567JQ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WLCSP5, 1.34x0.91
CASE 567JQ
ISSUE A
SCALE 4:1
DATE 09 JUN 2015
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. COPLANARITY APPLIES TO THE SPHERICAL
CROWNS OF THE SOLDER BALLS.
4. DIMENSION b IS MEASURED AT THE MAXIMUM
BALL DIAMETER PARALLEL TO DATUM C.
A B
ÈÈ
PIN A1
REFERENCE
D
DIE COAT
(OPTIONAL)
0.10 C
2X
0.10 C
2X
A3
A2
DIM
A
A1
A2
A3
b
D
E
e
e1
TOP VIEW
A2
DETAIL A
DETAIL A
0.10 C
A
0.05 C
A1
SIDE VIEW
NOTE 3
C
SEATING
PLANE
MILLIMETERS
MIN
MAX
−−−
0.35
0.08
0.12
0.23 REF
0.025 REF
0.16
0.20
1.34 BSC
0.91 BSC
0.40 BSC
0.693 BSC
GENERIC
MARKING DIAGRAM*
XYW
5X
e
b
e1
0.05 C A B
0.03 C
C
B
A
1 2 3
BOTTOM VIEW
X
Y
W
= Specific Device Code
= Year
= Work Week
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
A1
PACKAGE
OUTLINE
5X
0.69
PITCH
0.18
0.40
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON82067F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WLCSP5, 1.34X0.91
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON82067F
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY I. MARIANO.
04 FEB 2014
A
ADDED BACKSIDE COATING OPTION AND DETAIL A. REQ. BY B. BECKER.
09 JUN 2015
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2015
June, 2015 − Rev. A
Case Outline Number:
568JQ