VLMB40L1M2-34 Datasheet

VLMB40L1M2-34
www.vishay.com
Vishay Semiconductors
Low Current SMD LED PLCC-2
FEATURES
• High efficient InGaN technology
• EIA and ICE standard package
• Compatible with IR reflow, vapor phase and
wave solder processes according to
CECC 00802 and J-STD-020
• Available in 8 mm tape reel
19225
• Preconditioning according to JEDEC® level 2a
DESCRIPTION
• ESD withstand voltage: up to 2 kV according to
JESD22-A114-B
This device has been designed to meet the increasing
demand for blue SMD LED.
• AEC-Q101 qualified
The package of the VLMB40.. is the PLCC-2.
• Material categorization: for definitions of compliance
please see www.vishay.com/doc?99912
It consists of a lead frame which is embedded in a white
thermoplast. The reflector inside this package is filled with
clear epoxy.
APPLICATIONS
PRODUCT GROUP AND PACKAGE DATA
• Telecommunication:
telephone and fax
• Automotive: backlighting in dashboards and switches
• Product group: LED
indicator
and
backlighting
in
• Backlighting for audio and video equipment
• Package: SMD PLCC-2
• Backlighting in office equipment
• Product series: low current
• Indoor and outdoor message boards
• Angle of half intensity: ± 60°
• Flat backlight for LCDs, switches, and symbols
• Illumination purposes, alternative to incandescent lamps
• General use
PARTS TABLE
PART
VLMB40L1M2-34-GS08
COLOR
Blue
LUMINOUS INTENSITY
WAVELENGTH
FORWARD VOLTAGE
at IF
at IF
at IF
(mcd)
(nm)
(V)
TECHNOLOGY
(mA)
(mA)
(mA)
MIN.
TYP.
MAX.
MIN. TYP. MAX.
MIN. TYP. MAX.
11.2
23
28
2
462
468
472
2
-
3.2
4.2
20
InGaN on
sapphire
ABSOLUTE MAXIMUM RATINGS (Tamb = 25 °C, unless otherwise specified)
VLMB40..
PARAMETER
DC forward current
Surge forward current
TEST CONDITION
SYMBOL
VALUE
UNIT
Tamb ≤ 80 °C
IF
20
mA
tp ≤ 10 μs
IFSM
0.1
A
PV
84
mW
Power dissipation
Junction temperature
Tj
110
°C
Tamb
-40 to +100
°C
Storage temperature range
Tstg
-40 to +100
°C
Thermal resistance junction / ambient Mounted on PC board (pad size > 16 mm2)
RthJA
360
K/W
Operating temperature range
Rev. 1.2, 03-Aug-15
Document Number: 83293
1
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMB40L1M2-34
www.vishay.com
Vishay Semiconductors
OPTICAL AND ELECTRICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
VLMB40.., BLUE
TEST CONDITION
PART
SYMBOL
MIN.
TYP.
MAX
UNIT
Luminous intensity
PARAMETER
IF = 2 mA
VLMB40L1M2-34
IV
11.2
23
28
mcd
Dominant wavelength
IF = 2 mA
λd
462
468
472
nm
Peak wavelength
IF = 2 mA
λp
-
464
-
nm
deg
Angle of half intensity
IF = 2 mA
ϕ
-
± 60
-
Forward voltage
IF = 20 mA
VF
-
3.2
4.2
V
Temperature coefficient of VF
IF = 10 mA
TCVF
-
-3
-
mV/K
Temperature coefficient of IV
IF = 10 mA
TCIV
-
-0.4
-
%/K
Note
• Not designed for reverse operation
LUMINOUS INTENSITY CLASSIFICATION
COLOR CLASSIFICATION
LIGHT INTENSITY (mcd)
GROUP
BLUE
OPTIONAL
MIN.
MAX.
1
11.2
14
MIN.
MAX.
2
14
18
3
462
468
1
18
22.4
4
466
472
2
22.4
28
L
M
Note
• Luminous intensity is tested at a current pulse duration of 25 ms
and an accuracy of ± 11 %.
These type numbers represent the order groups which include
only a few brightness groups. Only one group will be shipped on
each reel (there will be no mixing of two groups on each reel). In
order to ensure availability, single brightness groups are not be
orderable.
In a similar manner for colors where wavelength groups are
measured and binned, single wavelength groups will be shipped
on any one reel.
In order to ensure availability, single wavelength groups are not
be orderable.
GROUP
DOM. WAVELENGTH (nm)
Note
• Wavelengths are tested at a current pulse duration of 25 ms.
TYPICAL CHARACTERISTICS (Tamb = 25 °C, unless otherwise specified)
0°
20
10
0
0
20913
20
40
60
80
100
Fig. 1 - Forward Current vs. Ambient Temperature
Rev. 1.2, 03-Aug-15
20°
30°
40°
1.0
0.9
50°
0.8
60°
70°
0.7
120
Tamb - Ambient Temperature (°C)
10°
ϕ - Angular Displacement
IV rel - Relative Luminous Intensity
IF - Forward Current (mA)
30
80°
0.6
0.4
0.2
0
95 10319
Fig. 2 - Relative Luminous Intensity vs. Angular Displacement
Document Number: 83293
2
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMB40L1M2-34
www.vishay.com
Vishay Semiconductors
1.50
IV rel - Relative Luminous Intensity
IF - Forward Current (mA)
100
10
1
2.5
20519
3.0
3.5
4.0
0.75
0
10 20 30 40
50
60 70
80 90
Tamb - Ambient Temperature (°C)
20221
Fig. 3 - Forward Current vs. Forward Voltage
Fig. 5 - Relative Luminous Intensity vs. Ambient Temperature
3.65
100
3.60
VF - Forward Voltage (V)
IV rel - Relative Luminous Intensity
1.00
0.50
4.5
VF - Forward Voltage (V)
1.25
10
1
3.55
3.50
3.45
3.40
3.35
3.30
3.25
0.1
1
21996
10
100
IF - Forward Current (mA)
Fig. 4 - Relative Luminous Intensity vs. Forward Current
Rev. 1.2, 03-Aug-15
0
20114
10 20 30 40 50 60 70 80 90 100
Tamb - Ambient Temperature (°C)
Fig. 6 - Forward Voltage vs. Ambient Temperature
Document Number: 83293
3
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMB40L1M2-34
www.vishay.com
Vishay Semiconductors
PACKAGE DIMENSIONS in millimeters
0.9
1.75 ± 0.1
3.5 ± 0.2
0.8
A
C
technical drawings
according to DIN
specifications
2.2
2.8 ± 0.15
Pin identification
Dimensions in mm
Ø 2.4
3 + 0.15
area covered
with solderresist
Mounting Pad Layout
4
2.6 (2.8)
1.2
1.6 (1.9)
4
Dimensions: reflow and vapor phase (wave soldering)
A
Protection Diode
C
Rev. 1.2, 03-Aug-15
20242
Document Number: 83293
4
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMB40L1M2-34
www.vishay.com
Vishay Semiconductors
METHOD OF TAPING / POLARITY AND TAPE AND REEL
SMD LED (VLM.3..., VLM.4...-SERIES)
SOLDERING PROFILE
Vishay’s LEDs in SMD packages are available in an
antistatic 8 mm blister tape (in accordance with DIN IEC 40
(CO) 564) for automatic component insertion. The blister
tape is a plastic strip with impressed component cavities,
covered by a top tape.
IR Reflow Soldering Profile for Lead (Pb)-free Soldering
Preconditioning acc. to JEDEC level 2a
300
Temperature (°C)
Adhesive tape
max. 260 °C
245 °C
255 °C
240 °C
217 °C
250
200
max. 30 s
150
max. 100 s
max. 120 s
100
Blister tape
max. ramp down 6 °C/s
max. ramp up 3 °C/s
50
0
0
50
100
150
Time (s)
200
94 8670
300
max. 2 cycles allowed
19885
Component cavity
250
Fig. 9 - Vishay Lead (Pb)-free Reflow Soldering Profile
(acc. to J-STD-020)
TAPING OF VLM.3..., VLM.4...
TTW Soldering (acc. to CECC00802)
300
5s
2.2
2.0
3.5
3.1
5.75
5.25
3.6
3.4
4.0
3.6
8.3
7.7
1.85
1.65
1.6
1.4
4.1
3.9
235 °C
to 260 °C
first wave
200
lead temperature
second
full line: typical
wave
dotted line: process limits
ca. 200 K/s
150
100 °C
to 130 °C
ca. 2 K/s
100
2 K/s
0.25
4.1
3.9
Temperature (°C)
250
ca. 5 K/s
50
forced cooling
2.05
1.95
94 8668
948626-1
REEL PACKAGE DIMENSION IN MILLIMETERS
FOR SMD LEDS, TAPE OPTION GS08
(= 1500 PCS.)
2.5
1.5
50
100
150
200
250
Time (s)
Fig. 10 - Double Wave Soldering of Opto Devices (all Packages)
10.0
9.0
120°
4.5
3.5
0
0
Fig. 7 - Tape Dimensions in mm for PLCC-2
13.00
12.75
63.5
60.5
Identification
Label:
Vishay
type
group
tape code
production
code
quantity
180
178
14.4 max.
94 8665
Fig. 8 - Reel Dimensions - GS08
Rev. 1.2, 03-Aug-15
Document Number: 83293
5
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
VLMB40L1M2-34
www.vishay.com
Vishay Semiconductors
BAR CODE PRODUCT LABEL (example)
Dry box storage is recommended as soon as the aluminum
bag has been opened to prevent moisture absorption. The
following conditions should be observed, if dry boxes are
not available:
106
A
RECOMMENDED METHOD OF STORAGE
H
VISHAY
• Storage temperature 10 °C to 30 °C
37
• Storage humidity ≤ 60 % RH max.
After more than 672 h under these conditions moisture
content will be too high for reflow soldering.
B
C
D
E
F
20216
G
A. Type of component
B. Manufacturing plant
C. SEL - selection code (bin):
e.g.: R1 = code for luminous intensity group
5L = code for chrom. coordinate group
In case of moisture absorption, the devices will recover to
the former condition by drying under the following condition:
192 h at 40 °C + 5 °C / - 0 °C and < 5 % RH (dry air /
nitrogen) or
96 h at 60 °C + 5 °C and < 5 % RH for all device containers
or
24 h at 100 °C + 5 °C not suitable for reel or tubes.
An EIA JEDEC standard JESD22-A112 level 2a label is
included on all dry bags.
D. Date code year / week
E. Day code (e.g. 4: Thursday)
F. Batch no.
G. Total quantity
L E V E L
CAUTION
2a
H. Company code
This bag contains
MOISTURE –SENSITIVE DEVICES
DRY PACKING
1. Shelf life in sealed bag 12 months at <40°C and < 90% relative humidity (RH)
The reel is packed in an anti-humidity bag to protect the
devices from absorbing moisture during transportation and
storage.
2. After this bag is opened devices that will be subjected to infrared reflow,
vapor-phase reflow, or equivalent processing (peak package body temp.
260°C) must be:
a) Mounted within 672 hours at factory condition of < 30°C/60%RH or
b) Stored at <10% RH.
Aluminum bag
3. Devices require baking before mounting if:
a)
Humidity Indicator Card is >10% when read at 23°C + 5°C or
b)
2a or 2b is not met.
Label
4. If baking is required, devices may be baked for:
192 hours at 40°C + 5°C/-0°C and <5%RH (dry air/nitrogen)
or
o
or
96 hours at 60±5 Cand <5%RH
For all device containers
24 hours at 100±5°C
Not suitable for reels or tubes
Bag Seal Date: ______________________________
(If blank, see bar code label)
Note: LEVEL defined by EIA JEDEC Standard JESD22-A113
Reel
15973
FINAL PACKING
The sealed reel is packed into a cardboard box. A secondary
cardboard box is used for shipping purposes.
19786
Example of JESD22-A112 level 2a label
ESD PRECAUTION
Proper storage and handling procedures should be followed
to prevent ESD damage to the devices especially when they
are removed from the antistatic shielding bag. Electrostatic
sensitive devices warning labels are on the packaging.
VISHAY SEMICONDUCTORS STANDARD
BAR CODE LABEL
The Vishay Semiconductors standard bar code labels are
printed at final packing areas. The labels are on each
packing unit and contain Vishay Semiconductors specific
data.
Rev. 1.2, 03-Aug-15
Document Number: 83293
6
For technical questions, contact: [email protected]
THIS DOCUMENT IS SUBJECT TO CHANGE WITHOUT NOTICE. THE PRODUCTS DESCRIBED HEREIN AND THIS DOCUMENT
ARE SUBJECT TO SPECIFIC DISCLAIMERS, SET FORTH AT www.vishay.com/doc?91000
Legal Disclaimer Notice
www.vishay.com
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Disclaimer
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provided in datasheets and/or specifications may vary in different applications and performance may vary over time. All
operating parameters, including typical parameters, must be validated for each customer application by the customer’s
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Vishay Intertechnology, Inc. hereby certifies that all its products that are identified as RoHS-Compliant fulfill the
definitions and restrictions defined under Directive 2011/65/EU of The European Parliament and of the Council
of June 8, 2011 on the restriction of the use of certain hazardous substances in electrical and electronic equipment
(EEE) - recast, unless otherwise specified as non-compliant.
Please note that some Vishay documentation may still make reference to RoHS Directive 2002/95/EC. We confirm that
all the products identified as being compliant to Directive 2002/95/EC conform to Directive 2011/65/EU.
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requirements as per JEDEC JS709A standards. Please note that some Vishay documentation may still make reference
to the IEC 61249-2-21 definition. We confirm that all the products identified as being compliant to IEC 61249-2-21
conform to JEDEC JS709A standards.
Revision: 02-Oct-12
1
Document Number: 91000