Datasheet (PDF)

ICO200
Embedded Field Controller with AMD
Geode™ LX800 Onboard and Front Cabling
Features
● Fanless cooling system: AMD Geode™ LX800 onboard
● Ultra slim and compact design
● Easy-to-maintain design: CF card, memory, mini-PCI
● Supports 1 CompactFlash™
2 COM
AMD LX800
processor
Front view
Din-rail mounting
IP40
Fanless
Low Power
Ordering Information
Specifications
Standard Color
Construction
CPU
System Board
System Memory
BIOS
System I/O Outlet
Watchdog Timer
Storage
Installation
System Indicator
Weight (net/gross)
EOS Support
ISO
Environment
Embedded field controller with AMD Geode™ LX800 CPU
onboard and front cabling
Optional
DDR SODIMM
256 MB ~ 1 GB
CompactFlash™
1 GB or above
*Specifications and certifications are based on options and may vary.
Dimensions
160.5
111.8
Certificate
Standard
ICO200-DC
53.4
Power Supply
Dimensions
White
Aluminum & heavy-duty steel, IP40
AMD Geode™ LX800 500 MHz processor onboard
SBC84620
1 x 200-pin DDR SO-DIMM max. up to 1 GB
Phoenix-Award 4Mbit with RPL/PXE LAN Boot ROM
SmartView and customer CMOS backup
1 x RS-232/422/485 (COM 1)
1 x RS-232 (COM 2) (default is RS-232)
1 x VGA
1 x PS/2 keyboard/mouse
2 x 10/100Mbps Ethernet
2 x USB 2.0
1 x VDC power input connector
Reset supported; 255 level
Supports 1 x CompactFlash™
Din-rail
1 x green LED for system power-on
1 x orange LED for HDD active
24VDC
160.5 mm (6.32“) (W) x 111.8 mm (4.40“) (D) x 53.35 mm
(2.10“) (H)
1.2 kg (2.64 lb)/1.92 kg (4.23 lb)
XPE, WinCE, Linux support package
Manufactured in an ISO9001 facility
Operation temperature:
0°C ~ +50°C (+32°F ~ +122°F),
Relative humidity:
10% ~ 95% @ 40°C ; non-condensing
Operation vibration:
2 G, 5 ~ 500 Hz, random for CompactFlash™
CE
Power Protection
DC Version
OVP (over voltage protection)
UVP (under voltage protection)
Reverse protection
363
* All specifications and photos are subject to change without notice.