INTERSIL ISL6114IRZA

ISL6113, ISL6114
®
Data Sheet
September 25, 2007
FN6457.0
Dual Slot PCI-E Hot Plug Controllers
Features
The ISL6113, ISL6114 both target the PCI-Express Add-in card
hot swap application. Together with a pair of N-Channel and
P-Channel MOSFETs, and two sense resistors per slot, either
provides compliant hot plug power control to any combination
of two PCI-Express X1, X4, X8 or X16 slots.
• Dual PCI-E Slot Hot Swap Power Control and Distribution
The ISL6113, ISL6114 feature a programmable current
regulated (CR) maximum level for a programmable period to
each voltage load so that both fault isolation protection and
imperviousness to electrical transients are provided.
For each +12V supply, the CR level is set by a resistor value
depending on the needs of the PCI-Express connector (X1, X4,
X8 or X16) to be powered. This resistor is a sub-ohm standard
value current sense resistor one for each slot and the voltage
across this resistor is compared to a 50mV reference providing
a nominal CR protection level adequately above the specific
slot maximum limits. The 3.3V supply uses a 15mΩ sense
resistor compared to a 50mV reference to provide 3.3A of
maximum regulated current to all connector sizes. The
3.3VAUX is internally monitored and controlled to provide a
nominal maximum of 1A of AUX output current.
The CR period for each slot is set by a separate external
capacitor on the associated CFILTER pin. Once the CR period
has expired, the IC then quickly turns off its associated FETs
thus unloading the faulted card from the supply voltage rails. A
nominal 3.3V must always be present on the AUXI pin for
proper IC bias; this should be the 3.3VAUX supply if used, if not
the AUXI pin is tied directly to the 3VMAIN supply. Both ICs
employ a card presence detection input that disables the MAIN
and AUX enabling inputs if it is not pulled low. Output voltage
monitoring with both PCI-E Reset Not and Power Good Not
reporting along with OC Fault reporting are provided. Whereas
the ISL6113 has the same GATE drive and response
characteristics as the ISL6112, the ISL6114 has a lower turn-on
GATE drive current allowing for the use of smaller
compensation capacitors and thus much faster response to
Way Overcurrent (WOC) conditions. Additionally, the ISL6114
does not turn-on with the CR feature invoked as do the
ISL6112, ISL6113 allowing for shorter CR programmed
periods.The ISL6113, ISL6114 are footprint compatible for all
common pins, but not entirely function compatible with the
ISL6112’s QFN package as there are I/O differences.
1
• Highest Accuracy External RSENSE Current Monitoring
On Main Supplies
• Programmable Current Regulation Protection Function for
X1, X4, X8, X16 Connectors
• Programmable Current Regulation Duration
• Programmable In-rush Protection During Turn-On
• Latch-off or Retry Modes After Failure
• Pb-free (RoHS Compliant)
Applications
• PCI-Express Servers
• Power Supply Distribution and Control
• Hot Swap/Electronic Breaker Circuits
• Network Hubs, Routers, Switches
• Hot Swap Bays, Cards and Modules
IF 3.3VAUX NOT
IMPLEMENTED
12VINA 12VSENSEA 12VOUTA 3VINA 3VSENSEA 3VOUTA
12VGATEA
3VGATEA
VSTBYA
VAUXA
PRSNTB
FAULTA
PRSNTA
PWRGDA
FORONA
PERSTA
FORONB
GPO_A0
AUXENA
ISL6113, ISL6114
ONA
GPO_B0
AUXENB
PERSTB
ONB
PWRGDB
GPI_A0
FAULTB
GPI_BO
VAUXB
CFILTERA
CFILTERB
GND
12VGATEB
3VGATEB
VSTBYB
12VINB 12VSENSEB 12VOUTB 3VINB 3SENSEB
3VOUTB
IF 3.3VAUX NOT
IMPLEMENTED
FIGURE 1. TYPICAL ISL6113, ISL6114 BLOCK DIAGRAM
APPLICATION IMPLEMENTATION
CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures.
1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc.
Copyright Intersil Americas Inc. 2007. All Rights Reserved
All other trademarks mentioned are the property of their respective owners.
ISL6113, ISL6114
Ordering Information
PART
NUMBER
PART
MARKING
TEMP. RANGE
(°C)
PACKAGE
(Pb-free)
-40 to +85
48 Ld 7x7 QFN
PKG. DWG. #
ISL6113IRZA
ISL6113 IRZ
L48.7x7
ISL6113IRZA-T*
ISL6113 IRZ
-40 to +85
48 Ld 7x7 QFN Tape and Reel
L48.7x7
ISL6114IRZA
ISL6114 IRZ
-40 to +85
48 Ld 7x7 QFN
L48.7x7
ISL6114IRZA-T*
ISL6114 IRZ
-40 to +85
48 Ld 7x7 QFN Tape and Reel
L48.7x7
ISL6113EVAL1Z
ISL6113 Evaluation Platform
ISL6114EVAL1Z
ISL6114 Evaluation Platform
*Please refer to TB347 for details on reel specifications.
NOTE: These Intersil Pb-free plastic packaged products employ special Pb-free material sets; molding compounds/die attach materials and 100%
matte tin plate PLUS ANNEAL - e3 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J
STD-020.
Pinout
43
PERSTA
ONB
44
GPI_B0
ONA
45
PRSNTB
AUXENA
46
PRSNTA
GND
47
AUXENB
GPO_B0
48
L/R
GPO_A0
ISL6113, ISL6114
(48 LD QFN)
TOP VIEW
42
41
40
39
38
37
FAULTA
1
36 FAULTB
CFILTERA
2
35 CFILTERB
12VGATEA
3
34 12VGATEB
GPI_A0
4
33 GND
12VINA
5
PWRGDA
6
32 12VINB
GND
31 PWRGDB
30 NC
NC
7
12VSENSEA
8
FORCE_ONA
9
28 FORCE_ONB
12VOUTA
10
27 12VOUTB
VSTBYA
11
26 VSTBYB
3VINA
12
25 3VINB
2
(EXPOSED BOTTOM PAD)
GND
(Exposed bottom pad)
13
14
15
16
17
18
19
20
21
22
23
24
3VSENSEA
3VGATEA
VAUXA
3VOUTA
GND
PERSTB
NC
NC
3VOUTB
VAUXB
3VGATEB
3VSENSEB
29 12VSENSEB
FN6457.0
September 25, 2007
ISL6113, ISL6114
Functional Block Diagram (1 Channel)
ON
AUXEN
VSTBY
12VIN
POWER-ON
RESET
250µs
VSTBY
UVLO
12VGATE
VAUX CHARGE
PUMP AND
MOSFET
VAUX
12VSENSE
12VIN
50mV
VAUX
OVERCURRENT
12V
UVLO
3VIN
50mV
ON/OFF
3VGATE
12V BIAS
ON/OFF
3VSENSE
3VIN
FAULT
100mV*
THERMAL
SHUTDOWN
ON/OFF
100mV*
PERST
ON/OFF
3V
UVLO
ON/
OFF
VSTBY
PWRGD
VAUX
PWRGD
IREF
LOGIC
12VPWRGD
12VOUT
CFILTER
10.5V
1.25V
3VPWRGD
3VOUT
2.8V
VSTBY
INT
40kΩ x 2
FORCE_ON
GND
GPI
GPO
L/R
PRSNT
BOTH A AND B SLOTS SHARE THE L/R PIN.
3
FN6457.0
September 25, 2007
ISL6113, ISL6114
Pin Descriptions
PIN
NAME
FUNCTION
9, 28
FORCE_ONA,
FORCE_ONB
Asserting a FORCE_ON input low will turn on the MAIN and AUX supplies to the respective slot in a forced mode
over riding the ON input and the UV, OC and short circuit protections on those outputs. UVLO protection for the
VSTBY input is not affected by the FORCE_ON pins. Asserting FORCE_ON will cause the PWRGD and FAULT
outputs to enter their open-drain state. This input is internally pulled high to the VAUX rail. Functionality is disabled
when PRSNT is high.
44, 43
ONA, ONB
Enable input for MAIN outputs use to enable or disable MAIN voltage supply (12V and 3.3V) outputs. Taking ONX
low after a fault resets the respective slots Main Output Fault Latch. Functionality is disabled when PRSNT is high.
45, 42
AUXENA, AUXENB 3.3VAUX Enable Input, enables the respective VAUX output. Pulling AUXENX low after a fault resets the
associated slot’s VAUX fault latch. Functionality is disabled when PRSNT is high.
5, 32
12VINA,12VINB
Connect to 12VMAIN supply and high side of sense resistor. This is one of two pins for Kelvin connection to
measure the 50mV CR Vth. An undervoltage lockout prevents the IC main supply function until 12VIN >10V. The
current regulation threshold is set by connecting a sense resistor between this pin and 12VSENSE. When the
current-limit threshold of IR = 50mV is reached, the 12VGATE pin is modulated to maintain a constant 50mV
voltage across the sense resistor and thereby a constant current is passed into the load. If the 50mV threshold is
maintained for CR duration, the circuit breaker is tripped and both GATE pins for the affected slot turn off the
switch FETs and thus turn off the supplies to the slot.
8, 29
12VSENSEA,
12VSENSEB
12V current sense low side input. This is the second of two pins for Kelvin connection to the RSENSE to measure
the 50mV CR Vth. The CR limits are set by connecting a sense resistor between each of these pins and
associated 12VIN pin.
10, 27
12VOUTA,
12VOUTB
12V output voltage monitor for UV condition. This is the voltage input downstream of the MOSFET that is delivered
to the add-in card load.
12, 25
3VINA, 3VINB
Connect to 3VMAIN supply and high side of sense resistor. This provides one of two pins for Kelvin connection to
measure the 50mV CR Vth. Undervoltage lockout (UVLO) prevents turn-on until 3VIN >2.75V. The current
regulation threshold is set by connecting a sense resistor between this pin and 3VSENSE. When the current-limit
threshold of IR = 50mV is reached, the 3VGATE pin is modulated to maintain a constant 50mV voltage across the
sense resistor and thereby a constant current is passed into the load. If the 50mV threshold is maintained for the
CR duration, the circuit breaker is tripped and both FETs for the affected slot are turned-off.
13, 24
3VSENSEA,
3VSENSEB
3.3V current sense low side input. This provides the second of two pins for Kelvin connection for measuring the
50mV CR Vth. The CR limits are set by connecting a sense resistor between each of these pins and associated
3VINX pin.
16, 21
3VOUTA,
3VOUTB
3.3V output voltage monitor for UV condition. This is the voltage downstream of the MOSFET that is delivered to
the add-in card load.
1, 36
FAULTA, FAULTB
An open drain output which is pulled low whenever the CR duration has expired due to an OC fault condition on
any of the MAIN or the AUX supplies or in the event of an IC over-temperature condition. If fault latch is invoked
by a MAIN (+12V, +3.3V) supply fault, then it is reset by pulling the faulted slot’s ON pin low. if fault was asserted
because of an OC fault condition on the slot’s AUX output then pulling the AUXEN input low will reset the latch.
Both enabling inputs must be pulled low to clear a fault condition on both the MAIN and VAUX outputs of the same
slot. Internal over-temperature limit is ~+140°C with a +20°C hysteresis.
15, 22
VAUXA, VAUXB
3.3VAUX output to the PCI-E slot: This output connects to the VAUX pin of the PCI-E connector through an internal
0.3Ω FET. This output is current regulated to ~1A.
11, 26
VSTBYA
VSTBYB
3.3V bias input for the IC, and internal VAUX switches. VVSTBY must always be present for proper IC bias, either
from a dedicated 3.3V or 3VMAIN if AUX supply not implemented.
41
L/R
Latch-off or Retry bar input. Tying this input low invokes a periodic retry to turn-on after current regulation timer
has expired on both slots. Leaving this pin open provides a latch-off operational mode after CR period has expired.
In this mode turn-on is initiated by cycling the appropriate EN input(s). This pin is internally pulled up to VSTBY.
40, 39
PRSNTA, PRSNTB
The card presence detection input disables the operation of the FORCE_ON, ON and AUXEN inputs if not pulled
to GND. If after turn-on, the PRSNT input goes high then all associated outputs (MAIN and AUX) are turned off
immediately.
6, 31
PWRGDA,
PWRGDB
4, 38
GPI_A0, GPI_B0
48, 47
GPO_A0, GPO_B0
A POWER GOOD NOT signal that is asserted low while all output voltages are compliant.
~5ms debounced user attention input, driven by either a mechanical switch or digital signal form higher level
controller.
User attention output, that can be used to drive LEDs, alarms or other attention getting devices. Open drain with
90mA pull-down capability.
4
FN6457.0
September 25, 2007
ISL6113, ISL6114
Pin Descriptions (Continued)
PIN
NAME
FUNCTION
3, 34
12VGATEA,
12VGATEB
12VMAIN gate drive output, connects to gate of an external P-Channel MOSFET. During power-up, this pin is
pulled down with a 25µA (5µA for ISL6114) current to control the dv/dt ramp of the output voltage to the slot. During
CR, the voltage on this pin is modulated to maintain a constant current into the load. During power-down or
latch-off for an overcurrent fault, this pin is pulled high to 12VIN by internal sources.
14,
23
3VGATEA,
3VGATEB
3VMAIN gate drive outputs connects to gate of an external N-Channel MOSFET. During power-up this pin charges
up with a 25µA (5µA for ISL6114) current to control the dv/dt ramp of the output voltage to the slot load. During
CRTIM the voltage on this pin is modulated to maintain a constant current into the load. During power-down or
latch-off for an overcurrent fault this pin is pulled low by internal sources.
37, 18
PERSTA,
PERSTB
2, 35
CFILTERA,
CFILTERB
17, 33,
46
GND
7,19, 20,
30
NC
100ms delayed report of MAIN supplies output voltage compliance.
A capacitor connected between each of these pins and ground sets the current regulated duration (tFILTER) for
each slot. tFILTER is the amount of time for which a slot remains in current limit before its circuit breaker is tripped.
IC ground reference
No Connect
5
FN6457.0
September 25, 2007
ISL6113, ISL6114
Absolute Maximum Ratings (Note 3)
Thermal Information
12VIN, 12VSENSE, 12VOUT . . . . . . . . . . . . . . . . . . . . . . . . +14.5V
VSTBY, 3VIN, 3VSENSE, 3VOUT . . . . . . . . . . . . . . . . . . . . . . . +7V
12VGATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 12VI
3VGATE . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.3V to 12VI
Logic I/O . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -0.5V to +5.5V
VAUX Output Current . . . . . . . . . . . . . . . . . .Short Circuit Protected
ESD Rating
Human Body Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .2kV
Machine Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .200V
Charged Device Model . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .1kV
Thermal Resistance (Typical, Notes 1, 2)
θJA (°C/W)
θJC (°C/W)
48 Ld 7x7 QFN Package . . . . . . . . . . .
27
3
Maximum Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +150°C
Maximum Storage Temperature Range . . . . . . . . . -65°C to +150°C
Pb-free reflow profile . . . . . . . . . . . . . . . . . . . . . . . . . .see link below
http://www.intersil.com/pbfree/Pb-FreeReflow.asp
Operating Conditions
12VMAIN Supply Voltage Range. . . . . . . . . . . . . . . . . . +12V ± 10%
3VMAIN Supply Voltage Range. . . . . . . . . . . . . . . . . . .+3.3V ± 10%
AUXI Supply Voltage Range . . . . . . . . . . . . . . . . . . . . .+3.3V ± 10%
Temperature Range (TA) . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C
CAUTION: Do not operate at or near the maximum ratings listed for extended periods of time. Exposure to such conditions may adversely impact product reliability and
result in failures not covered by warranty.
NOTES:
1. θJA is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
2. For θJC, the “case temp” location is the center of the exposed metal pad on the package underside.
3. All voltages are relative to GND, unless otherwise specified.
Electrical Specifications
12VIN = 12V, 3VIN and VSTBY = +3.3V, TA = TJ = -40°C to +85°C, Unless Otherwise Specified.
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
47.5
50
52.5
mV
MAIN CURRENT REGULATION
Current Limit Threshold Voltages
VTHILIMIT
VIN – VSENSE
Fast-Trip Threshold Voltages
VTHFAST
VIN – VSENSE (ISL6113)
85
100
115
mV
VIN – VSENSE (ISL6114)
140
150
160
mV
VSENSE Input Current
ISENSE
0.1
CFILTER Threshold Voltage
VFILTER
CFILTER Charging Current
Nominal Current Limit Duration =
CFILTER x 550k
IFILTER
VVIN – VVSENSE > VTHILIMIT
tFILTER
CFILTER Open
Regulated Current Level
ILIM(AUX)
From end of ISC(TRAN) to
CFILTER time-out
Output MOSFET Resistance VAUX
MOSFET
rDS(AUX)
Off-State Output Offset Voltage VAUX
µA
1.20
1.25
1.30
V
2
2.5
3
µA
10
µs
AUXILIARY CURRENT REGULATION
0.8
1
1.2
A
IDS = 375mA, TJ = +125°C
350
mΩ
VOFF(VAUX)
VAUX = Off, TJ = +125°C
40
mV
ICC12
Enabled with no load current
0.9
1.5
mA
ICC3.3
Enabled with no load current
0.1
0.2
mA
ICCSTBY
Enabled with no load current
5
6
mA
VUVLO (12V)
12VIN increasing
8
9
10
V
VUVLO (3V)
3VIN increasing
2.1
2.5
2.75
V
VUVLO(STBY)
VSTBY increasing
2.8
2.9
2.96
V
BIAS AND POWER GOOD
Supply Current
12VIN, 3VIN, VSTBY Undervoltage
Lockout Thresholds
Undervoltage Lockout Hysteresis
12VIN, 3VIN
6
VHYSUV
180
mV
FN6457.0
September 25, 2007
ISL6113, ISL6114
Electrical Specifications
12VIN = 12V, 3VIN and VSTBY = +3.3V, TA = TJ = -40°C to +85°C, Unless Otherwise Specified. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
Undervoltage Lockout Hysteresis
VSTBY
VHYSSTBY
Power-Good Undervoltage Thresholds
VUVTH(12V)
12VOUT decreasing
10.15
10.5
10.75
V
VUVTH(3V)
3VOUT decreasing
2.7
2.8
2.9
V
VUVTH(VAUX)
VAUX decreasing
2.55
2.8
3.0
V
Power-Good Detect Hysteresis
50
UNIT
VHYSPG
mV
30
mV
GATE DRIVE
12VGATE Voltage
VGATE(12V)
Max Gate Voltage when Enabled
0
ISL6113 12VGATE Sink Current
IGATE (12VSINK)
Start Cycle
17
Start Cycle
ISL6114 12VGATE Sink Current
0.55
V
25
35
µA
3
5
7
µA
35
72
12VGATE Source Current (Fault Off)
(Absolute Value)
IGATE
(12VPULLUP)
Any fault condition
(VDD – VGATE) = 2.5V
3VGATE Voltage
VGATE(3V)
Min Gate voltage when Enabled
ISL6113 3VGATE Source Current
IGATE(3VCHARGE)
Start Cycle
17
Start Cycle
Any fault condition
VGATE = 2.5V
ISL6114 3VGATE Source Current
3VGATE Sink Current (Fault Off)
IGATE(3VSINK)
12VIN - 0.55
mA
12VIN
V
25
35
µA
3
5
7
µA
80
105
mA
80
mA
ANALOG I/O DC PARAMETERS
GPO Pull-Down Current
IGPO_OUT
LOW-Level Input Voltage ON, AUXEN,
GPI, FORCE_ON, PRSNT
VIL
Output LOW Voltage FAULT, PWRGD,
GPO, PERST
VOL
0.8
V
0.4
V
5
V
40
50
kΩ
0.5
1
µA
-2
2
µA
-2
2
µA
IOL = 3mA
HIGH-Level Input Voltage ON, AUXEN, VIH
GPI,FORCE_ON, PRSNT
2.1
Internal Pull-ups to VSTBY (Note 4)
RPULLUP
12VIN, 3VIN Input Leakage Current
ILKG,OFF XVIN
Input/Output Leakage Current, ON,
AUXEN, GPO, FORCE_ON, PERST,
IIL
Off-State Leakage Current FAULT,
PWRGD, GPI
ILKG(OFF)
GPI ILKG for these two pins
measured with VAUX OFF
Output Discharge Resistance
RDIS (12V)
12VOUT = 6.0V
1400
1850
Ω
RDIS (3V)
3VOUT = 1.65V
140
180
Ω
RDIS (VAUX)
3VAUX = 1.65V
350
400
Ω
IPERST
ONX is low
30
mA
TJ increasing, each slot
140
°C
TJ decreasing, each slot
130
°C
TJ increasing, both slots
160
°C
TJ decreasing, both slots
150
°C
PERST Pull-Down Current when
Asserted.
VSTBY = +3.3V, 12VIN = OFF;
3VIN = OFF
THERMAL PROTECTION
Over-temperature Shutdown and Reset tOVER
Thresholds with Overcurrent on Slot
Over-temperature Shutdown and Reset
Thresholds, all other Conditions (all
Outputs will Latch OFF)
7
FN6457.0
September 25, 2007
ISL6113, ISL6114
Electrical Specifications
12VIN = 12V, 3VIN and VSTBY = +3.3V, TA = TJ = -40°C to +85°C, Unless Otherwise Specified. (Continued)
PARAMETER
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNIT
I/O TIMING PARAMETERS
12V Current Limit Response Time
tOFF(12V)
CGATE = 25pF
VIN – VSENSE = 140mV
1
2.1
µs
3.3V Current Limit Response Time
tOFF(3V)
CGATE = 25pF
VIN – VSENSE = 140mV
0.3
1
µs
VAUX Current Limit Response Time
tSC(TRAN)
VAUX = 0V, VSTBY = +3.3V
2.5
µs
1
µs
1
µs
Delay from MAIN Overcurrent to FAULT tPROP (12V FAULT
output
or 3V FAULT)
CFILTER = 0
VIN – VSENSE = 140mV
Delay from VAUX Overcurrent to FAULT tPROP(VAUXFAULT) ILIM(AUX) to FAULT output
Output
CFILTER = 0 VAUX output
grounded
ON, AUXEN, PRSNT Min Pulse Width
tmin
100
ns
Power-On Reset Time after VSTBY
Becomes Valid
tPOR
250
µs
Auto-Retry Period
tRETRY
R/L tied to GND, Any OC Event
Presence Detect Delay to Auto Enable
tPRSNT_ON
PRSNT = high to low
Presence Detect Delay to Disable
tPRSNT_OFF
PRSNT = low to high
GPI to GPO Propagation Delay
tGPI-GPO
GPI high/low to GPO high/low
4
6
8
ms
Delay of Main Power Good to Reporting tPVPERL
PWRGD low to PERST high.
105
145
185
ms
Power Supply Disabled to PERST Low
ON Low to PERST Low
tPERST
0.75
1.4
3
s
4
6.5
9
ms
2.5
100
µs
ns
NOTE:
4. Limits should be considered typical and are not production tested.
8
FN6457.0
September 25, 2007
ISL6113, ISL6114
Typical Application Diagram
+12V
SYSTEM
POWER +3.3V
SUPPLY
VSTBY
0.1µF
PCI-EXPRESS CONNECTOR
0.1µF
11
26
15
VSTBYA VSTBYB VAUXA
VSTBY
12VINA
PCI
EXPRESS
BUS
0.1µF
5
18 PERSTA
2 CFILTERA
VSTBY
35 CFILTERB
C1
C2
100k
100k
100k 100k
9
FORCE_ONA
28
FORCE_ONB
4
GPI_A0
38
GPI_B0
VSTBY
AUXENA
AUXENB
ONA
ONB
VSTBY
HOT-PLUG
CONTROLLER
PWRGDA
PWRGDB
FAULTA
FAULTB
#CGS
22nF
3
12VGATEA
#CGD
6800pF
12VOUTA 10
3VINA 12
FORCE_ONB
GPI_A0
RSENSE^
Float for latch / GND for retry
short pin GND on connector
40
short pin GND on connector
39
3.3AUX
375mA
*R12VGATEA
15Ω
12V
2.1A (x4/x8)
0.1 F
RSENSE^
0.015Ω
3VSENSEA 13
GPI_B0
*R3VGATEA
3VGATEA 14
15Ω
3VOUTA 16
# CGATE
ISL6113
22nF
ISL6114
10k x 4
12VINB 32
0.1µF
45
AUXENA
42
12VSENSEB 29
AUXENB
44
#CGS *R12VGATEB
ONA
22nF
43
15Ω
34
ONB
12VGATEB
#C
GD
6800pF
12VOUTB 27
10k x 4
0.1µF
6
PWRGDA
31
3VINB
PWRGDB
25
1
FAULTA
24
36
3VSENSEB
FAULTB
41
VSTBY
FORCE_ONA
12VSENSEA 8
3VGATEB 23
L/R
PRSNTA
PRSNTB
37 PERSTA
47 GPOB
48 GPOA
15Ω
17
#CGATE
22nF
GND
33
RSENSE^
12V
2.1A (x4/x8)
RSENSE^
0.015Ω
*R3VGATEB
3VOUTB 21
VAUXB 22
GND
3.3V
3.0A
3.3V
3.0A
3.3AUX
375mA
GND 46
PCI
EXPRESS
DATA BUS
10k x 3
PCI-EXPRESS CONNECTOR
* Values for R12VGATE and R3VGATE may vary
depending upon the CGS of the external MOSFETs.
# These components are not required for ISL6113/4
operation but can be implemented for GATE output
slew rate control (application specific)
• Bold lines indicate high current paths
^ RSENSE value is application specific
9
FN6457.0
September 25, 2007
ISL6113, ISL6114
ISL6113, ISL6114 Descriptions and
Operational Explanation
.
VAUX
These two ICs target the dual PCI-EXPRESS slot
application for add-in cards in servers. Together with a pair
of N and P-Channel MOSFETs, four high precision current
sense resistors and a handful of passive components, the
ISL6113, ISL6114 provide a PCI-E compliant hot plug control
solution. These ICs use the Hot Plug Interface (HPI) for
communicating, enabling, monitoring and reporting of UV
conditions and OC and over temperature faults. Additionally
they have a full complement of PCI-E specific I/O.
The ISL6113, ISL6114 share the same footprint as their
sister part, the ISL6112, which features both SMI and HPI
control and communication capabilities, neither of these two
has serial bus capabilities. Whereas the ISL6113 has the
same turn-on characteristics as the ISL6112, the ISL6114
uses a lower level of current sourcing on the GATE outputs
(5µA vs the ISL6113’s 25µA). This lower sourcing current
allows the user to use less GATE capacitance for in-rush
current and GATE ramp control than the ISL6113 to achieve
similar turn-on characteristics. This reduced capacitance in
turn provides for a faster turn-off of the MAIN supplies by the
ISL6114 in the event of an OC fault than is possible with the
ISL6113.
Bias, Power-On Reset and Power Cycling
The ISL6113, ISL6114 utilizes the VSTBY pins as the only IC
bias supply source. For systems without a dedicated 3.3V
auxiliary supply, the 3VMAIN supply is to be used for the IC
bias. A Power-On Reset (POR) cycle is initiated after VSTBY
rises above its UVLO threshold and remains satisfied for
tPOR, ~250µs. If VSTBY is recycled, the ISL6113, ISL6114
enters a new power-on-reset cycle. VSTBY must be the first
supply voltage applied followed by the MAIN supply inputs.
During tPOR, all outputs remain off. PCI-Express (PCI-E)
compliance requires that the connector power must be off
prior to and during insertion and during removal of a PCI-E
board. Before the add-in board is properly inserted into or
removed from a connector, the FET switches are turned off
via the enabling inputs (ON_X and AUXEN_X). In the event
of an improper insertion or removal and to ensure that the
power is off when necessary, the ISL6113, ISL6114 has a
present input (PRSNT) per slot that overrides and disables
the enabling inputs if PRSNT is not pulled low by having a
card fully inserted into the slot to complete the pull-down
circuit. The PRSNT pin must be a last to make, first to break
connection to ensure compliance.
Enabling the VAUX Outputs
Upon asserting an AUXEN input, the related output turns-on
the internal power switch between the VSTBY supply and its
load. The turn-on is slew rate limited and invokes the ICs
current regulation feature so as to not droop the supply due
to in-rush current loading. Figure 2 illustrates the ISL6113
AUX turn-on performance into a 100Ω, 150µF load with the
in-rush load current being limited to ~1A.
AUXEN
IAUX
FIGURE 2. VAUX TURN-ON RLOAD = 10Ω, CLOAD = 100µF
Standby Mode
Standby mode is entered when one or more of the MAIN
supply inputs (12VIN and/or 3VIN) is absent, below its
respective UVLO threshold or OFF. The ISL6113, ISL6114
also has 3.3V auxiliary outputs (VAUX), satisfying an
optional PCI Express requirement. These outputs are fed
from the VSTBY input pins and controlled by the AUXEN
input pins and are independent of the MAIN outputs. Should
IC be in standby mode the VAUX switch will function as long
as VVSTBY is compliant. Prior to standby mode, ONA and
ONB inputs must be deasserted or else the ISL6113,
ISL6114 will assert its FAULT outputs.
Enabling the MAIN GATE Outputs
The related AUXEN must be active for the MAIN supplies to
be enabled otherwise they will be latched off. When a slots
MAIN supplies are off, the 12VGATE pin is held high with an
internal pull-up to the 12VIN voltage. Similarly, the 3VGATE
pin is internally held low to GND. With an add-in card
properly in place, when an ON_X pin is signaled high, the
ISL6113, ISL6114 enables control of one slot turning on one
pair of FETs via the 3VGATE and 12VGATE pins. The FET
gates are charged with a +25µA (+5µA for the ISL6114)
current sink/source pulling the 12VGATE pin to ground and
the 3VGATE pin is charged to ~12VIN thereby enhancing
both of the MAIN supply FET switches.
Estimating In-Rush Current and VOUT Slew Rate at
Start-Up
The expected in-rush current can be estimated by using
Equation 1:
⎛ C LOAD⎞
ISL6113 - I INRUSH Nominally = 25μA ⎜ --------------------⎟
⎝ C GATE⎠
⎛ C LOAD⎞
ISL6114 - I INRUSH Nominally = 5μA ⎜ --------------------⎟
⎝ C GATE⎠
(EQ. 1)
With 25µA and 5µA being the GATE pin charge current for
10
FN6457.0
September 25, 2007
ISL6113, ISL6114
the ISL6113, ISL6114 respectively, CLOAD is the load
capacitance, and CGATE is the total GATE capacitance
including CISS of the external MOSFET and any external
capacitance connected from the GATE output pin to the
GATE reference, GND or source.
An estimate for the output slew rate of 3.3V outputs and 12V
outputs where there is little or no external 12VGATE output
capacitors, can be taken from Equation 2:
I LIM
VOUTdv/dt = -------------------C LOAD
TABLE 2. ISL6114 3.3V AND 12V OUTPUT SLEW-RATE
SELECTION FOR GATE CAPACITANCE
DOMINATED START-UP
| IGATE | = 5µA
CGATE or CGD
dv/dt (LOAD)
0.01µF*
0.5V/ms
0.022µF*
0.23V/ms
0.047µF
0.106 V/ms
0.1µF
0.050V/ms
(EQ. 2)
where ILIM = 50mV/RSENSE and CLOAD is the load
capacitance. Note: As a consequence, the CR duration,
tFILTER must be programmed to exceed the time it takes to
fully charge the output load to the input rail voltage level.
MAIN Outputs (Start-up Delay and Slew-Rate
Control)
The 3.3V outputs act as source followers. In this mode of
operation, VSOURCE = [VGATE – VTH(ON)] until the
associated output reaches 3.3V. The voltage on the gate of
the MOSFET will then continue to rise until it reaches 12V,
which ensures minimum rDS(ON). For the 12V outputs, when
the MOSFET is optionally configured as a Miller integrator to
adjust the VOUT ramp time by having a CGD, which is
connected between the MOSFET’s gate and drain. In this
configuration, the feedback action from drain to gate of the
MOSFET causes the voltage at the drain of the MOSFET to
slew in a linear fashion at a rate estimated by Equation 3:
25μA
ISL6113 VOUTdv/dt = -------------C GD
5μA
ISL6114 VOUTdv/dt = -----------C GD
(EQ. 3)
Tables 1 and 2 approximate the output slew-rate for various
values of CGATE when start-up is dominated by GATE
capacitance (external CGATE from GATE pin to ground plus
CGS of the external MOSFET for the 3.3V rail; CGD for the
12V rail).
TABLE 1. ISL6113 3.3V AND 12V OUTPUT SLEW-RATE
SELECTION FOR GATE CAPACITANCE
DOMINATED START-UP
*Values in this range will be affected by the internal parasitic
capacitances of the MOSFETs used and should be verified
empirically.
During turn-on, the ISL6113 invokes the current regulation
(CR) feature to limit inrush current whereas the ISL6114
disables the CR feature during turn-on thus allowing a
shorter programmed tFILTER. Both ICs monitor for a severe
or Way Overcurrent (WOC) condition such as a short at this
time.
Note that all of these performance estimates and guidelines
are useful only for first order time and loading expectations,
as they do not look at other significant loading factors.
Figures 3 through 11 realistically illustrate the discussed
turn-on performance topic with the noted loading and
compensation conditions. Notice the degree of control over
the in-rush current and the GATE ramp rate as the CGD and
CGS values are changed providing for highly customized
turn on characteristics.
In some scope shots although the CFILTER shows a ramping
in the absence of excessive displayed loading current the
CFILTER is responding to the other MAIN supply current that
is not displayed.
All scope shots were taken from the ISL6113EVAL1Z or
ISL6114EVAL1Z platform with any component changes are
noted.
12VOUT
12VGATE
| IGATE | = 25µA
CGATE or CGD
dv/dt (LOAD)
0.01µF*
2.5V/ms
0.022µF*
1.136V/ms
0.047µF
0.532 V/ms
0.1µF
0.250V/ms
*Values in this range will be affected by the internal parasitic
capacitances of the MOSFETs used and should be verified
empirically.
12 IOUT
CFILTER
CGD = 6.8nF
CGS = 22nF
FIGURE 3. ISL6113 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
11
FN6457.0
September 25, 2007
ISL6113, ISL6114
3VGATE
12VOUT
12VGATE
3 VOUT
3 IOUT
CFILTER
12IOUT
CFILTER
CGD = 9.8nF
CGATE = 22nF
FIGURE 4. ISL6113 3VMAIN START-UP RLOAD = 2Ω,
CLOAD = 470µF
12VOUT
CGS = 2.2nF
FIGURE 7. ISL6113 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
12VOUT
12VGATE
12VGATE
12IOUT
CFILTER
CGD = 6.8nF
CGS = 2.2nF
FIGURE 5. ISL6113 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
3VGATE
3VOUT
12IOUT
CFILTER
CGD = 1.5nF
CGS = 4.7nF
FIGURE 8. ISL6114 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
3VGATE
3 VOUT
3IOUT
3 IOUT
CFILTER
CGATE = 2.2nF
FIGURE 6. ISL6113 3VMAIN START-UP RLOAD = 2Ω,
CLOAD = 470µF
12
CFILTER
CGS = 4.7nF
FIGURE 9. ISL6114 3VMAIN START-UP RLOAD = 2Ω,
CLOAD = 470µF
FN6457.0
September 25, 2007
ISL6113, ISL6114
12VOUT
12VGATE
12IOUT
CFILTER
CGD = OPEN
ISL6113, ISL6114 enters its CR mode where it regulates the
load current to the programmed level by modulating the gate of
the related FET switch into the linear region of operation to
maintain 50mV across the sense resistor for the programmed
tFILTER duration. However, should the load current cause a
VRSENSE > VTHFAST, the outputs are immediately shut off with
no tFILTER delay, as shown in Figures 14 and 15. If the
ISL6113, ISL6114 latches off due to the tFILTER expiring, then
the FETs are turned-off more aggressively than if signaled from
the linear region with approximately 80mA of GATE current to
ensure faster isolation from the voltage bus. This is also true
when turning off from a WOC event.
12VOUT
CGS = OPEN
12VGATE
FIGURE 10. ISL6114 12VMAIN START-UP RLOAD = 10Ω,
CLOAD = 470µF
3VGATE
12IOUT
CFILTER
3VOUT
3IOUT
FIGURE 12. ISL6113 12VMAIN CR AND SHUTDOWN
CFILTER
CGS = OPEN
3IOUT
3VOUT
FIGURE 11. ISL6114 3VMAIN START-UP RLOAD = 2Ω,
CLOAD = 470µF
Current Regulation (CR) Function
The ISL6113, ISL6114 provides a current limiting function that
protects the input voltage supplies against excessive current
loads, including short circuits during turn-on (MAIN supplies
shown in previous Figures 3 through 11) and during static
operation for both MAIN (Figures 12 through 15) and AUX
supplies (Figures 16 and 17). When during static operation, any
load current causes >VTHILIMIT (nominally 50mV) drop across
a sense resistor thus exceeding the programmed CR limit, the
13
3VGATE
CFILTER
FIGURE 13. ISL6113 3VMAIN CR AND SHUTDOWN
FN6457.0
September 25, 2007
ISL6113, ISL6114
12VGATE
12VOUT
VAUX
CFILTER
CFILTER
IAUX
12IOUT
FIGURE 14. ISL6113 12VMAIN WOC SHUTDOWN
FIGURE 16. VAUX OC REGULATION AND SHUTDOWN
VAUX
3VGATE
CFILTER
CFILTER
3VOUT
3 IOUT
IAUX
FIGURE 17. VAUX WOC REGULATION AND SHUTDOWN
FIGURE 15. ISL6113 3VMAIN WOC SHUTDOWN
The VAUX outputs have a different circuit-breaker function.
The VAUX circuit breakers do not incorporate a fast-trip
detector, instead they regulate the current into a fault to
avoid exceeding their operating current limit. The circuit
breaker will trip due to an overcurrent on VAUX when the
programmable CR duration timer, t
expires. This use of
FLT
the t
timer prevents the circuit breaker from tripping
FLT
prematurely due to brief current transients. See Figures 16
and 17 for illustrations of the VAUX protection performance
into an over current (OC) and more severe OC condition
respectively. The ISL6113, ISL6114 AUX current control
responds proportionally to the severity of the OC condition
resulting in appropriately fast VAUX pull down and current
regulation until tFILTER has expired.
In the fault latch mode set by leaving L/R pin open, following a
fault condition, the outputs can be turned on again via the ON
inputs (if the fault occurred on one of the MAIN outputs), via
the AUXEN inputs (if the fault occurred on the AUX outputs),
or by cycling both ON and AUXEN (if faults occurred on both
the MAIN and AUX outputs). When the circuit breaker trips,
FAULT will be asserted. In the fault retry mode, set by
grounding the L/R pin the ISL6113, ISL6114 will initiate an
automatic restart about every 1.5s until successful.
The ISL6113, ISL6114 current regulation duration (tFILTER)
is set by external capacitors at the CFILTER pins to GND.
Once the CR mode is entered, the external cap is charged
with a 2.5µA current source to 1.25V. Once this threshold
has been reached the IC then turns-off all fault the related
FETs and sets the FAULT output low. For a desired tFILTER,
the value for CCFILTER is given by Equation 4:
nominal t FILTER
C FILTER = -------------------------------------------500kΩ
14
(EQ. 4)
FN6457.0
September 25, 2007
ISL6113, ISL6114
where 500kΩ is (nominal VFILTER/nominal IFILTER) and
where tFILTER is the desired response time with the values for
IFILTER and VFILTER being found in the ISL6113, ISL6114’s
“Electrical Specifications Table” on page 6. See Table 3 for
nominal tFILTER times for given CFILTER cap values.
For the ISL6113, there is a minimum tFILTER consideration
since the ISL6113 has its CR feature invoked as it turns-on the
FETs into the load. There is a maximum bulk capacitance
specified for each power level supported that needs to be
charged at the CR limit. This in-rush current time must be
considered when programming the tFILTER.
TABLE 3.
the 12VMAIN, 3VMAIN and VAUX outputs exceed their
respective VUVTH levels.
PCI-E Reset Outputs (PERST)
A PCI-Express specific output, the ISL6113, ISL6114 have
two open-drain, active-low PERST outputs that must be
pulled up to VSTBY. Upon enabling, the assertion high of
PERST is delayed a minimum of 100ms (tPVPERL) from the
power rails achieving minimum specified operating limits for
stability of supplies and REFCLK. Once high the card
functions can safely start-up. PERST is immediately pulled
low when the power supply is disabled.
Force_On Inputs (FORCE_ON)
NOMINAL tFILTER DURATION
CFILTER CAPACITANCE (µF)
TIME (ms)
Open
0.01
0.01
5
0.022
11
0.047
24
0.1
50
NOTE: Nom. CR_DUR = CFILTER cap (µF) * 500kΩ.
Holding the CFILTER pin low will increase the CR duration
indefinitely. This feature may be useful in trouble shooting, or
evaluation. If this is invoked be cautious not to violate the
SOA of the pass FETs.
Power-Down Cycle
When signaled off, the GATE pins are discharged/charged with
a 25µA for ISL6113 (5µA for ISL6114) current sink/source to
ramp down the supplies in a controlled fashion. When a slot is
turned off, internal switches are connected to the outputs
12VOUT and 3VOUT providing a discharge path for load
capacitance. This ensures that the outputs are pulled to
GND, thereby ensuring 0V on slot connectors during
removal or insertion of add-in cards.
Thermal Shutdown
The internal VAUX switches are protected against damage not
only by current limiting, but by a dual mode over-temperature
protection scheme as well. Each slot controller on the ISL6113,
ISL6114 is thermally isolated from the other. Should an
overcurrent condition raise the junction temperature of one
slots controller and pass switch > TOVER (nominally +140°C),
all of the outputs for that slot will be shut off and the slots FAULT
output will be asserted. The other slots operating condition will
remain unaffected. However, should the ISL6113, ISL6114’s die
temperature exceed +160°C, all outputs for both slots will be
shut off, whether or not a current limit condition exists.
Special I/O
Power Good Outputs (PWRGD)
These inputs are provided to facilitate system diagnostics or
evaluation when using the ISL6113, ISL6114. Asserting a
FORCE_ON input will turn on all three of the slots outputs,
while over riding all three supplies overcurrent, the MAIN
supplies UV protections, on-chip thermal protection for the
VAUX supplies and disable the PWRGD and FAULT outputs.
Asserting the FORCE_ON inputs will not disable the
VUVLO(STBY). If not used, each pin should be connected to
VSTBY.
General Purpose I/O (GPI, GPO)
Two pairs of pins on the ISL6113, ISL6114 are available for
buffered driving. Both of these are compliant to 3.3V. If
unused, connect each GPI pin to GND. The GPI pins are
5ms debounced for filtering and the GPO are open drain
capable of 90mA pull down current for attention getting
devices in accordance with the PCI-Express specifications.
Latch/Retry Operation Toggle (L/R)
This input pin is tied to GND for a ~1.5s retry period after
fault. If left open or tied high to VSTBY, the ISL6113, ISL6114
will latch off upon a fault.
Board Present Input (PRSNT)
The PRSNT input is used to detect the presence of an add-in
card in the slot. In systems where Manual Retention Latch
(MRL) is not implemented, this input detects when an add-in
card is properly inserted into the slot via the last make,
staggered length PRSNT connection on the add-in card
connector. This input must be pulled to ground through the addin card ensuring all connections have been made between the
connector and the card in order to enable 3.3VAUX turn-on.
This pin function can be defaulted by tying to GND. PRSNT not
being pulled low overrides and disables all FORCE_ON, ON
and AUXEN commands and for ~5ms after being pulled low. In
systems where MRL is implemented this input is connected to
the MRL sensor. The MRL Sensor allows monitoring of the
position of the MRL and therefore allows detection of
unexpected openings of the MRL. These inputs are internally
pulled up to the VSTBY rail. All I/O are valid at VSTBY <1V.
The ISL6113, ISL6114 have two open-drain, active-low
PWRGD outputs that must be pulled up to VSTBY. This
output will be asserted when a slot has been enabled and
15
FN6457.0
September 25, 2007
ISL6113, ISL6114
PCI-Express Application
Recommendations
Using the ISL6113EVAL1Z,
ISL6114EVAL1Z Platform
For each of the 3VMAIN and +12VMAIN supply, the CR level is
set by an external sense resistor value depending on the
maximum specified power for the various sizes of the
PCI-Express connector and application implemented (X1, 10W
or 25W; X4, X8, 25W; X16, 25W or 75W; and X16
Graphic-ATX, 150W). The power rating is a combination of both
main and the optional auxiliary supplies. This sense resistor is a
low sub-1Ω standard value current sense resistor (one for each
slot) and the voltage across this resistor is compared to a 50mV
reference. On the 12VMAIN, for a10W connector, a 75mΩ
sense resistor provides a nominal CR level of 0.66A, 32%
above the 0.5A maximum specification; for a 25W connector, a
20mΩ sense resistor provides a nominal CR level of 2.5A, 19%
above the 2.1A maximum specification; for a 75W connector a
8mΩ sense resistor provides a nominal CR level of 6.25A, 14%
above the 5.5A maximum specification; for a X16 GraphicsATX 150W card, a 7mΩ sense resistor provides a nominal CR
level of 7.1A, 14% above the 6.25A maximum specification.
The 150W is provided by 2 slots, each providing up to a
maximum of 75W from the 12VMAIN as this specialized type of
card does not consume 3VMAIN or AUX supply power. The
3.3V supply uses a 15mΩ sense resistor compared to a 50mV
reference to provide a nominal CR of 3.3A or 11% above the 3A
maximum specification load across all sizes and power levels
of the connector.
Description and Introduction
Table 4 provides recommended 12VMAIN sense resistor
values for particular power levels.
TABLE 4.
NOMINAL CURRENT REGULATION LEVEL
12VMAIN RSENSE
(mΩ)
12VMAIN
CR (A)
PCI-E ADD IN BOARD POWER
LEVEL SUPPORTED (W)
75
0.7
10
20
2.5
25
8
6.2
75
7
7
150
NOTE: CR Level = VTHILIMIT/RSENSE.
Providing a nominal CR protection level above the maximum
specified limits of the card ensures that the card is able to
draw its maximum specified loads, and, in addition, have
enough headroom before a regulated current limiter is
invoked to protect against transients and other events. This
headroom margin can be adjusted up or down by utilizing
differing values of sense resistor.
16
The primary ISL6113, ISL6114 evaluation platform is shown in
Figures 37 and 38 both photographically and schematically.
This evaluation board highlights a PCB layout that confines all
necessary active and passive components in an area
12mmx55mm. This width is smaller than the specified
PCI-Express socket to socket spacing allowing for intimate
co-location of the load power control and the load itself.
Around the central highlighted layout are numerous labeled
test points and configuration jumpers. Where there are node
names such as, AO(L/R) the pin name in parentheses
relates to the ISL6113, ISL6114. The ISL6113, ISL6114
share an evaluation platform with the ISL6112 as all three
parts have a common pinout for the common pin functions.
The specific evaluation board as ordered and received will
reflect the part number in the area below the Intersil logo
either by label or silk screened lettering. For those pins not
common across the ISL6112 and ISL6113, ISL6114 in the
bottom left corner there is a matrix detailing the differences.
After correctly biasing the evaluation platform as noted
through the 6 banana jacks, turning on VSTBY first then the
other MAIN supplies in any order. With the appropriate
signaling to the AUXEN and ON inputs the user should see
turn-on waveforms as shown previously. The addition of
external current loading is necessary to demonstrate the OC
and WOC response performance.
Figures 18 and 19 demonstrate some of the PCI-E specific
and additional I/O functionality. Figure 18 shows the PRSNT
pin being signaled low then the 12VOUT and 3VOUT outputs
turning on automatically as the ON input is already asserted.
Power good is signaled once the 12VOUT and 3VOUT meet
their respective VUVVth levels. After the time period tPVPERL
the PCI-E specific reset signal output, PERST is asserted.
Figure 19 shows the GPI to GPO ~6ms functionality.
Figure 20 shows the retry period operation. Approximately
every 1.5s the IC attempts to restart into a faulty load until
finally being able to turn-on fully into a normal load. This retry
mode is invoked with R/L input tied low.
ISL6113EVAL1Z, ISL6114EVAL1Z Errata
GPO_A0 and GPO_BO labeling is reversed. Correct
labeling shown on evaluation board photograph in Figure 37.
Caution: The ISL6113EVAL1Z, ISL6114EVAL1Z gets very
hot to the touch after operating it for a few minutes. Hottest
areas marked on evaluation board.
FN6457.0
September 25, 2007
ISL6113, ISL6114
12VOUT
PRSNT
3VOUT
GPO
PGOOD
tPVPERL
GPI
PERST
FIGURE 18. PRSNT, VOUT, POWERGOOD, PERST
FIGURE 19. GPI TO GPO FUNCTIONALITY
12VMAIN
3VMAIN
12GATE
12IOUT
FIGURE 20. RETRY MODE OPERATION
17
FN6457.0
September 25, 2007
ISL6113, ISL6114
Typical Performance Curves
1.0
6.0
5.8
0.8
12V ICC
5.4
5.2
ICC (mA)
ICCSTBY (mA)
5.6
5.0
4.8
4.6
4.4
0.6
0.4
0.2
3.3V ICC
4.2
4.0
-60
-40
-20
0
20
40
60
80
100
0
-50
120
0
TEMPERATURE (°C)
WOC THRESHOLD VOLTAGE (V)
CURRENT LIMIT Vth (mV)
53
52
51
50
49
48
-40
-20
0
20
40
60
80
100
120
103
102
101
100
99
98
97
96
-60
-40
-20
0
20
40
60
80
100
120
100
120
TEMPERATURE (°C)
FIGURE 23. CURRENT LIMIT THRESHOLD VOLTAGE
vs TEMPERATURE
FIGURE 24. FAST TRIP THRESHOLD VOLTAGE
vs TEMPERATURE
400
1200
380
1150
AUX RESISTANCE (Ω)
AUX CURRENT LIMIT (mA)
150
104
TEMPERATURE (°C)
1100
1050
1000
950
900
850
800
-60
100
FIGURE 22. ICC CURRENT vs TEMPERATURE
FIGURE 21. ICCSTBY CURRENT vs TEMPERATURE
47
-60
50
TEMPERATURE (°C)
360
IAUX = 375mA
340
320
300
280
260
240
220
-40
-20
0
20
40
60
80
100
TEMPERATURE (°C)
FIGURE 25. AUX CURRENT LIMIT vs TEMPERATURE
18
120
200
-60
-40
-20
0
20
40
60
80
TEMPERATURE (°C)
FIGURE 26. AUX rDS(ON) vs TEMPERATURE
FN6457.0
September 25, 2007
ISL6113, ISL6114
AUX AND 3VMAIN RISING POR (V)
Typical Performance Curves (Continued)
12VMAIN POR RISING (V)
9.30
9.25
9.20
9.15
9.10
9.05
-60
-40
-20
0
20
40
60
80
100
3.1
2.9
2.5
2.3
3VMAIN
2.1
1.9
1.7
1.5
-60
120
AUX
2.7
-40
-20
FIGURE 27. 12VMAIN RISING POR THRESHOLD VOLTAGE
vs TEMPERATURE
AUX AND 3VMAIN UV Vth (V)
12VMAIN UV Vth (V)
10.50
10.48
10.46
10.44
10.42
10.40
60
80
100
120
-40
-20
0
20
40
60
80
100
2.79
2.78
2.76
2.75
2.74
2.73
AUX
2.72
2.71
2.70
-60
120
3VMAIN
2.77
-40
-20
TEMPERATURE (°C)
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 29. 12VMAIN POWER GOOD THRESHOLD VOLTAGE
vs TEMPERATURE
FIGURE 30. AUX AND 3VMAIN POWER GOOD THRESHOLD
VOLTAGE vs TEMPERATURE
5.1
25.5
25.0
TURN ON CURRENT (µA)
TURN ON CURRENT (µA)
40
2.80
10.52
3VGATE
24.5
24.0
23.5
12VGATE
23.0
22.5
22.0
-60
20
FIGURE 28. AUX AND 3VMAIN RISING POR THRESHOLD
VOLTAGE vs TEMPERATURE
10.54
10.38
-60
0
TEMPERATURE (°C)
TEMPERATURE (°C)
-40
-20
0
20
40
60
80
100
TEMPERATURE (°C)
FIGURE 31. ISL6113 GATE TURN-ON CURRENT (ABS)
vs TEMPERATURE
19
120
5.0
3VGATE
4.9
4.8
4.7
12VGATE
4.6
4.5
4.4
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 32. ISL6114 GATE TURN-ON CURRENT (ABS)
vs TEMPERATURE
FN6457.0
September 25, 2007
ISL6113, ISL6114
120
3.0
2.9
100
FILTER CURRENT (µA)
GATE FAULT OFF CURRENT (mA)
Typical Performance Curves (Continued)
3GATE
80
60
12GATE
40
20
2.8
2.7
2.6
2.5
2.4
2.3
2.2
2.1
0
-60
-40
-20
0
20
40
60
80
100
2.0
-60
120
-40
-20
TEMPERATURE (°C)
1.30
160
1.28
155
tPVPERL (ms)
FILTER THRESHOLD (V)
20
40
60
80
100
120
FIGURE 34. FILTER CHARGE CURRENT vs TEMPERATURE
FIGURE 33. GATE FAULT OFF CURRENT (ABS)
vs TEMPERATURE
1.26
1.24
1.22
1.20
-60
0
TEMPERATURE (°C)
150
145
140
135
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 35. FILTER THRESHOLD VOLTAGE vs TEMPERATURE
20
130
-60
-40
-20
0
20
40
60
80
100
120
TEMPERATURE (°C)
FIGURE 36. tPVPERL vs TEMPERATURE
FN6457.0
September 25, 2007
ISL6113, ISL6114
CAUTION HOT AREA
GPO_A
CAUTION HOT AREA
GPO_B
CAUTION HOT AREA
FIGURE 37. ISL6113EVAL1Z, ISL6114EVAL1Z BOARD PHOTOGRAPH
21
FN6457.0
September 25, 2007
22
FN6457.0
September 25, 2007
FIGURE 38. ISL6113EVAL1Z, ISL6114EVAL1Z BOARD SCHEMATIC
ISL6113, ISL6114
ISL6113
ISL6114
ISL6113, ISL6114
TABLE 5. ISL6113EVAL1Z, ISL6114EVAL1Z COMPONENT LISTING
COMPONENT
DESIGNATOR
COMPONENT FUNCTION
COMPONENT DESCRIPTION
U1
ISL6113 or ISL6114
PCI-Express Dual Slot Hot Plug Controller
Q1, Q4
Voltage Rail Switches
SI4405DY or equivalent, P-Channel MOSFET
Q2, Q3
Voltage Rail Switches
SI4820DY or equivalent, N-Channel MOSFET
Current Sense Resistor
0.020Ω 1%, 2512
R9, R10, R17, R20
Pull-up resistors on FORCE_ON and GPI Inputs
100kΩ, 0201
R11, R12, R13, 14,
R15, R16, R18, 19,
R21
I/O Pull-up resistors
10kΩ, 0201
R2, R4, R5, R7
FET gate series resistance
15Ω, 0201
C1, C7, C8, C13
ISL6113EVAL1Z 3VMAIN FET gate capacitance
22nF 10%, 16V, 0402
C1, C7, C8, C13
ISL6114EVAL1Z 3VMAIN FET gate capacitance
open
C3, C5, C6, C10,
C11, C14
MAIN and VSTBY decoupling capacitance
1µF 10%, 6.3V, 0402
C2, C12
ISL6113 12VMAIN FET gate to drain capacitance
6.8nF 10%, 6.3V, 0201
C2, C12
ISL6114 12VMAIN FET gate to drain capacitance
open
C4, C9
CFILTER capacitance (5ms)
0.01µF 10%, 6.3V, 0201
R24, R25
AUX Load Resistance
10Ω 20%, 3W
C17, C18
AUX Load Capacitance
100µF 20%, 25V, Radial Electrolytic
R22, R26, R28, 29
12VMAIN Load Resistance
20Ω 20%, 10W
R23, R27
3VMAIN Load Resistance
2Ω 20%, 10W
R1, R3, R6, R8
C15, C16, C19, C20 12VMAIN and 3VMAIN Load Capacitance
470µF 20%, 16V, Radial Electrolytic
All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems.
Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality
Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without
notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and
reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result
from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries.
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23
FN6457.0
September 25, 2007
ISL6113, ISL6114
Package Outline Drawing
L48.7x7
48 LEAD QUAD FLAT NO-LEAD PLASTIC PACKAGE
Rev 4, 10/06
4X 5.5
7.00
A
44X 0.50
B
37
6
PIN 1
INDEX AREA
6
PIN #1 INDEX AREA
48
1
7.00
36
4. 30 ± 0 . 15
12
25
(4X)
0.15
13
24
0.10 M C A B
48X 0 . 40± 0 . 1
TOP VIEW
4 0.23 +0.07 / -0.05
BOTTOM VIEW
SEE DETAIL "X"
( 6 . 80 TYP )
(
0.10 C
BASE PLANE
0 . 90 ± 0 . 1
4 . 30 )
C
SEATING PLANE
0.08 C
SIDE VIEW
( 44X 0 . 5 )
C
0 . 2 REF
5
( 48X 0 . 23 )
( 48X 0 . 60 )
0 . 00 MIN.
0 . 05 MAX.
TYPICAL RECOMMENDED LAND PATTERN
DETAIL "X"
NOTES:
1. Dimensions are in millimeters.
Dimensions in ( ) for Reference Only.
2. Dimensioning and tolerancing conform to AMSE Y14.5m-1994.
3. Unless otherwise specified, tolerance : Decimal ± 0.05
4. Dimension b applies to the metallized terminal and is measured
between 0.15mm and 0.30mm from the terminal tip.
5. Tiebar shown (if present) is a non-functional feature.
6. The configuration of the pin #1 identifier is optional, but must be
located within the zone indicated. The pin #1 indentifier may be
either a mold or mark feature.
24
FN6457.0
September 25, 2007