89-6 7440-22-4 7440-22-4 90598-46-2 7440-50-8 7440-31-5 0.00054 0.00331 0.00040 0.00488 0.00012 0.00011 0.00037 0.00006 0.00043 0.00021 Material Analysis Weight (%) 100% 89% 11% 95% 3% 2% 86% 14% 100% 100% % of Total Weight 5.2% 31.7% 3.8% 46.8% 1.2% 1.1% 3.5% 0.6% 4.1% 2.0% 0.01043 *Tin whisker mitigation strategy is 150 °C, 1 hour anneal within 24 hours of tin plating. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 1 Dec. 2014 PQFN 2X2 BOM 2 (single or dual die) Component Material Name Material Mass (g) Chip Silicon 0.00054 Encapsulant Epoxy Resin 0.00371 Lead Frame Copper 0.00511 Die Attach Silver Epoxy 0.00043 Wire Bond Copper 0.00043 Lead Finish Ni/Pd/Au 0.00021 Element Name Composition Si SiO2 Epoxy Resin Cu Fe Ag Ag Epoxy Resin Cu Ni Pd Au Total Weight (g) CAS # Substance Mass (g) 7440-21-3 60676-86-0 90598-46-2 7440-50-8 7439-89-6 7440-22-4 7440-22-4 90598-46-2 7440-50-8 7440-02-0 7440-05-3 7440-57-5 0.00054 0.00331 0.00040 0.00488 0.00012 0.00011 0.00037 0.00006 0.00043 0.00019 0.00001 0.00001 Material Analysis Weight (%) 100% 89% 11% 95% 3% 2% 86% 14% 100% 93% 6% 1% % of Total Weight 5.2% 31.7% 3.8% 46.8% 1.2% 1.1% 3.5% 0.6% 4.1% 1.8% 0.1% 0.1% 0.01043 No tin whisker mitigation strategy. This part is compliant with EU Directive 2011/65/EU (RoHS Directive) and does not contain lead, mercury, cadmium (0.01%), hexavalent chromium, PBB or PBDE in concentrations greater than 0.1%, except as permitted by Annex III. Further part complies with 3 reflow cycles per JEDEC J-STD-020 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 2 Dec. 2014 PQFN 2X2 Test Definition Room Temperature Humidity Temperature Humidity Unbiase Temperature Cycling Inspection Total Interval Class Duration 1 and 2 Class 1 and 2 Products Products Test Conditions Maximum Whisker Length (µm) 30± 2°C/60± 3% RH 1000 hours 4000 hours 20 55± 3°C/85± 3% RH 1000 hours 4000 hours 20 500 cycles 1500 cycles 45 -40 to 55°C to 80 to 95°C, air to air, 10 min soak, approx 3 Tin Whisker testing per JESD201, Environmental Acceptance Requirements for Tin Whisker Susceptibility of Tin and Tin Alloy Surface Finish Tin Whisker Results (number of failing whiskers) Test Room Temperature Humidity Storage Temperature Humidity Test Temperature Cycling 1000 Hours 2000 Hours 3000 Hours 4000 Hours 0/24 0/24 0/24 0/24 0/24 0/24 0/24 0/24 500 Cycles 1000 Cycles 1500 Cycles 0/24 0/24 0/24 The information contained in this document is provided without any warranty, either expressed or implied, and IR specifically disclaims any and all liability, including but not limited to consequential or indirect damages. 3 Dec. 2014