MATERIAL DECLARATION SHEET Material Number CM453232 Series Product Line WOUND CHIP INDUCTOR Compliance Date January 1, 2005 RoHS Compliant No. Construction Element(subpart) 1 Core 2 Wire 3 Terminal 4 5 Adhesive Molding Compound Yes MSL Homogeneous Material Ferrite Copper wire Phosphor Bronze Adhesive Epoxy Resin Total weight 1 Homogeneous Material\ Substances Material weight [g] 0.053 0.014 0.009 0.003 0.031 Iron oxide Nickel oxide Zinc oxide Copper oxide Copper Polyurethane CASRN if applicable Materials Mass % Material Mass % of total unit wt. 29.87 4.82 9.64 3.85 12.09 0.64 7.77 Subpart mass of total wt. (%) Copper 1309-37-1 1313-99-1 1314-13-2 1317-38-0 7440-50-8 9009-54-5 7440-50-8 62 10 20 8 95 5 95 Tin 7440-31-5 Epoxy resin 25068-38-6 2-Methylimidazole 693-98-1 4,4'-Methylenedianiline 101-77-9 2.73 2.73 Carbon black 1333-86-4 Silicon dioxide 7631-86-9 Epoxy Resin 29690-82-2 Silicon dioxide 7631-86-9 Antimony trioxide 1309-64-4 5 86 3 1 1 9 15 74 1 4.23 20.85 0.28 28.18 Phenol formaldehyde resin 9003-35-4 10 2.82 48.18 12.73 8.18 0.41 0.110 This Document was updated on: 2012/6/7 Important remarks: 1. It is the responsibility of the user to verify they are accessing the latest version. Headquarters Riverside CA www.bourns.com CASRN: CAS Registry Number® is a Registered Trademark of the American Chemical Society page 1 of 1