MATERIAL DECLARATION SHEET Material Number CR0805 Series Product Line Compliance Date Thick Film Chip Resistors 04-01-2003 RoHS Compliant Yes MSL 1 Construction Element (subpart) Homogeneous Material Material weight [g] 1 Ceramic Substrate Ceramic 0.00382 2 Conductor Layer Thick Film Conductor 0.000083 3 Resistive Element Thick Film Resistor 0.000043 4 5 Over Coating Marking Epoxy Epoxy 0.000067 0.0000036 End Terminal NI-CR 0.0000034 Ni Plating Nickel Sn Plating Tin Total weight 0.00014 0.00013 0.00429 No. 6 7 8 Homogeneous Material\ CASRN Materials Mass % Material Mass % of total unit wt. Substances Aluminum oxide Silicon dioxide Silver Bismuth Barium Silicon Boron Ruthenium dioxide Silver Palladium Lead Epoxy Epoxy Nickel Chromium Nickel 1344-28-1 14808-60-7 7440-22-4 7440-69-9 7440-39-3 7440-21-3 7440-42-8 12036-10-1 7440-22-4 7440-05-3 7439-92-1 29690-82-2 25085-99-8 7440-02-0 7440-47-3 7440-02-0 96% 4% 96% 1% 1% 1% 1% 25% 40% 15% 20% 100% 100% 80% 20% 100% 85.56 3.57 1.84 0.02 0.02 0.02 0.02 0.25 0.4 0.15 0.2 1.55 0.08 0.06 0.02 3.29 Tin 7440-31-5 100% 2.94 if applicable Subpart mass of total wt. (%) 89.13 1.92 1.01 1.55 0.08 0.08 3.29 2.94 This Document was updated on: 2016-2-5 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. 2. Resistive Element contains the Lead (Pb) which can be referred to RoHS Exemption 7(c)-I. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1