ISL55007 SIGNS NEW DE R O F D T NDE ACEMEN COMME ED REPL Center at NO T RE D N E M OM port Sheet SupData N O REC chnical .intersil.com/tsc e T r u o t contac ERSIL or www T 1-888-IN ® May 22, 2006 MMIC Silicon Bipolar Broadband Amplifier Features The ISL55005, ISL55007, ISL55008 and ISL55009, ISL55010, ISL55011 constitute a family of high performance gain blocks featuring a Darlington configuration using high ft transistors and excellent thermal performance. They are an ideal choice for DVB-S LNB cable receiver applications. • Input impedance of 75Ω ISL55005, ISL55007, ISL55008 offer higher OIP3 performance while the ISL55009, ISL55010, ISL55011 offer lower operating supply currents. • Low input and output return losses ISL55005 and ISL55009 match a 75Ω source to a 50Ω load. ISL55007 and ISL55010 match a 75Ω source to a 75Ω load. ISL55008 and ISL55011 match a 50Ω source to a 50Ω load. Applications FN6214.0 • Output impedance of 75Ω • Noise figure of 3.8dB • OIP3 of 18dBm • Pb-free plus anneal available (RoHS compliant) • LNB and LNB-T line amplifiers • IF gain blocks for satellite and terrestrial HDTV STBs • PA driver amplifier Ordering Information PART NUMBER (Note) PART MARKING ISL55007IEZ-T7 CBD • Wireless data, satellite TAPE & REEL PACKAGE (Pb-Free) PKG. DWG. # 7” (3k pcs) 6 Ld SC-70 P6.049 • Bluetooth/WiFi • Satellite locator and signal strength meters NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Typical Application Circuit Pinout 6 LD SC-70 +3.3V 0.1µF 100pF 100pF 3 4 6 68pF 0.1µF GND 1 6 OUT GND 2 5 GND IN 3 4 VSP 100nH 68pF 1, 2, 5 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2006. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. ISL55007 Absolute Maximum Ratings (TA = 25°C) Supply Voltage from VSP to GND . . . . . . . . . . . . . . . . . . . . . . . . 6V Input Voltage . . . . . . . . . . . . . . . . . . . . . . . VS+ +0.3V to GND -0.3V Power Dissipation . . . . . . . . . . . . See Packging Information Section Ambient Operating Temperature . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature . . . . . . . . . . . . . . . . . . . . . . . .-65°C to +125°C Operating Junction Temperature . . . . . . . . . . . . . . . . . . . . . . +125°C ESD Rating Human Body Model (Per MIL-STD-883 Method 3015.7) . . .3000V Machine Model (Per EIAJ ED-4701 Method C-111). . . . . . . .300V CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typ values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER Gt P1dB OIP3 VSP = +3.3V, Zrsc = Zload = 50Ω, TA = 25°C, unless otherwise specified. DESCRIPTION CONDITIONS Small Signal Gain Output Power at 1dB Compression Output Third Order Intercept Point MIN TYP MAX UNIT 1.0GHz 14.6 15.8 17.1 dB 1.5GHz 14.5 15.7 17.0 dB 2.0GHz 14.3 15.5 16.8 dB 1.0GHz 5.4 7.4 9.4 dBm 2.0GHz 5.3 6.8 8.3 dBm 1.0GHz 18.5 dBm 2.0GHz 17.6 dBm BW 3dB Bandwidth 3dB below Gain @ 500MHz 3.3 GHz IRL Input Return Loss 1.0GHz Zrsc = 75Ω, Zload = 75Ω 16.4 dB ORL Output Return Loss 1.0GHz Zrsc = 75Ω, Zload = 75Ω 12.9 dB RISOL Reverse Isolation 2.0GHz 21.0 dB NF Noise Figure 2.0GHz 3.8 dB ID Device Operating Current 17.5 20.7 23.5 mA Device Test Setup Agilent _8753ES VNA 50Ω 50Ω CONNECTORLESS PLATFORM 50Ω PIN 3 DC BLOCK PIN 6 PICOSECOND LABS MODEL 5542 50Ω DUT BIAS TEE 3.3V PICOSECOND LABS MODEL 5508-110 I1 I2 IDEVICE INPUT REFERENCE PLANE 2 OUTPUT REFERENCE PLANE 3.3V POWER SUPPLY FN6214.0 May 22, 2006 ISL55007 Typical Performance Curves Zsrc = 75Ω, Zload = 75Ω 16 16 12 12 ORL (dB) 20 IRL (dB) 20 8 4 4 0 0.5 8 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 0 0.5 3.0 FIGURE 1. INPUT RETURN LOSS vs FREQUENCY 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 3.0 FIGURE 2. OUTPUT RETURN LOSS vs FREQUENCY 18.0 -6.0 16.8 -6.8 15.6 -7.6 S11 (dB) S21 (dB) Typical Performance Curves 50Ω environment 14.4 -9.2 13.2 12.0 0.5 -8.4 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 -10.0 0.5 3.0 -20.0 -7.0 -20.8 -7.6 -21.6 -8.2 -22.4 -23.2 -24.0 0.5 1.5 2.0 FREQ UENCY (GHz) 2.5 3.0 FIGURE 4. |S11| vs FREQUENCY S22 (dB) S12 (dB) FIGURE 3. |S21| vs FREQUENCY 1.0 -8.8 -9.4 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 FIGURE 5. |S12| vs FREQUENCY 3 3.0 -10.0 0.5 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 3.0 FIGURE 6. |S22| vs FREQUENCY FN6214.0 May 22, 2006 ISL55007 Typical Performance Curves 50Ω environment (Continued) 21 1dB OUTPUT COMPRESSION POINT (dBm) 8.0 20 7.6 19 OIP3 (dBm) 7.2 18 6.8 17 1.5 2.0 FREQUENCY (GHz) 2.5 6.0 0.5 3.0 FIGURE 7. OIP3 vs FREQUENCY 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 3.0 FIGURE 8. P1dB vs FREQUENCY 6.0 NOISE FIGURE (dB) 4.8 3.6 2.4 1.2 0.0 0.5 1.0 1.5 2.0 FREQUENCY (GHz) 2.5 3.0 1.8 0.6 1.6 0.7 1.4 1.2 0.8 0.9 1.0 FIGURE 9. NOISE FIGURE vs FREQUENCY 2.0 0.2 0.4 0.4 3.0 0.6 0.3 0.8 4.0 1.0 5.0 1.0 6.0 0.2 0.8 7.0 0.6 8.0 9.0 10 0.1 0.4 20 50 50 10 20 4.0 3.0 2.0 1.8 1.6 1.4 1.2 1.0 0.9 0.8 0.7 0.6 0.5 0.4 0.3 0.2 0 0.1 0.2 5.0 1.0 0.5 50 0.2 S22 3 GHz 7.0 0.8 6.0 S11 1.0 2.2 1.0 4.0 0.8 3 GHz 0.3 20 1.0 1.0 0.6 2.2 0.2 0.5 GHz 0.5 GHz 0.4 5.0 0.1 8.0 9.0 10 0.6 3.0 0.4 0.4 1.8 2.0 0.5 1.4 1.2 1.0 0.9 0.8 0.7 1.6 0.6 0.2 16 0.5 6.4 RF Café 2002 FIGURE 10. S11 AND S22 vs FREQUENCY 4 FN6214.0 May 22, 2006 ISL55007 Packaging Information JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD POWER DISSIPATION (W) 0.3 0.25 0.2 0.15 176mW θ JA 0.1 SC 7 =5 0-6 67 °C /W 0.05 0 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 11. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE 5 FN6214.0 May 22, 2006 ISL55007 Small Outline Transistor Plastic Packages (SC70-6) 0.20 (0.008) M VIEW C C P6.049 CL 6 LEAD SMALL OUTLINE TRANSISTOR PLASTIC PACKAGE e b 6 INCHES 5 4 CL CL E1 E 1 2 3 e1 C D CL A A2 A1 SYMBOL MIN MAX MIN MAX NOTES A 0.031 0.043 0.80 1.10 - A1 0.000 0.004 0.00 0.10 - A2 0.031 0.039 0.00 1.00 - b 0.006 0.012 0.15 0.30 b1 0.006 0.010 0.15 0.25 c 0.003 0.009 0.08 0.22 6 c1 0.003 0.009 0.08 0.20 6 D 0.073 0.085 1.85 2.15 3 E 0.071 0.094 1.80 2.40 - E1 0.045 0.053 1.15 1.35 3 SEATING PLANE e -C- e1 L 0.10 (0.004) C MILLIMETERS 0.0256 Ref 0.65 Ref 0.0512 Ref 0.010 0.018 - 1.30 Ref 0.26 - 0.46 L1 0.017 Ref. 0.420 Ref. L2 0.006 BSC 0.15 BSC WITH b N PLATING b1 R 0.004 - 0.10 - R1 0.004 0.010 0.15 0.25 α 0o 8o 0o 8o c c1 6 4 6 5 Rev. 2 9/03 BASE METAL NOTES: 1. Dimensioning and tolerance per ASME Y14.5M-1994. 4X θ1 2. Package conforms to EIAJ SC70 and JEDEC MO203AB. 3. Dimensions D and E1 are exclusive of mold flash, protrusions, or gate burrs. R1 4. Footlength L measured at reference to gauge plane. R 5. “N” is the number of terminal positions. GAUGE PLANE SEATING PLANE L C L1 4X θ1 α L2 6. These Dimensions apply to the flat section of the lead between 0.08mm and 0.15mm from the lead tip. 7. Controlling dimension: MILLIMETER. Converted inch dimensions are for reference only VIEW C All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 6 FN6214.0 May 22, 2006