LTC2123 Dual 14-Bit 250Msps ADC with JESD204B Serial Outputs FEATURES n n n n n n n n n n n n DESCRIPTION 5Gbps JESD204B Interface 70dBFS SNR 90dBFS SFDR Low Power: 864mW Total Single 1.8V Supply Easy to Drive 1.5VP-P Input Range 1.25GHz Full Power Bandwidth S/H Optional Clock Divide by Two Optional Clock Duty Cycle Stabilizer Low Power Sleep and Nap Modes Serial SPI Port for Configuration 48-Lead (7mm × 7mm) QFN Package The LTC®2123 is a 2-channel simultaneous sampling 250Msps 14-bit A/D converter with serial JESD204B outputs. It is designed for digitizing high frequency, wide dynamic range signals. It is perfect for demanding communications applications with AC performance that includes 70dBFS SNR and 90dBFS spurious free dynamic range (SFDR). The 1.25GHz input bandwidth allows the ADC to under-sample high frequencies. The 5Gbps JESD204B serial interface simplifies the PCB design by minimizing the number of data lines required. The DEVCLK+ and DEVCLK– inputs can be driven differentially with sine wave, PECL, or LVDS signals. An optional clock divide-by-two circuit or clock duty cycle stabilizer maintains high performance at full speed for a wide range of clock duty cycles. APPLICATIONS n n n n n n Communications Cellular Base Stations Software Defined Radios Medical Imaging High Definition Video Test and Measurement Instrumentation L, LT, LTC, LTM, Linear Technology and the Linear logo are registered trademarks of Linear Technology Corporation. All other trademarks are the property of their respective owners. TYPICAL APPLICATION 64k Point 2-Tone FFT, fIN = 71.1MHz and 69MHz, –7dBFS, 250Msps OVDD 1.2V TO 1.9V LTC2123 50Ω 50Ω 0 CLOCK 14-BIT ADC JESD204B LOGIC CLOCK ÷ 2 OR ÷ 1 SERIALIZER PLL 5Gbps OVDD 1.2V TO 1.9V (250MHz OR 500MHz) ANALOG INPUT –20 JESD204B FPGA OR ASIC 50Ω 14-BIT ADC JESD204B LOGIC AMPLITUDE (dBFS) ANALOG INPUT –40 –60 –80 –100 50Ω –120 SERIALIZER 5Gbps 0 20 40 60 80 100 120 FREQUENCY (MHz) 2123 TA01b 2123 TA01a 2123fc For more information www.linear.com/LTC2123 1 LTC2123 ABSOLUTE MAXIMUM RATINGS PIN CONFIGURATION (Notes 1, 2) 48 47 46 45 44 43 42 41 40 39 38 37 VDD GND CS SCK SDI SDO OF + OF – GND GND VDD VDD TOP VIEW VDD 1 GND 2 AINA+ 3 AINA– 4 SENSE 5 VREF 6 VCM 7 GND 8 AINB– 9 AINB+ 10 GND 11 VDD 12 36 35 34 33 32 31 30 29 28 27 26 25 49 GND OVDD OVDD CMLOUT_A1+ CMLOUT_A1– CMLOUT_A0+ CMLOUT_A0– CMLOUT_B0+ CMLOUT_B0– CMLOUT_B1+ CMLOUT_B1– OVDD OVDD VDD 13 GND 14 DEVCLK– 15 DEVCLK+ 16 GND 17 SYSREF+ 18 SYSREF – 19 GND 20 SYNC~+ 21 SYNC~ – 22 VDD 23 VDD 24 Supply Voltages VDD, OVDD....................................................... 0.3V to 2V Analog Input Voltage AINA/B+, AINA/B –........................ –0.3V to (VDD + 0.2V) SENSE (Note 3)............................. –0.3V to (VDD + 0.2V) Digital Input Voltage DEVCLK+, DEVCLK–, SYSREF+, SYSREF –, SYNC~+, SYNC~ – (Note 3)........ –0.3V to (VDD + 0.3V) CS, SDI, SCK (Note 4) ........................... –0.3V to 3.9V SDO (Note 4) ............................................. –0.3V to 3.9V Digital Output Voltage................... –0.3V to (VDD + 0.3V) Operating Ambient Temperature Range LTC2123C................................................. 0°C to 70°C LTC2123I .............................................–40°C to 85°C Storage Temperature Range................... –65°C to 150°C UK PACKAGE 48-LEAD (7mm × 7mm) PLASTIC QFN TJMAX = 150°C, θJA = 28°C/W EXPOSED PAD (PIN 49) IS GND, MUST BE SOLDERED TO PCB ORDER INFORMATION LEAD FREE FINISH TAPE AND REEL PART MARKING* PACKAGE DESCRIPTION TEMPERATURE RANGE LTC2123CUK#PBF LTC2123CUK#TRPBF LTC2123UK 48-Lead (7mm × 7mm) Plastic QFN 0°C to 70°C LTC2123IUK#PBF LTC2123IUK#TRPBF LTC2123UK 48-Lead (7mm × 7mm) Plastic QFN –40°C to 85°C Consult LTC Marketing for parts specified with wider operating temperature ranges. *The temperature grade is identified by a label on the shipping container. Consult LTC Marketing for information on nonstandard lead based finish parts. For more information on lead free part marking, go to: http://www.linear.com/leadfree/ For more information on tape and reel specifications, go to: http://www.linear.com/tapeandreel/ CONVERTER CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) PARAMETER CONDITIONS Resolution (No Missing Codes) MIN l 14 TYP MAX UNITS Bits Integral Linearity Error Differential Analog Input (Note 6) l –5.5 ±0.85 5.5 LSB Differential Linearity Error Differential Analog Input l –0.9 ±0.25 0.9 LSB Offset Error (Note 7) l –13 ±5 13 mV Gain Error Internal Reference External Reference l –4.0 ±1.5 ±1 2.2 %FS %FS Offset Drift Full-Scale Drift Internal Reference External Reference Transition Noise 2 ±20 µV/ºC ±30 ±10 ppm/ºC ppm/ºC 1.82 LSBRMS 2123fc For more information www.linear.com/LTC2123 LTC2123 ANALOG INPUT The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS VIN Analog Input Range (AIN+ – AIN–) 1.7V < VDD < 1.9V l VIN(CM) Analog Input Common Mode (AIN+ + AIN–)/2 Differential Analog Input (Note 8) l VCM – 20mV VCM VCM + 20mV V VSENSE External Voltage Reference Applied to SENSE External Reference Mode l 1.2 1.250 1.3 V l –1 1 µA l –1 1 µA 1.5 IIN1 Analog Input Leakage Current 0 < AIN+, AIN– < VDD, No Clock IIN2 SENSE Input Leakage Current 1.23V < SENSE < 1.27V tAP Sample-and-Hold Acquisition Delay Time 1 tJITTER Sample-and-Hold Acquisition Delay Jitter 0.15 CMRR Analog Input Common Mode Rejection Ratio VP-P ns psRMS 75 BW–3dB Full-Power Bandwidth dB 1250 MHz DYNAMIC ACCURACY The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER CONDITIONS SNR Signal-to-Noise Ratio 15MHz Input 70MHz Input 140MHz Input SFDR S/(N+D) Spurious Free Dynamic Range 2nd or 3rd Harmonic 15MHz Input 70MHz Input 140MHz Input Spurious Free Dynamic Range 4th Harmonic or Higher 15MHz Input 70MHz Input 140MHz Input Signal-to-Noise Plus Distortion Ratio l TYP 67.1 70 69.7 69 dBFS dBFS dBFS 71 90 85 80 dBFS dBFS dBFS 81 98 95 85 dBFS dBFS dBFS 66.3 69.9 69.4 68.8 dBFS dBFS dBFS –90 dB l l 15MHz Input 70MHz Input 140MHz Input Crosstalk Crosstalk Between Channels MIN l Up to 250MHz Input MAX UNITS INTERNAL REFERENCE CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) PARAMETER CONDITIONS VCM Output Voltage IOUT = 0 MIN TYP MAX 0.435 • VDD – 18mV 0.435 • VDD 0.435 • VDD + 18mV VCM Output Temperature Drift ±37 VCM Output Resistance –1mA < IOUT < 1mA VREF Output Voltage IOUT = 0 1.225 1.250 ±30 VREF Output Resistance –400µA < IOUT < 1mA VREF Line Regulation 1.7V < VDD < 1.9V 7 0.6 V ppm/°C 4 VREF Output Temperature Drift UNITS Ω 1.275 V ppm/°C Ω mV/V 2123fc For more information www.linear.com/LTC2123 3 LTC2123 POWER REQUIREMENTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER MIN TYP MAX VDD Analog Supply Voltage (Note 9) CONDITIONS l 1.7 1.8 1.9 V OVDD Output Supply Voltage CML Current = 16mA, Directly Terminated (Note 8) CML Current = 16mA, AC Terminated l l 1.2 1.4 1.9 1.9 V V IVDD Analog Supply Current 480 520 mA IOVDD Output Supply Current Per Lane CML Current = 12mA l 12 13.8 mA PDISS Power Dissipation VDD = 1.8V, Excluding OVDD Power l 864 936 mW PSLEEP Sleep Mode Power 2 mW PNAP Nap Mode Power 468 mW l 11 UNITS DIGITAL INPUTS AND OUTPUTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS CLOCK INPUTS (DEVCLK+, DEVCLK–) VID Differential Input Voltage (Note 8) l 0.2 VICM Common Mode Input Voltage Internally Set Externally Set (Note 8) l 1.1 RIN Input Resistance CIN Input Capacitance (See Figure 2) V 1.2 1.5 V V 10 kΩ 2 pF DIFFERENTIAL DIGITAL INPUTS (SYNC~+, SYNC~–, SYSREF+, SYSREF–) VID Differential Input Voltage (Note 8) VICM Common Mode Input Voltage Internally Set Externally Set (Note 8) l l 0.2 1.1 V 1.2 1.5 V V RIN Input Resistance 6.7 kΩ CIN Input Capacitance 2 pF DIGITAL INPUTS (CS, SDI, SCK) VIH High Level Input Voltage VDD = 1.8V l VIL Low Level Input Voltage VDD = 1.8V l IIN Input Current VIN = 0V to 3.6V l CIN Input Capacitance (Note 8) 1.3 V –10 0.6 V 10 µA 3 pF 200 Ω SDO OUTPUT (Open-Drain Output. Requires 2k Pull-Up Resistor if SDO Is Used) ROL Logic Low Output Resistance to GND VDD = 1.8V, SDO = 0V IOH Logic High Output Leakage Current SDO = 0V to 3.6V COUT Output Capacitance (Note 8) l –10 10 4 µA pF LVDS OUTPUTS (OF+, OF–) VOD Differential Output Voltage VOS Common Mode Output Voltage 4 100Ω Differential Load l 247 350 454 l 1.125 1.25 1.375 mV V 2123fc For more information www.linear.com/LTC2123 LTC2123 DIGITAL INPUTS AND OUTPUTS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS CML Outputs VDIFF CML Differential Output Voltage Output Current Set to 10mA Output Current Set to 12mA Output Current Set to 14mA Output Current Set to 16mA 500 600 700 800 VOH Output High Level Directly-Coupled 50Ω to OVDD Directly-Coupled 100Ω Differential AC-Coupled OVDD OVDD –¼VDIFF OVDD –¼VDIFF V V V VOL Output Low Level Directly-Coupled 50Ω to OVDD Directly-Coupled 100Ω Differential AC-Coupled OVDD –½VDIFF OVDD –¾VDIFF OVDD –¾VDIFF V V V VOCM Output Common Mode Level Directly-Coupled 50Ω to OVDD Directly-Coupled 100Ω Differential AC-Coupled OVDD –¼VDIFF OVDD –½VDIFF OVDD –½VDIFF V V V ROUT Output Resistance Single-Ended Differential l 80 50 100 mVppd mVppd mVppd mVppd Ω Ω 120 TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER CONDITIONS MIN TYP MAX UNITS fS, 1/tS Sampling Frequency (Note 9) l 50 250 MHz tL 1× CLK Low Time (Note 8) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On l l 1.9 1.5 2 2 10 10 ns ns tH 1× CLK High Time (Note 8) Duty Cycle Stabilizer Off Duty Cycle Stabilizer On l l 1.9 1.5 2 2 10 10 ns ns tDCK DEVCLK Period 2X_CLK SPI Register = 0 2X_CLK SPI Register = 1 l l 4 2 20 10 ns ns Write Mode Readback Mode CSDO = 20pF, RPULLUP = 2kΩ l l 40 250 ns ns SPI Port Timing (Note 8) tSCK SCK Period tCSS CS Falling to SCK Rising Set Up Time l 5 ns tSCH SCK Rising to CS Rising Hold Time l 5 ns tSCS SCK Falling to CS Falling Set Up Time l 5 ns tDS SDI to SCK Rising Set Up Time l 5 ns tDH SCK Rising to SDI Hold Time l 5 ns tDO SCK Falling to SDO Valid Readback Mode CSDO = 20pF, RPULLUP = 2KΩ l 125 ns 1000 1000 ps ps 0.3 0.35 UI UI JESD204B Timing (Note 8) tBIT, UI High Speed Serial Bit Period 2 Lane Mode (1 Lane Per ADC) 4 Lane Mode (2 Lanes Per ADC) l l tJIT Total Jitter of CML Outputs (P-P) > 3.125Gbps Per Lane (BER = 1E-15, Note 8) ≤ 3.125Gbps Per Lane (BER = 1E-12, Note 8) l l 200 400 2123fc For more information www.linear.com/LTC2123 5 LTC2123 TIMING CHARACTERISTICS The l denotes the specifications which apply over the full operating temperature range, otherwise specifications are at TA = 25°C. (Note 5) SYMBOL PARAMETER CONDITIONS tSU_SYN SYNC~ to DEVCLK Set-Up Time (Note 8) l 0.6 tH_SYN DEVCLK to SYNC~ Hold Time (Note 8) l 0.6 tSU_SYS SYSREF to DEVCLK Set-Up Time (Note 8) l 0.2 tH_SYS DEVCLK to SYSREF Hold Time (Note 8) l 0.32 LATP2 Pipeline Latency, 2-Lane Mode (Note 10) l 13.5 13.5 tS LATP4 Pipeline Latency, 4-Lane Mode (Note 10) l 19.5 19.5 tS tDS Delay from DEVCLK to Serial Data Out (Note 8) l 0.6 tS LATSC2 Latency from SYNC~ Assertion to COMMA Out, 2-Lane Mode (Note 10) l 10 10 tS LATSC4 Latency from SYNC~ Assertion to COMMA Out, 4-Lane Mode (Note 10) l 20 20 tS LATSL2 Latency from SYNC~ De-assertion to LAS Out, 2-Lane Mode (Notes 10, 11) l 6 6 tS LATSL4 Latency from SYNC~ De-assertion to LAS Out, 4-Lane Mode (Notes 10, 11) l 12 12 tS LATOF Overflow Latency (Note 10) l 6 6 tS tD_OF1X Analog Delay of OF with 1X_CLK (Note 8) l 1.4 1.7 2.0 ns tD_OF2X Analog Delay of OF with 2X_CLK (Note 8) l 1.6 1.9 2.2 ns Note 1: Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to any Absolute Maximum Rating condition for extended periods may affect device reliability and lifetime. Note 2: All voltage values are with respect to GND (unless otherwise noted). Note 3: When these pin voltages are taken below GND or above VDD, they will be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND or above VDD without latchup. Note 4: When these pin voltages are taken below GND they will be clamped by internal diodes. When these pin voltages are taken above VDD they will not be clamped by internal diodes. This product can handle input currents of greater than 100mA below GND without latch-up. Note 5: VDD = 1.8V, fSAMPLE = 250MHz, differential DEVCLK+/DEVCLK– = 2VP-P sine wave, input range = 1.5VP-P with differential drive, unless otherwise noted. 6 MIN TYP MAX UNITS ns ns (tDCK – 0.32) ns ns Note 6: Integral nonlinearity is defined as the deviation of a code from a best fit straight line to the transfer curve. The deviation is measured from the center of the quantization band. Note 7: Offset error is the offset voltage measured from –0.5LSB when the output code flickers between 01 1111 1111 1111 and 10 0000 0000 0000. Note 8: Guaranteed by design, not subject to test. Note 9: Recommended operating conditions. Note 10: When the “2X_CLK” SPI register bit is set, the DEVCLK frequency is 2X the sampling frequency. When the “2X_CLK” bit is not set, the DEVCLK frequency is equal to the sampling frequency. Latency is measured in units of sampling periods (tS), where tS is the inverse of the sampling frequency. Note 11: When in subclass 0, the Lane Alignment Sequence (LAS) latency measurement begins at the start of the frame following the detection of SYNC~ de-assertion. When in subclasses 1 or 2 this LAS latency measurement begins at the start of the first multiframe following the detection of SYNC~ de-assertion. 2123fc For more information www.linear.com/LTC2123 LTC2123 TYPICAL PERFORMANCE CHARACTERISTICS Differential Nonlinearity (DNL) 1.00 1.5 0.75 1.0 0.50 0.5 0.0 –0.5 –0.25 –1.5 –0.75 4096 8192 12288 –1.00 16384 20000 0.00 –0.50 0 25000 0.25 –1.0 –2.0 5000 0 4096 8192 12288 0 8227 16384 2123 G03 64k Point FFT, fIN = 70.1MHz, –1dBFS, 250Msps 64k Point FFT, fIN = 141.1MHz, –1dBFS, 250Msps 0 –20 –20 –20 –60 –80 –100 AMPLITUDE (dBFS) 0 AMPLITUDE (dBFS) 0 –40 –40 –60 –80 –100 0 20 40 60 80 100 –120 120 –40 –60 –80 –100 0 20 FREQUENCY (MHz) 40 60 80 100 –120 120 –20 –20 AMPLITUDE (dBFS) –20 AMPLITUDE (dBFS) 0 –100 –40 –60 –80 40 60 80 100 120 FREQUENCY (MHz) –120 0 20 40 60 80 100 120 120 –40 –60 –80 –120 0 20 40 60 80 100 120 FREQUENCY (MHz) FREQUENCY (MHz) 2123 G07 100 –100 –100 20 80 64k Point FFT, fIN = 383.1MHz, –1dBFS, 250Msps 0 –80 60 2123 G06 64k Point FFT, fIN = 223.1MHz, –1dBFS, 250Msps –60 40 FREQUENCY (MHz) 0 0 20 2123 G05 64k Point FFT, fIN = 185.1MHz, –1dBFS, 250Msps –120 0 FREQUENCY (MHz) 2123 G04 –40 8242 2123 G02 64k Point FFT, fIN = 15.1MHz, –1dBFS, 250Msps –120 8232 8237 OUTPUT CODE OUTPUT CODE 2123 G01 AMPLITUDE (dBFS) 15000 10000 OUTPUT CODE AMPLITUDE (dBFS) AC Grounded Input Histogram 30000 COUNT DNL ERROR (LSB) INL ERROR (LSB) Integral Nonlinearity (INL) 2.0 2123 G08 2123 G09 2123fc For more information www.linear.com/LTC2123 7 LTC2123 TYPICAL PERFORMANCE CHARACTERISTICS 64k Point FFT, fIN = 567.1MHz, –1dBFS, 250Msps 64k Point FFT, fIN = 907.1MHz –1dBFS, 250Msps 0 0 –20 –20 –20 –40 –60 –80 –100 –120 AMPLITUDE (dBFS) 0 AMPLITUDE (dBFS) AMPLITUDE (dBFS) 64k Point FFT, fIN = 421.1MHz, –1dBFS, 250Msps –40 –60 –80 –100 0 20 40 60 80 100 –120 120 0 20 40 60 80 100 –120 120 dBFS 90 80 70 60 dBc 50 40 30 20 –100 100 0 –80 –70 –60 –50 –40 –30 –20 –10 120 dBc 30 20 0 –70 0 –60 65 –20 –10 0 530 510 490 4 LANE 470 IVDD (mA) SNR (dBFS) 70 –30 IVDD vs Sample Rate, fIN = 15MHz, –1dBFS 65 85 75 –40 2123 G15 70 90 80 –50 INPUT LEVEL (dBFS) 75 95 SFDR (dBFS) 40 SNR vs Input Frequency, –1dBFS, 1.5V Range, 250Msps 100 60 55 450 430 2 LANE 410 50 390 60 45 55 0 200 400 600 800 1000 INPUT FREQUENCY (MHz) 40 370 0 200 400 600 800 1000 350 40 80 120 160 200 240 280 SAMPLE RATE (Msps) INPUT FREQUENCY (MHz) 2123 G16 8 50 2123 G14 2123 G13 50 60 INPUT LEVEL (dBFS) FREQUENCY (MHz) SFDR vs Input Frequency, –1dBFS, 1.5V Range, 250Msps 120 10 10 80 100 dBFS 70 SNR (dBc AND dBFS) SFDR (dBc AND dBFS) AMPLITUDE (dBFS) –80 80 80 100 –20 –60 60 SNR vs Input Level, fIN = 70MHz, 1.5V Range, 250Msps 110 –40 40 2123 G12 120 60 20 FREQUENCY (MHz) SFDR vs Input Level, fIN = 70MHz, 1.5V Range, 250Msps 0 40 0 2123 G11 64k Point 2-Tone FFT, fIN = 71.1MHz and 69MHz, –7dBFS, 250Msps 20 –80 FREQUENCY (MHz) 2123 G10 0 –60 –100 FREQUENCY (MHz) –120 –40 2123 G17 2123 G18 2123fc For more information www.linear.com/LTC2123 LTC2123 TYPICAL PERFORMANCE CHARACTERISTICS CMLOUT Bathtub Curve, 2.5Gbps CMLOUT Eye Diagram, 2.5Gbps 1E-01 1E-05 100mV/DIV BIT ERROR RATE (BER) 1E-03 1E-07 1E-09 1E-11 1E-13 1E-15 0.0 0.2 0.4 0.6 0.8 1.0 66.7ps/DIV 2123 G20 UNIT INTERVAL (UI) 2123 G19 CMLOUT Bathtub Curve, 5Gbps CMLOUT Eye Diagram, 5Gbps 1E-01 100mV/DIV 1E-05 1E-07 1E-09 1E-11 1E-13 1E-15 0.0 0.2 0.4 0.6 0.8 1.0 33.3ps/DIV 2124 G22 UNIT INTERVAL (UI) 2123 G21 CMLOUT Eye Diagram, 5Gbps, 8in (20cm) FR4 100mV/DIV BIT ERROR RATE (BER) 1E-03 33.3ps/DIV 2123 G23 2123fc For more information www.linear.com/LTC2123 9 LTC2123 PIN FUNCTIONS VDD (Pins 1, 12, 13, 23, 24, 37, 38, 48): 1.8V Power Supply. Bypass to ground with 0.1µF ceramic capacitors. Adjacent pins can share bypass capacitor. In subclass 2 a low to high transition of SYNC~ is sampled on the rising edge of DEVCLK to reset the internal dividers and set up deterministic latency. GND (Pins 2, 8, 11, 14, 17, 20, 39, 40, 47, Exposed Pad Pin 49): Device Power Ground. The exposed pad must be soldered to the PCB ground. OVDD (Pins 25, 26, 35, 36): 1.2V to 1.9V Output Driver Supply. Bypass each pair to ground with 0.1μF ceramic capacitors. AINA+ /AINA– (Pins 3, 4): Analog Input Pair for Channel A. CMLOUT_B1–/CMLOUT_B1+ (Pins 27, 28): Current Mode Logic Output Pair for Channel B Lane 2. Must be terminated with a 50Ω resistor to OVDD, a differential 100Ω resistor to the complementary output, or AC coupled to another termination voltage. SENSE (Pin 5): Reference Programming Pin. Connecting SENSE to VDD selects the internal reference and a ±0.75V input range. An external reference between 1.2V and 1.3V applied to SENSE selects an input range of ±0.6 • VSENSE. VREF (Pin 6): Reference Voltage Output. Bypass to ground with a 2.2μF ceramic capacitor. Nominally 1.25V. VCM (Pin 7): Common Mode Bias Output. Nominally equal to 0.435 • VDD. VCM should be used to bias the common mode of the analog inputs. Bypass to ground with a 0.1μF ceramic capacitor. AINB– /AINB+ (Pins 9, 10): Analog Input Pair for Channel B. DEVCLK–/DEVCLK+ (Pins 15, 16): Device Clock Input Pair. The sample clock is derived from this differential signal. An internal DEVCLK divider may be programmed through the SPI to either divide by one or two (DEVCLK = DEVCLK+ – DEVCLK–). In divide-by-one mode, the analog signal is sampled on the falling edge of DEVCLK. In divide-by-two mode, the analog signal is sampled once every two DEVCLK cycles on the rising edge of DEVCLK. The actual sampling cycle is established at the time of the clock divider initialization. In subclass 1, a low-to-high transition of the SYSREF signal will initialize the divide-by-two circuit on the first rising edge of DEVCLK. In subclass 2, a low to high transition of the SYNC~ signal will initialize the divide-by-two circuit on the first rising edge of DEVCLK. SYSREF+/SYSREF– (Pins 18, 19): A JESD204B Subclass 1 Input Signal Pair. A low to high transition of SYSREF is sampled on the rising edge of DEVCLK to reset the internal dividers and set up deterministic latency (SYSREF = SYSREF+ – SYSREF–). SYNC~+/SYNC~– (Pins 21, 22): A JESD204B Synchronization Input Signal Pair. Used to establish initial Code Group synchronization for all three subclasses. A low level of the SYNC~ signal causes the LTC2123 to output K28.5 commas (SYNC~ = SYNC~+ – SYNC~–). 10 CMLOUT_B0–/CMLOUT_B0+ (Pins 29, 30): Current Mode Logic Output Pair for Channel B Lane 1. Must be terminated with a 50Ω resistor to OVDD, a differential 100Ω resistor to the complementary output, or AC coupled to another termination voltage. CMLOUT_A0–/CMLOUT_A0+ (Pins 31, 32): Current Mode Logic Output Pair for Channel A Lane 1. Must be terminated with a 50Ω resistor to OVDD, a differential 100Ω resistor to the complementary output, or AC coupled to another termination voltage. CMLOUT_A1–/CMLOUT_A1+ (Pins 33, 34): Current Mode Logic Output Pair for Channel A Lane 2. Must be terminated with a 50Ω resistor to OVDD, a differential 100Ω resistor to the complementary output, or AC coupled to another termination voltage. OF–/OF+ (Pins 41, 42): Over/Underflow LVDS Digital Output. OF is high when an overflow or underflow has occurred. The overflows for channel A and channel B are multiplexed together and transmitted at twice the sample frequency (OF = OF+ – OF–). SDO (Pin 43): Serial Interface Data Output. SDO is the optional serial interface data output. Data on SDO is read back from the mode control registers and can be latched on the falling edge of SCK. SDO is an open-drain N-channel MOSFET output that requires an external 2k pull-up resistor from 1.8V to 3.3V. If readback from the mode control registers is not needed, the pull-up resistor is not necessary and SDO can be left unconnected. 2123fc For more information www.linear.com/LTC2123 LTC2123 PIN FUNCTIONS SDI (Pin 44): Serial Interface Data Input. SDI is the serial interface data input. Data on SDI is clocked into the mode control registers on the rising edge of SCK. SDI can be driven with 1.8V to 3.3V logic. SCK (Pin 45): Serial Interface Clock Input. SCK is the serial interface clock input. SCK can be driven with 1.8V to 3.3V logic. CS (Pin 46): Serial Interface Chip Select Input. When CS is low, SCK is enabled for shifting data on SDI into the mode control registers. SCK must be low at the time of the falling edge of CS, for proper operation. CS can be driven with 1.8V to 3.3V logic. BLOCK DIAGRAM CS SCK SDI SDO SENSE VREF VCM SPI CONTROL LANE ALIGN SEQUENCE TEST PATTERNS LANE ALIGN SEQUENCE 1.25V REFERENCE ANALOG INPUT A ADC A DATA MAPPING ANALOG INPUT B ADC B DATA MAPPING DEVCLK CLK REC PLL AND CLK DIVIDERS SYSREF DECODE SYSREF SYSREF REC SYNC DECODE SYNC~ SCRAMBLER 1+x14+x15 SCRAMBLER 1+x14+x15 SCRAMBLER 1+x14+x15 LANE ALIGN SEQUENCE SCRAMBLER 1+x14+x15 LANE ALIGN SEQUENCE 8B/10B ENCODER CML DRIVER ALIGNMENT MONITORS 8B/10B ENCODER ALIGNMENT MONITORS 8B/10B ENCODER ALIGNMENT MONITORS 8B/10B ENCODER ALIGNMENT MONITORS CH. A, LANE 1, 2.5Gbps, 2 LANES/ADC 2.5Gbps SERIALIZER 2.5Gbps/ 5Gbps SERIALIZER 2.5Gbps/ 5Gbps SERIALIZER CML DRIVER CH. A, LANE 0, 2.5Gbps, 2 LANES/ADC OR CH. A, LANE 0, 5Gbps, 1 LANE/ADC CML DRIVER CH. B, LANE 2, 2.5Gbps, 2 LANES/ADC OR CH. B, LANE 1, 5Gbps, 1 LANE/ADC CH. B, LANE 3, 2.5Gbps, 2 LANES/ADC 2.5Gbps SERIALIZER CML DRIVER SYNC REC 2123 BD01 Figure 1. Functional Block Diagram 2123fc For more information www.linear.com/LTC2123 11 LTC2123 TIMING DIAGRAM ANALOG INPUT tAP N –1 N+14 N+13 N+1 N tCONV DEVCLK tL tH tDS LATP2 tBIT CMLOUT_A0 N-14 N-13 N-1 N N-14 N-13 N-1 N CMLOUT_B0 2123 TD01 Two-Lane Timing (One Lane Per ADC), fDEVCLK = fS tAP ANALOG N–1 INPUT N+1 N N+2 N+3 N+4 N+19 N+18 N+21 N+20 N+22 tCONV DEVCLK tDS LATP4 CMLOUT_A0 N–21 N–19 N–3 N–1 N–20 N–18 N–2 N N–21 N–19 N–3 N–1 N–20 N–18 N–2 N CMLOUT_A1 CMLOUT_B0 CMLOUT_B1 2123 TD02 Four-Lane Timing (Two Lane Per ADC), fDEVCLK = fS NOTE: DEVCLK = DEVCLK+ – DEVCLK– 12 2123fc For more information www.linear.com/LTC2123 LTC2123 TIMING DIAGRAM tAP ANALOG N–1 INPUT N+6 N N+7 N+5 N+1 DEVCLK (1X_CLK) LATOF OF CH A N-7 CH B N-7 CH A N-6 CH B N-6 tD_OF1X CH A N-5 CH A N CH B N CH A N+1 CH B N+1 2123 TD03 Over Flow (OF) Timing, 1X_CLK Mode tAP ANALOG N–1 INPUT N+6 N N+7 N+5 N+1 DEVCLK (2X_CLK) LATOF OF CH A N-7 CH B N-7 CH A N-6 CH B N-6 tD_OF2X CH A N-5 CH A N CH B N CH A N+1 CH B N+1 2123 TD04 Over-Flow (OF) Timing 2X_CLK Mode 2123fc For more information www.linear.com/LTC2123 13 LTC2123 TIMING DIAGRAM DEVCLK tH_SYS SYSREF tSU_SYS 2123 TD05 SYSREF Timing (Subclass 1) DEVCLK tH_SYN SYNC~ 2123 TD06 tSU_SYN SYNC~ Rising Edge Clock Reset Timing (Subclass 2) NOTE: DEVCLK = DEVCLK+ – DEVCLK–, OF = OF+ – OF–, SYSREF = SYSREF+ – SYSREF–, SYNC~ = SYNC~+ – SYNC~– 14 2123fc For more information www.linear.com/LTC2123 LTC2123 SPI TIMING tSCH tCSS CS tSCK SCK tSCS SDI tDS R/W A6 A5 A4 A3 A2 A1 A0 D7 D6 D5 D4 D3 D2 D1 D0 tDH SDO HIGH IMPEDANCE 2123 ST01 SPI Timing, Write Mode CS SCK SDI R/W A6 A5 A4 A3 A2 A1 A0 X X X X X X X X tDO SDO HIGH IM PEDANCE D7 D6 D5 D4 D3 D2 D1 D0 HIGH IMPEDANCE 2123 ST02 SPI Timing, Read Mode 2123fc For more information www.linear.com/LTC2123 15 LTC2123 DEFINITIONS ADC PERFORMANCE TERMS Intermodulation Distortion Aperture Delay Time If the ADC input signal consists of more than one spectral component, the ADC transfer function nonlinearity can produce intermodulation distortion (IMD) in addition to THD. IMD is the change in one sinusoidal input caused by the presence of another sinusoidal input at a different frequency. The time it takes for the input signal to be held by the sample-and-hold circuit after the sampling edge of DEVCLK (DEVCLK = DEVCLK+ - DEVCLK–). The delay measurement starts at the instant the differential DEVCLK signals cross each other. In divide-by-one mode, the analog signal is sampled on the falling edge of DEVCLK. In divide-by-two mode, the analog signal is sampled once every two DEVCLK cycles on the rising edge of DEVCLK. The actual sampling cycle is established at the time of the clock divider initialization. In subclass 1, a low to high transition of the SYSREF signal will initialize the divide-by-two circuit on the first rising edge of DEVCLK. In subclass 2, a low to high transition of the SYNC~ signal will initialize the divide-by-two circuit on the first rising edge of DEVCLK. Aperture Delay Jitter The variation in the aperture delay time from conversion to conversion. This random variation will result in noise when sampling an AC input. The signal to noise ratio due to the jitter alone will be: SNRJITTER = –20log (2π • fIN • tJITTER) Crosstalk Crosstalk is the coupling from one channel (being driven by a full-scale signal) onto the other channel (being driven by a –1dBFS signal). 16 If two pure sine waves of frequencies fa and fb are applied to the ADC input, nonlinearities in the ADC transfer function can create distortion products at the sum and difference frequencies of mfa ± nfb, where m and n = 0, 1, 2, 3, etc. For example, the 3rd order IMD terms include (2fa + fb), (fa + 2fb), (2fa – fb) and (fa – 2fb). The 3rd order IMD is defined as the ratio of the RMS value of either input tone to the RMS value of the largest 3rd order IMD product. Signal-to-Noise Plus Distortion Ratio The signal-to-noise plus distortion ratio [S/(N+D)] is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components at the ADC output. The output is band limited to frequencies above DC to below half the sampling frequency. Signal-to-Noise Ratio The signal-to-noise (SNR) is the ratio between the RMS amplitude of the fundamental input frequency and the RMS amplitude of all other frequency components, except the first five harmonics. Spurious Free Dynamic Range (SFDR) The ratio of the RMS input signal amplitude to the RMS value of the peak spurious spectral component expressed in dBc. SFDR may also be calculated relative to full scale and expressed in dBFS. 2123fc For more information www.linear.com/LTC2123 LTC2123 DEFINITIONS SERIAL INTERFACE TERMS Comma 8B/10B Encoding A special 8B/10B code-group containing the binary sequence “0011111” or “1100000”. Commas are used for frame alignment and synchronization because a comma sequence cannot be generated by any combination of normal code-groups (unless a bit error occurs). There are three special code-groups that contain a comma, K28.1, K28.5, and K28.7. A data encoding standard that encodes an 8-bit octet into a 10-bit code-group (IEEE Std 802.3-2002 part 3, clause 36.2). The resulting code-group is ideal for serial transmission for two fundamental reasons: 1) The receiver does not require a high speed clock to capture the data because the code-groups are run-length limited to ensure a sufficient number of transitions for PLL-based clock recovery 2) AC coupling is permitted because the code-groups are DC balanced (see Running Disparity). A table of the 256 possible input octets with the resulting 10-bit code-groups is documented in IEEE Std 802.3-2002 part 3 Table 36-1. A name associated with each of the 256 data code-groups is formatted “Dx.y”, with x ranging from 0 to 31 and y ranging from 0 to 7. Additionally, Table 36-2 of the standard defines a set of 12 special code-groups used as non-data characters (such as commas) with the naming format of “Kx.y”. Current Mode Logic (CML) A circuit technique used to implement differential high speed logic. CML employs differential pairs (usually ntype) to steer current into resistive loads. It is possible to implement any logic function using CML. The output swing and offset is dependent on the bias current, the load resistance, and termination resistance. This product family uses CML drivers to transmit high speed serial data to the outside world. The output driver bias current is programmable from 10mA to 16mA, generating a signal swing of approximately 250mVP-P (500mVppd) to 400mVP-P (800mVppd) across the combined internal and external termination resistance of 25Ω (50Ω source//50Ω termination) on each output (mVppd stands for mVP-P differential). For brevity, each of these three special code-groups are often called a comma, but in the strictest sense it is the first 7 bits of these code-groups that are designated a comma. DC Balanced Signal A specially conditioned signal that may be AC coupled with minimal degradation to the signal. DC balance is achieved when the average number of 1’s and 0’s are equal, eliminating the undesirable effects of DC wander on the receive side of the coupling capacitor. When 8B/10B coding is used, DC balance is achieved by following disparity rules (see Running Disparity). De-Scrambler A logic block that restores scrambled data to its prescrambled state. A self aligning de-scrambler is based on the same pseudo random bit sequence as the scrambler, so it requires no alignment signals. In this product family the scrambler is based on the 1+x14+x15 polynomial, and the self aligning process results in an initial loss of 15 bits, or one ADC sample. Deterministic Latency A predictable and repeatable delay from the input to the output of the system. JESD204B subclasses 1 and 2 employ technologies that support a predictable and repeatable pipeline delay through the system. Frame Code-Group The 10-bit output from an 8B/10B encoder or the 10-bit input to the 8B/10B decoder. The LTC2123 frame consists of two complete code-groups per lane, and constitutes one complete ADC sample per lane. 2123fc For more information www.linear.com/LTC2123 17 LTC2123 DEFINITIONS Frame Alignment Monitoring (FAM) Octet After initial frame synchronization has been established, frame alignment monitoring enables the receiver to verify that code-group alignment is maintained without the loss of data. This is done by substituting a K28.7 comma for the last code-group of the frame when certain conditions are met. The receiver uses this comma as a position marker within the frame for alignment verification. After decoding the data, the receiver replaces the K28.7 comma with the original data. The 8-bit input to an 8B/10B encoder, or the 8-bit output from an 8B/10B decoder. Initial Frame Synchronization The process of communicating frame boundary information to the receiver for alignment purposes. The receiver asserts the SYNC~ signal, causing the ADC to transmit K28.5 commas to the receiver. The receiver de-asserts the SYNC~ signal, and the ADC ceases transmission of commas according to the rules of the particular sub-class and mode of operation. The point of termination of commas in the data stream marks the frame boundary. Lane Alignment Monitoring (LAM) In JESD204B, lane alignment is attained and monitored through the use of the 8B/10B K28.3 special characters. These characters are conditionally embedded in the data stream at the end of the multiframe. The receiver uses this character as a position marker within the multiframe for lane alignment verification. After decoding the data, the receiver replaces the K28.3 character with the original data. Local Multiframe Clock (LMFC) An internal clock within each device of a JESD204B system that marks the multiframe boundary. Multiframe A group of frames intended to be of long duration compared to lane mismatches in multiple lane systems. In JESD204B the maximum multiframe length is 32 frames. There is no external multiframe clock in a JESD204B system, so the signal marking the multiframe boundaries is referred to as the local multiframe clock (LMFC). 18 Run-Length Limited (RLL) Data that has been encoded for the purpose of limiting the number of consecutive 1’s or 0’s in a data stream. This process guarantees that there will be an adequate number of transitions in the serial data for the receiver to lock onto with a phase-locked loop and recover the high speed clock. Running Disparity In order to maintain DC balance most 8B/10B code-groups have two output possibilities for each input octet. The running disparity is calculated to determine which of the two code-groups should be transmitted to maintain DC balance. The disparity of a code-group is analyzed in two segments called sub-blocks. Sub-block1 consists of the first six bits of a code-group and sub-block2 consists of the last four bits of a code-group. When a sub-block is more heavily weighted with 1’s the running disparity is positive, and when it is more heavily weighted with 0’s the running disparity is negative. When the number of 1’s and 0’s are equal in a sub-block, the running disparity remains unchanged. The polarity of the current running disparity determines which code-group should be transmitted to maintain DC balance. For a complete description of disparity rules, refer to IEEE Std 802.3-2002 part 3, Clause 36.2.4.4. Pseudo Random Bit Sequence (PRBS) A data sequence having a random nature over a finite interval. The most commonly used PRBS test patterns may be described by a polynomial in the form of 1+xm+xn and have a random nature for the length of up to 2n-1 bits, where n indicates the order of the PRBS polynomial and m plays a role in maximizing the length of the random sequence. Scrambler A logic block that applies a pseudo random bit sequence to the input octets to minimize the tonal content of the high speed serial bit stream. 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION CONVERTER OPERATION INPUT DRIVE CIRCUITS The LTC2123 is a two-channel, 14-bit 250Msps A/D converter with JESD204B high speed serial outputs. The analog inputs must be driven differentially. The DEVCLK inputs should be driven differentially for optimal performance. The high speed serial interface is capable of data rates of up to 5Gbps per lane. The overflow/underflow indicators are available as part of the high speed serial data, and optionally as low-latency double data rate LVDS outputs. A SPI port provides programmability of multiple user options. Input Filtering ANALOG INPUT The analog inputs are differential CMOS sample-and hold circuits (Figure 2). The inputs must be driven differentially around a common mode voltage set by the VCM output pin, which is nominally 0.8V. For the 1.5V input range, the inputs should swing from VCM – 0.375V to VCM + 0.375V. There should be 180° phase difference between the inputs. The two channels are simultaneously sampled by a shared clock circuit. If possible, there should be an RC lowpass filter right at the analog inputs. This lowpass filter isolates the drive circuitry from the A/D sample-and-hold switching, and also limits wide band noise from the drive circuitry. Figure 3 shows an example of an input RC filter. The RC component values should be chosen based on the application’s specific input frequency. Transformer-Coupled Circuits Figure 3 shows the analog input being driven by an RF transformer with the common mode supplied through a pair of resistors via the VCM pin. At higher input frequencies a transmission line balun transformer (Figures 4 and 5) has better balance, resulting in lower A/D distortion. 10Ω VCM 0.1µF 0.1µF 4.7Ω IN LTC2123 LTC2123 AIN+ 25Ω VDD RON 20Ω + 2pF AIN 10pF 0.1µF 4.7Ω 25Ω AIN– 2pF VDD T1: MACOM ETC1-1T RON 20Ω AIN– 2pF Figure 3. Analog Input Circuit Using a Transformer. Recommended for Input Frequencies from 5MHz to 70MHz 2pF VDD 1.2V 2123 F03 ÷1 OR ÷2 10Ω VCM 0.1µF 0.1µF 10k 10k IN DEVCLK+ LTC2123 4.7Ω AIN+ 45Ω DEVCLK– 0.1µF 0.1µF 2123 F02 Figure 2. Equivalent Input Circuit for a Single Channel 100Ω 45Ω T1: MABA T2: WBC1-1L 007159-000000 4.7Ω AIN– 2123 F04 Figure 4. Recommended Front-End Circuit for Input Frequencies from 15MHz to 150MHz 2123fc For more information www.linear.com/LTC2123 19 LTC2123 APPLICATIONS INFORMATION Amplifier Circuits VCM 0.1µF 10Ω 0.1µF LTC2123 4.7Ω IN 45Ω AIN+ 100Ω 0.1µF 45Ω 0.1µF 4.7Ω AIN– T1: MABA 007159-000000 2123 F05 Figure 5. Recommended Front-End Circuit for Input Frequencies from 150MHz to 900MHz 50Ω 50Ω Reference VCM 0.1µF LTC2123 3pF 0.1µF 4.7Ω INPUT 0.1µF 4.7Ω AIN– 3pF 2123 F06 Figure 6. Front-End Circuit Using a High Speed Differential Amplifier VREF 5Ω The LTC2123 has an internal 1.25V voltage reference. For a 1.5V input range with internal reference, connect SENSE to VDD. For a 1.5V input range with an external reference, apply a 1.25V reference voltage to SENSE (Figure 7). Device Clock (DEVCLK) Input AIN+ 3pF Figure 6 shows the analog input being driven by a high speed differential amplifier. The output of the amplifier is AC coupled to the A/D so the amplifier’s output common mode voltage can be optimally set to minimize distortion. At very high frequencies an RF gain block will often have lower distortion than a differential amplifier. If the gain block is single-ended, then a transformer circuit (Figures 3 through 5) should convert the signal to differential before driving the A/D. The A/D cannot be driven single-ended. LTC2123 1.25V The DEVCLK is used to derive the ADC sample clock, so the signal quality of the DEVCLK inputs strongly affects the A/D noise performance. The DEVCLK inputs should be treated as analog signals. Do not route them next to digital traces on the circuit board. The DEVCLK inputs are internally biased to 1.2V through 10k equivalent resistance (Figure 8). LTC2123 2.2µF VDD 1.2V SCALER/ BUFFER SENSE ADC REFERENCE 10k 10k DEVCLK+ SENSE DETECTOR 2123 F07 DEVCLK– Figure 7. Reference Circuit 2123 F08 Figure 8. Equivalent DEVCLK Input Circuit 20 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION If the common mode of the driver is within 1.1V to 1.5V, it is possible to drive the DEVCLK inputs directly. Otherwise a transformer or coupling capacitors are needed (Figures 9 and 10). The maximum (peak) voltage of the input signal should never exceed VDD +0.1V or go below –0.1V. The ADC sample clock is derived from DEVCLK. For good performance the sample clock should have a 50% (±5%) duty cycle. There are two programmable options provided in the LTC2123 that will ensure a 50% duty cycle sample clock: 1) An optional DEVCLK divide-by-two circuit is provided in the clock path to convert a 2X harmonic DEVCLK to a 50% duty cycle sample clock. The 2X_CLK option is enabled via SPI register 2, bit 2. 2) If a 2X clock is not available, the clock Duty Cycle Stabilizer (DCS) circuit may be enabled. When enabled, the DEVCLK duty cycle can vary from 30% to 70% and the duty cycle stabilizer will maintain a constant 50% internal duty cycle. The duty cycle stabilizer is enabled via SPI register 2, bit 0. If the 2X_CLK option is selected in the SPI register the Duty Cycle Stabilizer is disabled regardless of the state of the DCS_en bit. For applications where the sample rate needs to be changed quickly and a 2X clock is not available, both the 2X_CLK and the clock duty cycle stabilizer may be disabled. In this case, care should be taken to make the DEVCLK a 50% (±5%) duty cycle. Overflow Detection An overflow (OF) is detected when the analog inputs are either over-ranged or under-ranged. There are two mechanisms for reporting an OF event: 1) The OF bit is transmitted as part of the serial bit stream following the LSB of the ADC data. 2) There is a separate LVDS output pair dedicated to early indication of an OF event. The LVDS OF indicator has a latency of 6 sample clock cycles. Both ADC OF signals are multiplexed to one output pair at double data rate. The Channel A OF signal is active on the first half of the internal sample clock and the Channel B OF signal is active on the second half of the cycle. The LVDS OF indicator is output at standard LVDS levels: 3.5mA output current and a 1.25V output common mode voltage. An external 100Ω differential termination resistor is required to function properly. The termination resistor should be located as close as possible to the LVDS receiver. If used, this LVDS output pair is enabled via SPI register 2, bit 1. DATA FORMAT Table 1 shows the relationship between the analog input voltage, the digital data output bits and the overflow bit. The output data format is offset binary. LTC2123 VDD 1.2V 10k 0.1µF 10k 50Ω 0.1µF 0.1µF 100Ω 50Ω T1: MACOM ETC1-1-13 2123 F09 Figure 9. Sinusoidal DEVCLK Drive 2123fc For more information www.linear.com/LTC2123 21 LTC2123 APPLICATIONS INFORMATION LTC2123 interface stay active, allowing faster wake-up. While in nap mode the data at the output of the each ADC is forced to zero. The SPI and the serial test patterns are fully functional in nap mode, so any test pattern may be selected through the SPI. Recovering from nap mode requires at least 100 clock cycles. VDD 1.2V 0.1µF PECL OR LVDS INPUT 10k 10k DEVCLK+ JESD204B Overview 100Ω 0.1µF DEVCLK– 2123 F10 Figure 10. AC Coupled DEVCLK Drive Table 1. Output Codes vs Input Voltage AIN+ – AIN–(1.5V RANGE) OF D13-D0 (OFFSET BINARY) >0.75V +0.75V +0.749908V 1 0 0 11 1111 1111 1111 11 1111 1111 1111 11 1111 1111 1110 +0.0000915V +0.000000V –0.0000915V –0.0001831V 0 0 0 0 10 0000 0000 0001 10 0000 0000 0000 01 1111 1111 1111 01 1111 1111 1110 –0.7499084V –0.75V < –0.75V 0 0 1 00 0000 0000 0001 00 0000 0000 0000 00 0000 0000 0000 Power Down Modes The power down modes are controlled through register 1 of the SPI interface. The two ADC channels may be powered down separately, simultaneously, or the entire device may be placed in sleep mode to conserve power. The “PDA” and “PDB” SPI register bits are used to power down each ADC channel individually while keeping the internal clock and reference circuits active. “SLEEP” powers down the entire device, resulting in < 5mW power consumption. The amount of time required to recover from sleep mode depends on the size of the bypass capacitor on VREF. For the suggested value of 2.2µF, the A/D will stabilize after 0.1ms + 2500 • tp where tp is the period of the sampling clock. Nap Mode In "NAP” mode both ADC cores are powered down while the internal clock circuits, reference circuits, and serial 22 JESD204B is a JEDEC standard that defines a high speed serial interface for data converters. The advantages of serialization include the simplification of printed circuit board (PCB) layout through the reduction of traces on the PCB. JESD204B solves several problems associated with serial data transmission, such as the identification of the start of a sample and the proper alignment of data arriving on multiple lanes. JESD204B devices encode the parallel data using industry standard 8B/10B code-groups (IEEE 802.3-2002, section 3). There is an overhead requirement of 2 bits for every 8 encoded bits (8 bits are encoded to 10 bits), but encoding the ADC data prior to serialization provides certain benefits which make the transmitted data more suitable for serial transmission: These benefits include DC balance (for AC coupling), and Run-Length Limiting (providing a sufficient number of transitions for the receiver to extract the clock from the data with a Phase-Locked Loop). Figures 11 and 12 illustrate the transformation of ADC sampled data into 10-bit code groups prior to transmission. The code-groups are formed into frames and multiframes. For the LTC2123, there are two possible lane configurations: 1) Two lane mode (one lane per ADC) operating at up to 5Gbps per lane. 2) Four lane mode (two lanes per ADC) operating up to 2.5Gbps per lane. SYNC~ Signal In addition to the high speed serial lanes, JESD204B requires the use of a SYNC~ (active low) signal. The SYNC~ signal originates from the receiver and serves as a request to the LTC2123 that synchronization is required (JESD204B 4.9). 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION ADC CHANNEL A OUTPUT WORD FORMATION MSB BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 LSB BIT 2 BIT 1 BIT 0 OF BIT Ø OCTET MAPPING H G F E D C B A H G F E D C B A BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 H G B A H G B A BIT 7 BIT 6 BIT 1 BIT 0 BIT 7 BIT 6 BIT 1 BIT 0 CHANNEL A, OCTET 0 F E D C BIT 5 BIT 4 BIT 3 BIT 2 CHANNEL A, OCTET 1 F E D C BIT 5 CHANNEL A, FINAL OCTET 0 BIT 4 BIT 3 BIT 2 JESD204B PROCESSING (SCRAMBLING, SUBSTITUTIONS, ETC.) CHANNEL A, FINAL OCTET 1 8B/10B ENCODER A B C D E I F G H J A B C D E I F G H J BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 8 BIT 9 BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 8 BIT 9 CHANNEL A, 8B/10B CODE GROUP 0 (MOST SIGNIFICANT WORD) CHANNEL A, 8B/10B CODE GROUP 1 (LEAST SIGNIFICANT WORD) ONE FRAME BIT 0 OF CODE GROUP 0 IS TRANSMITTED FIRST SERIAL OUT FOR CHANNEL A (LANE 0) ADC CHANNEL B OUTPUT WORD FORMATION MSB BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 LSB BIT 2 BIT 1 BIT 0 OF BIT Ø OCTET MAPPING H G F E D C B A H G F E D C B A BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0 H G B A H G B A BIT 7 BIT 6 BIT 1 BIT 0 BIT 7 BIT 6 BIT 1 BIT 0 CHANNEL B, OCTET 0 F E D C BIT 5 BIT 4 BIT 3 BIT 2 CHANNEL B, FINAL OCTET 0 CHANNEL B, OCTET 1 F E D C BIT 5 BIT 4 BIT 3 BIT 2 JESD204B PROCESSING (SCRAMBLING, SUBSTITUTIONS, ETC.) CHANNEL B, FINAL OCTET 1 8B/10B ENCODER A B C D E I F G H J A B C D E I F G H J BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 8 BIT 9 BIT 0 BIT 1 BIT 2 BIT 3 BIT 4 BIT 5 BIT 6 BIT 7 BIT 8 BIT 9 CHANNEL B, 8B/10B CODE GROUP 0 (MOST SIGNIFICANT WORD) CHANNEL B, 8B/10B CODE GROUP 1 (LEAST SIGNIFICANT WORD) ONE FRAME BIT 0 OF CODE GROUP 0 IS TRANSMITTED FIRST 2123 F11 SERIAL OUT FOR CHANNEL B (LANE 1) Figure 11. Word Formation of Each Lane in Two-Lane Mode 2123fc For more information www.linear.com/LTC2123 23 24 C BIT 2 BIT 4 BIT 3 BIT 2 BIT 1 BIT 3 D BIT 4 E BIT 5 I BIT 6 F BIT 7 G BIT 8 H CHANNEL A, FINAL OCTET 0, EVEN SAMPLE BIT 5 For more information www.linear.com/LTC2123 BIT 1 BIT 0 BIT 2 C BIT 4 BIT 3 BIT 2 BIT 1 BIT 3 D BIT 4 E BIT 5 I BIT 6 F BIT 7 G BIT 8 H CHANNEL B, FINAL OCTET 0, EVEN SAMPLE BIT 5 BIT 0 OF CODE GROUP 0 IS TRANSMITTED FIRST G F E BIT 5 C BIT 2 OF BIT B BIT 1 A BIT 0 BIT 4 H BIT 2 BIT 1 B C BIT 2 D BIT 3 F BIT 6 F BIT 5 BIT 2 E BIT 4 BIT 1 D BIT 3 BIT 0 LSB C BIT 2 OF BIT B BIT 1 BIT 0 A BIT 4 BIT 3 BIT 2 BIT 1 Ø A BIT 7 G BIT 0 H BIT 8 BIT 2 C BIT 3 D BIT 4 E BIT 5 I BIT 6 F A BIT 7 G BIT 0 A BIT 0 BIT 8 H OCTET MAPPING J OCTET MAPPING A BIT 9 J 8B/10B ENCODER B H BIT 2 C BIT 7 G F BIT 5 BIT 11 E BIT 4 C BIT 2 BIT 8 D BIT 3 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 E BIT 4 I BIT 5 F BIT 6 G BIT 7 H BIT 2 C BIT 7 G F BIT 5 BIT 11 E BIT 4 BIT 5 BIT 4 BIT 3 D BIT 4 E BIT 5 I A H BIT 0 A BIT 7 H BIT 7 ONE FRAME BIT 9 J BIT 0 BIT 5 G F BIT 5 BIT 2 E BIT 4 BIT 1 D BIT 3 BIT 9 C BIT 2 BIT 8 B BIT 1 BIT 3 BIT 2 BIT 1 BIT 7 BIT 6 F BIT 7 G BIT 8 H A BIT 5 H BIT 0 A BIT 7 H BIT 7 BIT 6 BIT 5 BIT 4 B C BIT 2 OF BIT B BIT 1 BIT 3 BIT 2 BIT 1 Ø C BIT 2 D BIT 3 G F BIT 6 BIT 3 F BIT 5 BIT 2 E BIT 4 BIT 1 D BIT 3 BIT 0 LSB C BIT 2 OF BIT B BIT 1 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 CHANNEL B, OCTET 1, ODD SAMPLE G F E D C B BIT 6 I BIT 5 Ø A BIT 7 G BIT 0 H BIT 8 C BIT 2 D BIT 3 E BIT 4 I BIT 5 F BIT 6 A BIT 7 G BIT 0 A BIT 0 H BIT 8 CHANNEL B, 8B/10B CODE GROUP 1, ODD SAMPLE (LEAST SIGNIFICANT WORD) BIT 1 B CHANNEL B, FINAL OCTET 1, ODD SAMPLE BIT 4 E BIT 4 A BIT 0 CHANNEL A, 8B/10B CODE GROUP 1, ODD SAMPLE (LEAST SIGNIFICANT WORD) BIT 1 SERIAL OUT FOR CHANNEL B ODD SAMPLES (LANE 3) ONE FRAME BIT 9 J BIT 0 A BIT 0 BIT 6 D BIT 3 BIT 0 LSB CHANNEL A, OCTET 1, ODD SAMPLE G F E D C B BIT 6 BIT 3 CHANNEL A, FINAL OCTET 1, ODD SAMPLE BIT 4 ADC CHANNEL B OUTPUT WORD FORMATION, ODD SAMPLES BIT 10 CHANNEL B, FINAL OCTET 0, ODD SAMPLE BIT 6 A BIT 0 BIT 6 SERIAL OUT FOR CHANNEL A ODD SAMPLES (LANE 1) CHANNEL B, OCTET 0, ODD SAMPLE G F E D C B BIT 6 BIT 12 H BIT 8 CHANNEL B, 8B/10B CODE GROUP 0, ODD SAMPLE (MOST SIGNIFICANT WORD) BIT 1 B H BIT 13 MSB BIT 7 B BIT 1 BIT 7 CHANNEL A, FINAL OCTET 0, ODD SAMPLE BIT 6 BIT 0 OF CODE GROUP 0 IS TRANSMITTED FIRST BIT 0 A D BIT 3 BIT 9 ADC CHANNEL A OUTPUT WORD FORMATION, ODD SAMPLES BIT 10 CHANNEL A, OCTET 0, ODD SAMPLE G F E D C B BIT 6 BIT 12 CHANNEL A, 8B/10B CODE GROUP 0, ODD SAMPLE (MOST SIGNIFICANT WORD) BIT 1 H BIT 7 BIT 13 MSB BIT 0 OF CODE GROUP 0 IS TRANSMITTED FIRST BIT 0 JESD204B PROCESSING (SCRAMBLING, SUBSTITUTIONS, ETC.) BIT 9 8B/10B ENCODER JESD204B PROCESSING (SCRAMBLING, SUBSTITUTIONS, ETC.) CHANNEL B, 8B/10B CODE GROUP 1, EVEN SAMPLE (LEAST SIGNIFICANT WORD) BIT 1 B CHANNEL B, FINAL OCTET 1, EVEN SAMPLE BIT 5 CHANNEL B, OCTET 1, EVEN SAMPLE G F E D C B BIT 3 BIT 6 BIT 6 G I BIT 5 H BIT 4 E BIT 4 A BIT 0 CHANNEL A, 8B/10B CODE GROUP 1, EVEN SAMPLE (LEAST SIGNIFICANT WORD) BIT 1 BIT 7 BIT 7 BIT 3 Ø CHANNEL A, FINAL OCTET 1, EVEN SAMPLE BIT 5 CHANNEL A, OCTET 1, EVEN SAMPLE G F E D C B ONE FRAME BIT 9 J BIT 0 BIT 6 D BIT 3 BIT 0 LSB BIT 6 BIT 4 BIT 1 H BIT 5 BIT 2 BIT 7 BIT 6 BIT 3 SERIAL OUT FOR CHANNEL B EVEN SAMPLES (LANE 2) CHANNEL B, 8B/10B CODE GROUP 0, EVEN SAMPLE (MOST SIGNIFICANT WORD) B A A A B BIT 7 CHANNEL B, OCTET 0, EVEN SAMPLE G F E D C B C BIT 2 BIT 8 BIT 6 D BIT 3 BIT 9 H E BIT 4 H BIT 7 BIT 4 ADC CHANNEL B OUTPUT WORD FORMATION, EVEN SAMPLES BIT 10 BIT 7 F BIT 5 BIT 11 BIT 5 SERIAL OUT FOR CHANNEL A EVEN SAMPLES (LANE 0) BIT 0 BIT 12 BIT 6 ONE FRAME BIT 9 J BIT 0 BIT 1 G BIT 6 H BIT 7 BIT 13 MSB BIT 0 OF CODE GROUP 0 IS TRANSMITTED FIRST CHANNEL A, 8B/10B CODE GROUP 0, EVEN SAMPLE (MOST SIGNIFICANT WORD) B BIT 1 A BIT 0 A A B CHANNEL A, OCTET 0, EVEN SAMPLE G F E D C B C BIT 2 BIT 7 BIT 6 D BIT 3 BIT 8 H E BIT 4 BIT 9 ADC CHANNEL A OUTPUT WORD FORMATION, EVEN SAMPLES BIT 10 BIT 7 F BIT 5 BIT 11 BIT 0 BIT 12 BIT 1 G BIT 6 H BIT 7 BIT 13 MSB J 2123 F12 BIT 9 J BIT 9 LTC2123 APPLICATIONS INFORMATION Figure 12. Word Formation of Each Lane in Four-Lane Mode 2123fc LTC2123 APPLICATIONS INFORMATION Table 2. JESD204B Link Configuration Parameters JESD204B LINK CONFIGURATION PARAMETER LTC2123 DEVICE LTC2123 DEVICE VALUE FOR ONE LANE VALUE FOR TWO LANE PER ADC MODE PER ADC MODE ENCODING DID<7:0> SPI Programmable SPI Programmable Binary Value ADJCNT<3:0> NA, 0000 NA, 0000 Binary Value BID<3:0> SPI Programmable SPI Programmable Binary Value ADJDIR NA, 0 NA, 0 Binary Value PHADJ NA, 0 NA, 0 Binary Value LID–1<4:0> CMLOUT_A0 CMLOUT_A1 CMLOUT_B0 CMLOUT_B1 0_0000 NA 0_0001 NA 0_0000 0_0001 0_0010 0_0011 Binary Value Minus 1 SCR<0> SPI Programmable L –1<4:0> 0_0001 0_0011 Binary Value Minus 1 Binary Value F–1<7:0> 0000_0001 0000_0001 Binary Value Minus 1 K–1<4:0> SPI Programmable SPI Programmable Binary Value Minus 1 M–1<7:0> 0000_0001 0000_0001 Binary Value Minus 1 CS<1:0> 01 01 Binary Value N–1<4:0> 0_1101 0_1101 Binary Value Minus 1 SUBCLASSV<2:0> SPI Programmable SPI Programmable Binary Value N’–1<4:0> 0_1111 0_1111 Binary Value Minus 1 JESDV<2:0> 001 001 Binary Value S–1<4:0> 0_0000 0_0001 Binary Value Minus 1 HD 0 0 Binary Value CF<4:0> 0_0000 0_0000 Binary Value FCHK<7:0> Sum of all fields mod 256 Sum of all fields mod 256 Binary Value JESD204B Link Configuration Parameters There are 20 link configuration parameters used by JESD204B to describe the operation of the link (JESD204B 8.3, Table 20). The receiver must match the parameters of the LTC2123 in order for error free communication to take place. Table 2 summarizes the link parameters of the LTC2123. JESD204B Subclasses There are 3 subclasses of operation for JESD204B. These subclasses provide different levels of deterministic latency through the communication link. Below is a simple overview of the three subclasses: Subclass 0: No deterministic latency support is provided. There is no support for resetting and aligning critical clocks between the LTC2123 and the receiver. The LTC2123 is compliant with this subclass. Subclass 1: Deterministic latency is obtained through the addition of a SYSREF signal. The SYSREF signal provides precise timing information for aligning critical clocks in the LTC2123 and in the receiver. The low to high transition of SYSREF is sampled by the rising edge of DEVCLK, so the DEVCLK and SYSREF signals should originate from close proximity to each other and delays between these signals should closely match (Figure 13). The LTC2123 is compliant with this subclass. 2123fc For more information www.linear.com/LTC2123 25 LTC2123 APPLICATIONS INFORMATION As an added subclass 1 protection, the LTC2123 provides an optional Alert mode. Depending on the SYSREF generation circuit, there could be an erroneous or short pulse generated as the first SYSREF pulse. To avoid the possibility of alignment errors due to a compromised first pulse, an optional Alert mode may be enabled in the SPI. While in Alert mode, the LTC2123 will ignore the first SYSREF pulse, and reset critical clocks with the second pulse. The first pulse, therefore, serves to arm the system, and the second pulse resets the clocks. After a programmable number of multiframes without a second SYSREF pulse, the system is disarmed until the next SYSREF pulse is received. Figure 14 illustrates the state machine of the Subclass 1 Alert mode. Subclass 2: Deterministic latency support is obtained by sampling the low to high transition of the SYNC~ signal with the rising edge of DEVCLK. Upon detection of the SYNC~ low to high transition, the critical clocks are realigned. The LTC2123 is compatible with this subclass, but the detection resolution is always determined by the ADC DEVCLK frequency. LTC2123 5Gbps LANE 5Gbps LANE SYNC~ MATCHED DELAYS SYSREF 1 DEVICE CLOCK 1 SYSREF 2 DEVICE CLOCK 2 MATCHED DELAYS CLK GEN SYSREF 3 DEVICE CLOCK 3 FPGA or JESD204B ASIC MATCHED DELAYS LTC2123 5Gbps LANE 5Gbps LANE 2123 F13 NOTE: INTERNAL CLOCKS ARE RESET BY SYSREF ON THE RISING EDGE OF THE DEVICE CLOCK. FOR DETERMINISTIC LATENCY, EACH SYSREF/DEVICE CLOCK PAIR SHOULD HAVE MATCHED DELAYS, AND SHOULD SATISFY SETUP AND HOLD REQUIREMENTS, tSU_SYN AND tH_SYS. Figure 13. JESD204B Subclass 1 Configuration 26 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION RESET SAMPLE SYSREF NO SYSREF RECEIVED WAIT ALIGN MULTIFRAME BOUNDRY TO SYSREF; COUNT MULTIFRAMES; SAMPLE SYSREF; RESET COUNT WHEN SYSREF RECEIVED; SYSREF RECEIVED COUNT MULTIFRAMES; SAMPLE SYSREF; MULTIFRAME COUNT > R MULTIFRAME COUNT > R ALERT ALIGN MULTIFRAME COUNT ≤ R SYSREF RECEIVED AND MULTIFRAME COUNT ≤ R NO SYSREF RECEIVED 2123 F14 Figure 14. Alert Mode of Subclass 1 Code-Group Synchronization (JESD204B 5.3.3.1) Subclass 0: In order for each receiver to properly align to the received serial data, each ADC transmitter must communicate the location of the start of a code-group and the start of a frame to its receiver. When multiple ADC devices are transmitting on multiple lanes, this alignment must take place on all lanes simultaneously in order for the receivers to determine the relationship between lanes. A receiver initiates synchronization by asserting its SYNC~ signal. When multiple receivers are present, the SYNC~ signals of all receivers may be logically ORed to provide synchronization requests to all ADC devices simultaneously. The following synchronization process may be initiated by the receivers at any time: • The receiver issues a request for synchronization by asserting the SYNC~ signal (active low). • The ADC device will detect the SYNC~ assertion on the fifth rising edge of its Local Frame Clock (LFC). At the beginning of the frame following detection, each ADC transmitter will broadcast a continuous stream of K28.5 symbols in place of data. • After the receiver has successfully received at least four consecutive K28.5 symbols, it will de-assert the SYNC~ signal. • The ADC device will detect the de-assertion of the SYNC~ signal on the rising edge of its device clock, and continue to transmit K28.5 symbols on each lane until the beginning of the frame following detection. • If the Initial Lane Alignment Sequence (ILAS) is not disabled, the ADC device will reset its multiframe start marker and transmit an ILAS followed by encoded ADC data. The ILAS will be four multiframes in length. • If the ILAS is disabled, the ADC device will begin transmitting encoded ADC data on each lane. Subclass 1: • The ADC device will detect the de-assertion of the SYNC~ signal on the rising edge of its device clock, and continue to transmit K28.5 symbols on each lane until the beginning of the next multiframe. • If the ILAS is not disabled, the ADC device will transmit an ILAS at the beginning of the multiframe. The ILAS is immediately followed by encoded ADC data. • If the ILAS is disabled the ADC device will begin transmitting encoded ADC data on each lane at the beginning of the multiframe boundary. 2123fc For more information www.linear.com/LTC2123 27 LTC2123 APPLICATIONS INFORMATION Subclass 2: • Unique to this subclass, the SYNC~ signal must be de-asserted by the receiver on its multiframe boundary. The ADC device will detect the de-assertion of the SYNC~ signal on the rising edge of its device clock (for minimum latency error the ADC device clock frequency must be greater than or equal to the receiver device clock frequency). • The ADC’s Local Frame Clock (LFC) and Local Multiframe Clock (LMFC) are reset on the detected edge. • After resetting the internal clocks, the ADC device will continue to transmit K28.5 symbols on each lane for one multiframe (at least 5 frames + 9 octets) to enable the receiver to re-sync to the new clock positions. The ADC device will then cease K28.5 transmission at the next multiframe start. • If the ILAS is enabled, the ADC device will transmit an ILAS followed by encoded ADC data. • If the ILAS is not enabled the ADC device will transmit encoded ADC data on each lane. The start of a code-group will coincide with the start of each K28.5 symbol. The start of a frame will coincide with the first non-K28.5 symbol after the SYNC~ signal has been de-asserted. Initial Lane Alignment Sequence Transmission (JESD204B 5.3.3.5) When the lane alignment sequence is not disabled via the SPI, the sequence illustrated in the Lane Alignment Sequence Tables will be transmitted immediately after code-group synchronization is complete. The lane alignment sequence consists of four complete multiframes. The minimum number of octets in a multiframe is ultimately controlled by the configuration contents of the 2nd multiframe in the lane alignment sequence. The lane alignment sequence is constructed as follows: • Each multiframe in the sequence will begin with a K28.0 control character, and will end with a K28.3 symbol. • An 8-bit lane alignment counter is used to generate the octet data for the lane alignment sequence. The counter is reset by the code group synchronization process. The counter is clocked by an octet clock (character clock). • The octet of the lane alignment counter is always transmitted during the lane alignment sequence unless a control character or configuration octet is being transmitted. • The second multiframe contains the configuration data. The configuration data begins on the 3rd octet of the multiframe, and is preceded by a K28.4 symbol. • The lane alignment sequence may not be scrambled (the Scramble option in the SPI register is ignored). Note that the K28.3 symbol is the lane alignment symbol, and may be used by the receivers to align the multiframe boundary pointers in all the lanes in the link. 28 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION Lane Alignment Sequence Tables for Two Lane Mode (One Lane per ADC), 1st Multiframe Table 3a. Minimum Multiframe Length (K = 9), 1st Multiframe FRAME DESCRIPTION 0 Start of Subsequence 1 2 3 4 5 6 7 8 DATA OCTET (HEX) DATA OCTET (HEX) 8B/10B SYMBOL FRAME DESCRIPTION K28.0 0 Start of Subsequence Octet Counter 01 D1.0 Octet Counter 02 D2.0 Octet Counter 03 D3.0 Octet Counter 04 D4.0 Octet Counter 05 D5.0 Octet Counter 06 D6.0 Octet Counter 07 D7.0 Octet Counter 08 D8.0 Octet Counter 09 D9.0 Octet Counter 0A D10.0 Octet Counter 0B D11.0 Octet Counter 0C D12.0 Octet Counter 0D D13.0 Octet Counter 0E D14.0 Octet Counter 0F D15.0 Octet Counter 10 D16.0 Lane Alignment Symbol Table 3b. Maximum Multiframe Length (K = 32), 1st Multiframe 1 2 3 4 5 6 7 8 K28.3 01 D1.0 Octet Counter 02 D2.0 Octet Counter 03 D3.0 Octet Counter 04 D4.0 Octet Counter 05 D5.0 Octet Counter 06 D6.0 Octet Counter 07 D7.0 Octet Counter 08 D8.0 Octet Counter 09 D9.0 Octet Counter 0A D10.0 Octet Counter 0B D11.0 Octet Counter 0C D12.0 Octet Counter 0D D13.0 Octet Counter 0E D14.0 Octet Counter 0F D15.0 Octet Counter 10 D16.0 Octet Counter 11 D17.0 29 30 31 … 28 … 27 … 26 K28.0 Octet Counter … 25 8B/10B SYMBOL Octet Counter 32 D18.1 Octet Counter 33 D19.1 Octet Counter 34 D20.1 Octet Counter 35 D21.1 Octet Counter 36 D22.1 Octet Counter 37 D23.1 Octet Counter 38 D24.1 Octet Counter 39 D25.1 Octet Counter 3A D26.1 Octet Counter 3B D27.1 Octet Counter 3C D28.1 Octet Counter 3D D29.1 Octet Counter 3E D30.1 Lane Alignment Symbol K28.3 2123fc For more information www.linear.com/LTC2123 29 LTC2123 APPLICATIONS INFORMATION Lane Alignment Sequence Tables for Two Lane Mode (One Lane per ADC), 2nd Multiframe Table 3c. Minimum Multiframe Length (K = 9), 2nd Multiframe DATA OCTET (HEX) FRAME DESCRIPTION 0 Start of Subsequence K28.0 Start of Link Configuration K28.4 DESCRIPTION 0 Start of Subsequence K28.0 Start of Link Configuration K28.4 DID[7:0] *00 D0.0 {ADJCNT[3:0], BID[3:0]} *00 D0.0 2 {0, ADJDIR, PHADJ, LID[4:0]} 00 D0.0 {SCR, 00, L–1[4:0]} *01 D1.0 3 F–1 [7:0] 01 D1.0 {000, K–1[4:0]} *08 D8.0 M–1 [7:0] 01 D1.0 {CS[1:0]], 0, [N–1 [4:0]} 4D D13.2 {SUBCLASSV[2:0], N’–1[4:0]} 0F D15.0 {JESDV[2:0], S–1 [4:0]} 20 D0.1 4 5 6 7 8 {HD[0], 00, CF[4:0]} 00 D0.0 Reserved 00 D0.0 Reserved 00 D0.0 FCHK[7:0] 29 D9.1 Octet Counter 22 D2.1 Lane Alignment Symbol DATA OCTET (HEX) 8B/10B SYMBOL FRAME 1 Table 3d. Maximum Multiframe Length (K = 32), 2nd Multiframe 1 DID[7:0] *00 D0.0 {ADJCNT[3:0], BID[3:0]} *00 D0.0 2 {0, ADJDIR, PHADJ, LID[4:0]} *00 D0.0 {SCR[0], 00, L–1[4:0]} *01 D1.0 3 F–1 [7:0] 01 D1.0 {000, K–1[4:0]} *1F D8.0 M–1 [7:0] 01 D1.0 {CS[1:0]], 0, [N–1 [4:0]} 4D D13.2 4 5 6 7 8 K28.3 {SUBCLASSV[2:0], N’–1[4:0]} 0F D15.0 {JESDV[2:0], S–1 [4:0]} 20 D0.1 {HD[0], 00, CF[4:0]} 00 D0.0 Reserved 00 D0.0 Reserved 00 D0.0 FCHK[7:0] 40 D0.2 Octet Counter 50 D16.2 Octet Counter 51 D17.2 Field Descriptions: DID = Device ID, BID = Bank ID, LID = Lane ID, SCR = Scrambling enabled, L = Lanes per device, F = Octets per frame, K = Frames per multiframe, M = Converters per device, CS = Control bits per sample, N = Converter Resolution, N’ = Total bits per sample, S = Samples per converter per frame, HD = High density format, CF = Control words per frame per link, FCHK = Checksum of all fields (mod 256) 26 27 28 29 30 31 Octet Counter 72 D18.3 Octet Counter 73 D19.3 Octet Counter 74 D20.3 Octet Counter 75 D21.3 Octet Counter 76 D22.3 Octet Counter 77 D23.3 Octet Counter 78 D24.3 Octet Counter 79 D25.3 Octet Counter 7A D26.3 Octet Counter 7B D27.3 Octet Counter 7C D28.3 Octet Counter 7D D29.3 Octet Counter 7E Lane Alignment Symbol 30 … Configuration Field Defaults: DID = 0, BID = 0, LID = 0, SCR = 0, L = 2, F = 2, K = 9 or 32, M = 2, CS = 1, N = 14, SUBCLASSV = 0, N’ = 16, S = 1, HD = 0, CF = 0 … 25 … … X–1 Indicates that field X is affected by -1 encoding {} Indicates concatenation * Indicates a field directly programmable through the SPI 8B/10B SYMBOL D30.3 K28.3 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION Lane Alignment Sequence Tables for Two Lane Mode (One Lane per ADC), 3rd Multiframe Table 3e. Minimum Multiframe Length (K = 9), 3rd Multiframe FRAME DESCRIPTION 0 Start of Subsequence 1 2 3 4 5 6 7 8 DATA OCTET (HEX) DATA OCTET (HEX) 8B/10B SYMBOL FRAME DESCRIPTION K28.0 0 Start of Subsequence Octet Counter 25 D5.1 Octet Counter 26 D6.1 Octet Counter 27 D7.1 Octet Counter 28 D8.1 Octet Counter 29 D9.1 Octet Counter 2A D10.1 Octet Counter 2B D11.1 Octet Counter 2C D12.1 Octet Counter 2D D13.1 Octet Counter 2E D14.1 Octet Counter 2F D15.1 Octet Counter 30 D16.1 Octet Counter 31 D17.1 Octet Counter 32 D18.1 Octet Counter 33 D19.1 Octet Counter 34 D20.1 Lane Alignment Symbol Table 3f. Maximum Multiframe Length (K = 32), 3rd Multiframe 1 2 3 4 5 6 7 8 K28.3 81 D1.4 Octet Counter 82 D2.4 Octet Counter 83 D3.4 Octet Counter 84 D4.4 Octet Counter 85 D5.4 Octet Counter 86 D6.4 Octet Counter 87 D7.4 Octet Counter 88 D8.4 Octet Counter 89 D9.4 Octet Counter 8A D10.4 Octet Counter 8B D11.4 Octet Counter 8C D12.4 Octet Counter 8D D13.4 Octet Counter 8E D14.4 Octet Counter 8F D15.4 Octet Counter 90 D16.4 Octet Counter 91 D17.4 29 30 31 … 28 … 27 … 26 K28.0 Octet Counter … 25 8B/10B SYMBOL Octet Counter B2 D18.5 Octet Counter B3 D19.5 Octet Counter B4 D20.5 Octet Counter B5 D21.5 Octet Counter B6 D22.5 Octet Counter B7 D23.5 Octet Counter B8 D24.5 Octet Counter B9 D25.5 Octet Counter BA D26.5 Octet Counter BB D27.5 Octet Counter BC D28.5 Octet Counter BD D29.5 Octet Counter BE D30.5 Lane Alignment Symbol K28.3 2123fc For more information www.linear.com/LTC2123 31 LTC2123 APPLICATIONS INFORMATION Lane Alignment Sequence Tables for Two Lane Mode (One Lane per ADC), 4th Multiframe Table 3g. Minimum Multiframe Length (K = 9), 4th Multiframe FRAME DESCRIPTION 0 Start of Subsequence 1 2 3 4 5 6 7 8 DATA OCTET (HEX) DATA OCTET (HEX) 8B/10B SYMBOL FRAME DESCRIPTION K28.0 0 Start of Subsequence Octet Counter 37 D23.1 Octet Counter 38 D24.1 Octet Counter 39 D25.1 Octet Counter 3A D26.1 Octet Counter 3B D27.1 Octet Counter 3C D28.1 Octet Counter 3D D29.1 Octet Counter 3E D30.1 Octet Counter 3F D31.1 Octet Counter 40 D0.2 Octet Counter 41 D1.2 Octet Counter 42 D2.2 Octet Counter 43 D3.2 Octet Counter 44 D4.2 Octet Counter 45 D5.2 Octet Counter 46 D6.2 Lane Alignment Symbol Table 3h. Maximum Multiframe Length (K = 32), 4th Multiframe 1 2 3 4 5 6 7 8 K28.3 C1 D1.6 Octet Counter C2 D2.6 Octet Counter C3 D3.6 Octet Counter C4 D4.6 Octet Counter C5 D5.6 Octet Counter C6 D6.6 Octet Counter C7 D7.6 Octet Counter C8 D8.6 Octet Counter C9 D9.6 Octet Counter CA D10.6 Octet Counter CB D11.6 Octet Counter CC D12.6 Octet Counter CD D13.6 Octet Counter CE D14.6 Octet Counter CF D15.6 Octet Counter D0 D16.6 Octet Counter D1 D17.6 29 30 31 Octet Counter F2 D18.7 Octet Counter F3 D19.7 Octet Counter F4 D20.7 Octet Counter F5 D21.7 Octet Counter F6 D22.7 Octet Counter F7 D23.7 Octet Counter F8 D24.7 Octet Counter F9 D25.7 Octet Counter FA D26.7 Octet Counter FB D27.7 Octet Counter FC D28.7 Octet Counter FD D29.7 Octet Counter FE D30.7 Lane Alignment Symbol 32 … 28 … 27 … 26 K28.0 Octet Counter … 25 8B/10B SYMBOL K28.3 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION JESD204B Modes of Operation To avoid spectral interference from the serial data output, a SPI enabled data scrambler is added between the ADC data and the 8B/10B encoder to randomize the spectrum of the serial link. The polynomial used for the scrambler is 1+x14+x15, which is a pseudorandom pattern repeating itself every 215–1. • If the data in the last code-group of the current frame equals the data in the last code-group of the previous frame, the converter will replace the last code-group with the control character K28.7 before serialization. However, if a K28.7 symbol was already transmitted in the previous frame, the actual code-group will be transmitted. If lane alignment monitoring is enabled and it is the last code-group of a multiframe, a K28.3 will be transmitted in place of the K28.7, even if a control character was transmitted in the previous frame. The scrambled data is converted into two valid 8B/10B code-groups. The 8B/10B code-groups are then serialized and transmitted. • Upon receiving a K28.7 symbol, the receiver is required to replace it with the data decoded at the same position of the previous frame. The receiver is required to deserialize the data, decode the code-groups into octets, and descramble them back to the original octets using the self-aligning descrambler described in JESD204B 5.2. FAM mode 2 is implemented when scrambling is enabled as follows: Scramble Mode (JESD204B 5.2, Annex D) Frame Alignment Monitoring (FAM) (JESD204B 5.3.3.4, 7.3) A frame contains more than one octet or code-group, so it is necessary to periodically verify that the frame alignment of the receiver is correct. When frame alignment monitoring is not disabled via the SPI, the receiver may verify frame alignment without the loss of data. To accomplish this, predetermined data in the last code-group of the frame is substituted with the control character, K28.7. The receiver is required to detect the K28.7 character and replace it with the original data. In this way, the last octet or code-group may be verified. There are two possible frame alignment monitoring modes. FAM mode 1 is implemented when scrambling is not enabled as follows: • If the data in the last code-group of the current frame equals D28.7, the converter will replace this data with the K28.7 control character. If lane alignment monitoring is enabled and it is the last code-group of a multiframe, a K28.3 will be transmitted in place of the K28.7. • Upon receiving a K28.7 symbol, the receiver is required to replace it with D28.7. With FAM enabled the receiver is required to search for the presence of K28.7 symbols in the data stream. If two successive K28.7 symbols are detected at the same position other than the assumed end of frame, the receiver will realign its frame boundary to the new position. Lane Alignment Monitoring (LAM) (JESD204B 5.3.3.6, 7.5) When multiple lanes are present in a link, it is useful to periodically monitor the continued alignment of each lane. 2123fc For more information www.linear.com/LTC2123 33 LTC2123 APPLICATIONS INFORMATION Lane alignment symbols are inserted into the transmitted data on a substitution basis to enable the receiver to verify lane alignment without the loss of data. In this mode, predetermined data in the last code group of a multiframe is substituted with the control character K28.3. The receiver is required to detect the K28.3 character and replace it with the original data. In this way, the last code group of a multiframe may be marked and used for lane alignment. There are two possible lane alignment monitoring modes. Pattern 3: Periodic D21.5 Pattern 3 produces the maximum possible frequency for the high speed interface (a “1010” pattern). Pattern 4: PRBS15 LAM mode 1 is implemented when scrambling is not enabled as follows: Pattern 4 is a Pseudo Random Bit Sequence based on the polynomial 1+x14+x15 (the same polynomial used by the scrambler described in JESD204B 5.2). When this pattern is selected, the scrambler is internally forced on and the ADC data is forced to zero. The length of the sequence is 215–1 prior to 8B/10B encoding. • If it is the last code group of a multiframe and the data equals the data in the last code group of the previous frame, the converter will replace the current code group with the control character K28.3. When Frame and Lane Alignment Monitoring are not disabled, substitution of data will take place as described in the Frame Alignment Monitoring and Lane Alignment sections of this data sheet. • Upon receiving a K28.3 symbol, the receiver is required to replace it with the data decoded at the same position of the previous frame. Pattern 5: Repeated Lane Alignment Sequence LAM mode 2 is implemented when scrambling is enabled as follows: • If it is the last code group of a multiframe and the data of code group equals D28.3, the converter will replace this data with the K28.3 control character. • Upon receiving a K28.3 symbol, the receiver is required to replace it with D28.3. Simple and Complex Periodic Test Patterns Seven test patterns are a provided to the user for evaluation and system debug. Pattern 5 is the continuous transmission of the lane alignment sequence as described in JESD204B 5.3.3.8.2. In this mode, the following occurs: Case 1 - SYNC~ is active before entering this state • Code group synchronization is performed (K28.5 commas are transmitted in whole frames until SYNC~ is de-asserted). • The lane alignment sequence is transmitted repeatedly according to tables 3a to 3h. Case 2 - SYNC~ is not active before entering this state • At least one multiframe of K28.5 commas are transmitted. • The lane alignment sequence is transmitted repeatedly according to tables 3a to 3h. Pattern 1: Periodic K28.5 Pattern 1 contains both disparities of the K28.5 comma, and is 20 bits long. The K28.5 pattern contains a unique combination of maximum and minimum run-lengths, making this pattern useful in quickly observing the effects of Inter Symbol Interference (ISI). Pattern 2: Periodic K28.7 If scrambling is enabled, the test samples will not be scrambled. This test sequence is sensitive to a synchronization request from the receiver. If the SYNC~ signal is asserted at any time during test sample transmission, the lane alignment sequence pointer will be reset, and Case 1 will be repeated. Pattern 2 produces a square wave of the minimum possible frequency for the high speed serial interface (a “1111100000” pattern). 34 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION Pattern 6: Long Transport Layer Test Pattern Case 2 - SYNC~ is not active before entering this state Pattern 6 is a test pattern defined in JESD204B 5.1.6.3. The transmission of this test pattern over the link provides a way to verify that the data mapping of the ADC matches the receiver. To place the ADC in this test pattern transmission mode, the corresponding bit must be set in the periodic test pattern SPI register. Once this bit is set, the following occurs: • The test pattern of Tables 4a and 4b will be transmitted at the start of the next frame. Case 1 - SYNC~ is active before entering this state This test pattern is sensitive to a synchronization request from the receiver. If the SYNC~ signal is asserted at any time during test pattern transmission, the test pattern pointer will be reset, and Case 1 will be repeated. • Code-group synchronization is performed (K28.5 commas are transmitted in whole frames until SYNC~ is de-asserted). • Retransmission of the test pattern will occur at the start of each multiframe. If scrambling is enabled, the test samples will be scrambled, but the lane alignment sequence will not be scrambled. • The lane alignment sequence is transmitted (if not disabled) according to tables 3a to 3h. • The test pattern of Tables 4a and 4b are repeatedly transmitted on multiframe boundaries. Table 4a. Long Transport Layer Test Pattern Description for 1 Lane/ADC (L = 2), 2 Octets per Frame (F = 2),1 Sample/Converter/Frame Period (S = 1) Test Sample Sequence ADC 0 ADC 1 Lane 0 Octets Lane 1 Octets Frame 0 (CID + 1) 0000_0000 0000_011 0 0000_0000 0000_1000 Frame 1 (SID + 1) 0000_0000 0000_0100 0000_0000 0000_011 0 Frame i, 2 ≤ i ≤ K (MSB Set to 1) 1000_0000 0000_0000 1000_0000 0000_0000 Table 4b. Long Transport Layer Test Pattern Description for 2 Lanes/ADC, (L = 4), 2 Octets per Frame (F = 2), 2 Samples/Converter/ Frame Period (S = 2) Test Sample Sequence ADC 0 Lane 0 Octets Frame 0 (CID + 1) 0000_0000 ADC 1 Lane 1 Octets 0000_01 1 0 0000_0000 0000_0100 Lane 2 Octets 0000_0000 0000_1000 Lane 3 Octets 0000_0000 0000_1000 Frame 1 (SID + 1) 0000_0000 0000_0100 0000_0000 0000_10 1 0 0000_0000 0000_0100 0000_0000 0000_1000 Frame 2 1000_0000 0000_0000 1000_0000 0000_0000 1000_0000 0000_00 1 0 1000_0000 0000_0000 Frame 3 1000_0000 0000_0000 1000_0000 0000_0000 1000_0000 0000_0000 1000_0000 0000_001 0 Frame i, 2 ≤ i ≤ K (MSB Set to 1) 1000_0000 0000_0000 1000_0000 0000_0000 1000_0000 0000_0000 1000_0000 0000_0000 Note: CID = Converter ID, SID = Sample ID, K = F rames in Multiframe, 1 indicates the Control-Bit Position (overflow bit) 2123fc For more information www.linear.com/LTC2123 35 LTC2123 APPLICATIONS INFORMATION Pattern 7: Modified RPAT Serial Programming JESD204B clauses 4.4.1, 4.5.1 and 4.6.1 require that one of two possible patterns be supported by the transmitter for jitter compliance testing. The modified RPAT pattern is one of these two patterns, and consists of 12 specific code-groups repeated continuously (a description of the modified RPAT sequence may be found in IEEE Std. 802.32008 Annex 48A). The CS, SCK, SDI and SDO pins make up the Serial Peripheral Interface (SPI) pins that program the A/D control registers. Data is written to a register with a 16-bit serial word. Data can also be read back from a register to verify its contents. This RPAT pattern must begin with positive disparity. To gracefully force positive disparity, a ten character preamble is transmitted. The first nine characters will be the D5.6 code-group. The D5.6 preserves the previous disparity. If the disparity of these nine symbols is positive, the tenth preamble character will also be a D5.6 symbol. If the disparity is negative a reversal is forced by transmitting a D16.2 code-group as the tenth preamble character. Table 5. Modified RPAT Test Pattern Serial data transfer starts when CS is taken low. SCK must be low at the time of the falling edge of CS for proper operation (see the SPI Timing Diagrams). The data on the SDI pin is latched on the first 16 rising edges of SCK. Any SCK rising edges after the first 16 are ignored. The data transfer ends when CS is taken high again. The first bit of the 16-bit input word is the R/W bit. The next 7 bits are the address of the register (A6:A0). The final 8 bits are the register data (D7:D0). If the R/W bit is low, the serial data (D7:D0) will be written to the register set by the address bits (A6:A0). OCTET VALUE (HEX) DISPARITY D30.5 BE + D23.6 D7 – D3.1 23 + D7.2 47 + D11.3 6B + D15.4 8F + D19.5 B3 + D20.0 14 + The SDO pin is an open-drain output that pulls to ground through a 200Ω resistor. If register data is read back through SDO, an external 2kΩ pull-up resistor is required. If serial data is only written and read-back is not needed, SDO may be left floating and no pull-up resistor is needed. D30.2 5E – Table 6 shows a map of the mode control registers. D27.7 FB + D21.1 35 + Soft Reset D25.2 59 + The mode control registers should be programmed as soon as possible after the power supplies turn on and are stable. A global reset of all SPI registers to the default values may be performed by writing a 1 to Bit D7 of Address 0. After the reset is complete, Bit D7 is automatically set back to zero. This register is write-only. CODE GROUP NAME 36 If the R/W bit is high, data in the register selected by the address bits (A6:A0) will be read back on the SDO pin (see the SPI Timing Diagrams). During a read-back command the register is not updated and data on SDI is ignored. 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION Table 6. SPI Register Memory Map SPI REGISTER DESCRIPTION ADDRESS D7 Reset Soft Reset 0 Power Down 1 ADC CNTL 2 Device ID 3 Bank ID 4 Lanes (–1) 5 Frames/Multiframe (–1) 6 JESD204B Modes 7 JESD204B Subclass Modes 8 Periodic Test Patterns 9 D6 D5 D4 D3 D2 D1 D0 SLEEP NAP PDB PDA 2X_CLK OF_en DCS_en DID[7:0] BID[3:0] L–1[2:0] K–1 [4:0] LAS_dis R–1[2:0] (Alert Length) LAM_dis FAM_dis Alert TX_SYNC Reserved RST_dis SCR_en SUBCLASS[2:0] PAT[2:0] Normal Data 0 0 0 K28.5 (SYNC Comma) 0 0 1 K28.7 (…1111100000…) 0 1 0 D21.5 (…10101010…) 0 1 1 PRBS15 (1+x14+x15) 1 0 0 Lane Alignment Sequence 1 0 1 Long Transport Layer Test Pattern 1 1 0 Modified RPAT pattern 1 1 1 CML Output Magnitude 10 CML BIAS[1:0] 10mA (250mV) 0 0 12mA (300mV) 0 1 14mA (350mV) 1 0 16mA (400mV) 1 1 Note: X–1 indicates that field X is affected by –1 encoding 2123fc For more information www.linear.com/LTC2123 37 LTC2123 APPLICATIONS INFORMATION Register A0: Reset Register (Address 00h) D7 D6 D5 D4 Reset X X X This register is "Write Only”. Readback from this register will be all ones Bit 7 RESET D3 X D2 X D1 X D0 X Software Reset Bit 0 = Reset Disabled 1 = Software Reset. All SPI registers are set to default values. This bit is automatically set back to zero after the reset is complete. Bits 6-0 Unused Bits Register A1: Power Down Modes (Address 01h) D7 X Bits 7-4 D6 X Unused Bit D5 X Bit 3 SLEEP 0 = Normal Operation D4 X D3 Sleep D2 Nap D1 PDB D0 PDA D3 X D2 2X_CLK D1 OF_en D0 DCS_en 1 = Power Down Entire ADC Bit 2 NAP 0 = Normal Operation (Default Setting) 1 = Low Power Keep-Alive Mode for Both Channels Bit 1 PDB 0 = Normal Operation (Default Setting) 1 = Power Down Channel B Bit 0 PDA 0 = Normal Operation (Default Setting) 1 = Power Down Channel A Register A2: ADC Control (Address 02h) D7 X Bits 7-3 D6 X Unused Bits D5 X D4 X Bit 2 2X_CLK 0 = DEVCLK Frequency is Equal to Sample Frequency (Default Setting) 1 = DEVCLK Frequency is Twice the Sample Frequency Bit 1 OF_en 0 = LVDS Overflow Output is Disabled (Default Setting) 1 = LVDS Overflow Output is Enabled Bit 0 DCS_en 0 = Duty Cycle Stabilizer is Disabled (Default Setting) 1 = Duty Cycle Stabilizer is Enabled Register A3: Device ID (Address 03h) D7-D0 DID[7:0] Bits 7-0 DID[7:0] Device ID. Default value is 00000000 DID is defined in JESD204B 8.3. It is only used during the transmission of an initial lane alignment sequence and does not impact the configuration or functionality of the ADC 38 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION Register A4: Bank ID (Address 04h) D7 X D6 X Bits 7-4 Unused Bits Bits 3-0 BID[3:0] D5 X D4 X D3-D0 BID[3:0] Bank ID. Default value is 0000 BID is defined in JEDS204B 8.3. Provided as an extension to the DID word. It is only used during the transmission of an initial lane alignment sequence, and does not impact the configuration or functionality of the ADC or serial link Register A5: Number of Lanes –1 (Address 05h) D7 X D6 X Bits 7-3 Unused Bits Bits 2-0 L–1[2:0] D5 X D4 X D3 X D2-D0 L–1[2:0] The value of L configures the device. It is also transmitted in the Lane Alignment Sequence 001 = 2 Lanes (One Lane per ADC, Default Setting) 011 = 4 Lanes (Two Lanes per ADC) Register A6: Number of Frames Per Multiframe –1 (Address 06h) D7 X Bits 7-5 D6 X D5 X D4-D0 K–1[4:0] Unused Bits Bits 4-0 K–1[4:0] K is defined in JEDS204B 5.3.3.5. For both two and four lane operation, the minimum valid value of K is 9 (K–1 = 01000) and the maximum valid value is 32 (K–1 = 11111) Frames Per Multiframe minus 1. Default value is 01111 (16 frames per multiframe) Register A7: JESD204B Modes (Address 07h) D7 X Bits 7-6 D6 X Unused Bits D5 LAS_dis D4 LAM_dis Bit 5 LAS_dis 0 = Lane Alignment Sequence Enabled (Default Setting) 1 = Lane Alignment Sequence Disabled Bit 4 LAM_dis 0 = Lane Alignment Monitor Enabled (Default Setting) 1 = Lane Alignment Monitor Disabled Bit 3 FAM_dis 0 = Frame Alignment Monitor Enabled (Default Setting) 1 = Frame Alignment Monitor Disabled Bit 2 Reserved bit. Set to 0 D3 FAM_dis Bit 1 RST_dis 0 = In Subclass 1, SYSREF Reset of Dividers is Enabled (Default Setting) D2 0 D1 RST_dis D0 SCR_en In Subclass 2 SYNC~ Reset of Dividers is Enabled (Default Setting) 1 = In Subclass 1, SYSREF Reset of Dividers is Disabled In Subclass 2 SYNC~ Reset of Dividers is Disabled Bit 0 SCR_en 0 = Scrambling is Disabled (Default Setting) 1 = Scrambling is Enabled 2123fc For more information www.linear.com/LTC2123 39 LTC2123 APPLICATIONS INFORMATION Register A8: JESD204B Subclass Modes (Address 08h) D7-D5 R–1[2:0] R–1 [2:0] Bits 7-5 D4 D3 D2-D0 Alert TX_SYNC SUBCLASSV[2:0] Subclass 1 Alert mode De-arming Length. Default value is 000 (R = 1). Measured in Multiframe Periods Bit 4 Alert 0 = Alert Mode Disabled (Default Setting) 1 = Alert Mode Enabled Subclass 1 Alert Mode. First Pulse Arms, Second Pulse (and later) are Active Bit 3 TX_SYNC 0 = Transmitter Induced Synchronization Disabled (Default Setting) 1 = Transmitter Induced Synchronization Enabled A Multiframe of K28.5 Commas are Transmitted If Multiframe Position Changes Bits 2-0 SUBCLASSV[2:0] 000 = JESD204B Subclass 0 (Default Setting) 001 = JESD204B Subclass 1 (Deterministic Latency Obtained Using SYSYSREF) 010 = JESD204B Subclass 2 (Deterministic Latency Obtained Using SYNC~ Rising Edge) Register A9: Periodic Test Patterns (Address 09h) D7 X Bits 7-3 D6 X D5 X D4 X D3 X D2-D0 PAT[2:0] Unused Bits Bits 2-0 PAT[2:0] 000 = Normal ADC Data 001 = K28.5 Pattern (SYNC Comma) 010 = K28.7 Pattern (…1111100000…) 011 = D21.5 Pattern (…1010101010…) 100 = PRBS15 Pattern (1+x14+x15) 101 = Lane Alignment Sequence 110 = Long Transport Layer Test Pattern 111 = Modified RPAT Pattern Register A10: CML Output Magnitude (Address 0Ah) D7 X Bits 7-2 D6 X Unused Bits Bits 1-0 CMLBIAS[1:0] Affects All CML Outputs 00 = 10mA (250mV) 01 = 12mA (300mV) 10 = 14mA (350mV) 11 = 16mA (400mV) 40 D5 X D4 X D3 X D2 X D1-D0 CMLBIAS[1:0] 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION High Speed CML Output Terminations The CML outputs must be terminated in the transmission line characteristic impedance for proper functionality. In general, the transmission line impedance should be designed to provide either 50Ω single-ended or 100Ω differential. The OVDD supply voltage and the termination voltage determine the common mode output level of the CML outputs. For proper operation of the CML driver, the output common mode voltage should be greater than 1V. The directly-coupled termination mode of Figure 15 is recommended when the receiver termination voltage is within the required range. When the CML outputs are directly-coupled to the 50Ω termination resistors, the OVDD supply voltage also serves as the receiver termination voltage, and the output common mode voltage will be in the range of 125mV to 200mV lower than OVDD (depending on the programmed CML current). In this mode the OVDD voltage should be in the range of 1.125V to 1.2V (minimum), and VDD (maximum). If the serial receiver’s common mode input requirements are not compatible with the directly-coupled termination modes, the DC balanced 8B/10B encoded data will permit DC blocking capacitors as shown in Figure 17. In this AC-coupled mode, the termination voltage is determined by the receiver’s requirements. The coupling capacitors should be selected appropriately for the intended operating bit-rate, usually between 1nF to 10nF. In the AC-coupled mode, the output common mode voltage will be 250mV to 400mV below OVDD, so the OVDD supply voltage should be in the same range as the directly coupled differential case. The LTC2123 is fully AC compliant with the JESD204B specification. Table 7. Minimum OVDD Voltage DIRECTLY COUPLED MIN OVDD DIRECTLY COUPLED DIFFERENTIAL MIN OVDD AC COUPLED MIN OVDD 10mA 1.125V 1.25V 1.25V 12mA 1.15V 1.3V 1.3V 14mA 1.175V 1.35V 1.35V 16mA 1.2V 1.4V 1.4V CML CURRENT The directly-coupled differential termination of Figure 16 may be used when no termination voltage at the receiver is available as long as the input common mode voltage is within the required range. In this case, the common mode voltage will be in the range of 250mv to 400mV below OVDD. The minimum OVDD should be in the range of 1.25V to 1.4V (depending on the programmed CML current). The maximum OVDD is equal to VDD. 2123fc For more information www.linear.com/LTC2123 41 LTC2123 APPLICATIONS INFORMATION SERIAL CML DRIVER OVDD 50Ω 50Ω CMLOUT+ CMLOUT – 1.2V TO VDD (16mA BIAS) ZO SERIAL CML RECEIVER 50Ω 50Ω ZO DATA+ DATA– SPI PROGRAMMABLE 10mA TO 16mA GND 2123 F15 Figure 15. CML Termination, Directly Coupled Mode SERIAL CML DRIVER OVDD 50Ω 50Ω CMLOUT + CMLOUT – 1.4V TO VDD (16mA BIAS) SERIAL CML RECEIVER ZO ZO 100Ω DATA+ DATA– SPI PROGRAMMABLE 10mA TO 16mA GND 2123 F16 Figure 16. CML Termination, Directly Coupled Differential Mode 42 2123fc For more information www.linear.com/LTC2123 LTC2123 APPLICATIONS INFORMATION SERIAL CML DRIVER OVDD 50Ω 50Ω CMLOUT + CMLOUT – 1.4V TO VDD (16mA BIAS) SERIAL CML RECEIVER VTERM 50Ω ZO ZO DATA+ 50Ω 0.01µF 0.01µF DATA– SPI PROGRAMMABLE 10mA TO 16mA GND 2123 F17 Figure 17. CML Termination, AC-Coupled Mode GROUNDING AND BYPASSING The LTC2123 requires a printed circuit board with a clean unbroken ground plane in the first layer beneath the ADC. A multilayer board with an internal ground plane is recommended. Layout for the printed circuit board should ensure that digital and analog signal lines are separated as much as possible. In particular, care should be taken not to run any digital track alongside an analog signal track or underneath the ADC. High quality ceramic bypass capacitors should be used at the VDD, OVDD, VCM, VREF pins. Bypass capacitors must be located as close to the pins as possible. Size 0402 ceramic capacitors are recommended. The traces connecting the pins and bypass capacitors must be kept short and should be made as wide as possible. The analog inputs, clock signals, and digital outputs should not be routed next to each other. Ground fill and grounded vias should be used as barriers to isolate these signals from each other. HEAT TRANSFER Most of the heat generated by the LTC2123 is transferred from the die through the bottom-side exposed pad and package leads onto the printed circuit board. For good electrical and thermal performance, the exposed pad must be soldered to a large grounded pad on the PC board. This pad should be connected to the internal ground planes by an array of vias. 2123fc For more information www.linear.com/LTC2123 43 LTC2123 TYPICAL APPLICATIONS Silkscreen Top 44 2123fc For more information www.linear.com/LTC2123 LTC2123 TYPICAL APPLICATIONS Top Side Inner Layer 2, GND 2123fc For more information www.linear.com/LTC2123 45 LTC2123 TYPICAL APPLICATIONS Inner Layer 3 Inner Layer 4 46 2123fc For more information www.linear.com/LTC2123 LTC2123 TYPICAL APPLICATIONS Inner Layer 5, GND Bottom Layer 2123fc For more information www.linear.com/LTC2123 47 LTC2123 PACKAGE DESCRIPTION Please refer to http://www.linear.com/designtools/packaging/ for the most recent package drawings. UK Package 48-Lead Plastic QFN (7mm × 7mm) (Reference LTC DWG # 05-08-1704 Rev C) 0.70 ±0.05 5.15 ±0.05 5.50 REF 6.10 ±0.05 7.50 ±0.05 (4 SIDES) 5.15 ±0.05 PACKAGE OUTLINE 0.25 ±0.05 0.50 BSC RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED 7.00 ±0.10 (4 SIDES) 0.75 ±0.05 R = 0.10 TYP R = 0.115 TYP 47 48 0.40 ±0.10 PIN 1 TOP MARK (SEE NOTE 6) 1 2 PIN 1 CHAMFER C = 0.35 5.50 REF (4-SIDES) 5.15 ±0.10 5.15 ±0.10 0.200 REF 0.00 – 0.05 NOTE: 1. DRAWING CONFORMS TO JEDEC PACKAGE OUTLINE MO-220 VARIATION (WKKD-2) 2. DRAWING NOT TO SCALE 3. ALL DIMENSIONS ARE IN MILLIMETERS 4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.20mm ON ANY SIDE, IF PRESENT 5. EXPOSED PAD SHALL BE SOLDER PLATED 6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE TOP AND BOTTOM OF PACKAGE 48 (UK48) QFN 0406 REV C 0.25 ±0.05 0.50 BSC BOTTOM VIEW—EXPOSED PAD 2123fc For more information www.linear.com/LTC2123 LTC2123 REVISION HISTORY REV DATE DESCRIPTION A 09/14 Updated the Maximum Specification for PDISS 4 Updated the Typical Application 50 B 11/14 Updated the crosstalk specification 3 Added tDCK specification 5 Updated the tSU_SYS and tH_SYS specifications 6 C 09/15 PAGE NUMBER Updated SPI Port Timing section Updated DEVCLK and CS pins description Updated Aperture Delay Time description Revised Long Transport Layer Text Pattern description 5, 15, 36 10, 11 16 35, 37 and 40 2123fc Information furnished by Linear Technology Corporation is believed to be accurate and reliable. However, no responsibility is assumed for its use. Linear Technology Corporation makes no representation that the interconnection of its circuits as described herein will not infringe on existing patent rights. For more information www.linear.com/LTC2123 49 LTC2123 TYPICAL APPLICATION VDD C14 0.1µF C15 0.1µF C16 0.1µF C17 0.1µF C19 0.1µF C18 0.1µF VDD R18 0Ω R5 1k 4 3 C23 0.1µF C24 0.1µF R66 100Ω R7 45.3Ω VDD + R63 4.99Ω AINA AINA– C25 2.2µF R8 24.9Ω – C26 2.2µF R9 24.9Ω 4 3 C28 0.1µF VDD C29 0.1µF VDD GND AINA+ AINA– SENSE VREF VCM GND AINB– AINB+ GND VDD LTC2123 OVDD OVDD CMLOUT_A1+ CMLOUT_A1– CMLOUT_A0+ CMLOUT_A0– CMLOUT_B0+ CMLOUT_B0– CMLOUT_B1+ CMLOUT_B1– OVDD OVDD 36 35 34 33 32 31 30 29 28 27 26 25 C42–C49 1000pF C21 0.1µF CMLOUT_A1+ CMLOUT_A1– CMLOUT_A0+ CMLOUT_A0– CMLOUT_B0+ CMLOUT_B0– CMLOUT_B1+ CMLOUT_B1– OVDD HIGH SPEED CMLOUT TRACES ARE 50Ω VDD R67 100Ω R11 45.3Ω C20 0.1µF OVDD 13 14 15 16 17 18 19 20 21 22 23 24 1 2 3 4 5 6 7 8 9 10 11 12 VDD R10 45.3Ω • • AINB AINB AINB+ R64 4.99Ω T2 C27 0.1µF MABA-007159-000000 5 1 OVDD C11 2.2µF 49 48 47 46 45 44 43 42 41 40 39 38 37 R6 45.3Ω • • AINA VDD R62 4.99Ω T1 C22 0.1µF MABA-007159-000000 5 1 CS SCK SDI SDO OF+ OF– GND VDD GND CS SCK SDI SDO OF + OF – GND GND VDD VDD C13 0.1µF VDD GND DEVCLK– DEVCLK+ GND SYSREF+ SYSREF – GND SYNC~+ SYNC~ – VDD VDD C12 0.1µF R15 0Ω R65 4.99Ω DEVCLK– DEVCLK+ R13 0Ω R12 0Ω R14 100Ω R17 100Ω R15 0Ω SYNC~– SYNC~+ SYSREF– SYSREF+ 2123 TA02 RELATED PARTS PART NUMBER DESCRIPTION COMMENTS High Speed ADCs LTC2122 14-Bit, 170Msps 1.8V Dual ADC, JESD204B Serial Outputs 781mW, 70dB SNR, 90dB SFDR, 7mm × 7mm QFN Package, 6.2Gbps (Single Lane) Serial Interface LTC2158-14 14-Bit, 310Msps 1.8V Dual ADC, DDR LVDS Outputs 724mW, 68.8dB SNR, 88dB SFDR, 9mm × 9mm QFN Package LTC2157-14/ LTC2156-14/ LTC2155-14 14-Bit, 250Msps/210Msps/170Msps, 1.8V Dual ADC, DDR LVDS Outputs 650mW/616mW/567mW, 70dB SNR, 90dB SFDR, 9mm × 9mm QFN Package LTC2274 16-Bit 105Msps 3.3V Single ADC with JESD204 Serial Outputs 1300mW, 77.6dB SNR, 100dB SFDR, 6mm × 6mm QFN Package Receiver Subsystems LTM®9013 300MHz Wideband Receiver Integrated I/Q Demodulator, IF Amplifier, and Dual 14-Bit, 310Msps High Speed ADC, 15mm × 15mm BGA Package 50 Linear Technology Corporation 1630 McCarthy Blvd., Milpitas, CA 95035-7417 For more information www.linear.com/LTC2123 (408) 432-1900 ● FAX: (408) 434-0507 ● www.linear.com/LTC2123 2123fc LT 0915 REV C • PRINTED IN USA LINEAR TECHNOLOGY CORPORATION 2014