ISL73096RH, ISL73127RH, ISL73128RH The ISL73096RH, ISL73127RH and ISL73128RH are radiation hardened bipolar transistor arrays. The ISL73096RH consists of three NPN transistors and two PNP transistors on a common substrate. The ISL73127RH consists of five NPN transistors on a common substrate. The ISL73128RH consists of five PNP transistors on a common substrate. One of our bonded wafer, dielectrically isolated fabrication processes provides an immunity to Single Event Latch-up and the capability of highly reliable performance in any radiation environment. The high gain-bandwidth product and low noise figure of these transistors make them ideal for use in high frequency amplifier and mixer applications. Monolithic construction of the NPN and PNP transistors provides the closest electrical and thermal matching possible. Access is provided to each terminal of the transistors for maximum application flexibility. Specifications for Rad Hard QML devices are controlled by the Defense Supply Center in Columbus (DSCC). The SMD numbers listed here must be used when ordering. Detailed Electrical Specifications for these devices are contained in SMD 5962-07218. A “hot-link” is provided on our website for downloading. Features • Electrically Screened to SMD # 5962-07218 • QML Qualified per MIL-PRF-38535 Requirements • Radiation Environment - Gamma Dose (γ) . . . . . . . . . . 3 x 105RAD(Si) - SEL Immune . . Bonded Wafer Dielectric Isolation • NPN Gain Bandwidth Product (FT) . . . 8GHz (Typ) • NPN Current Gain (hFE). . . . . . . . . . . . 130 (Typ) • NPN Early Voltage (VA) . . . . . . . . . . . . 50V (Typ) • PNP Gain Bandwidth Product (FT) . . . 5.5GHz (Typ) • PNP Current Gain (hFE) . . . . . . . . . . . . . 60 (Typ) • PNP Early Voltage (VA) . . . . . . . . . . . . 20V (Typ) • Noise Figure (50Ω) at 1GHz . . . . . . . . 3.5dB (Typ) • Collector-to-Collector Leakage . . . . . . <1pA (Typ) • Complete Isolation Between Transistors Applications • High Frequency Amplifiers and Mixers - Refer to Application Note AN1503 • High Frequency Converters • Synchronous Detector Ordering Information ORDERING NUMBER PART NUMBER TEMP. RANGE (°C) PACKAGE (Pb-free) 5962F0721801V9A ISL73096RHVX -55 to +125 DIE 5962F0721801VXC ISL73096RHVF (Notes 1, 2) -55 to +125 16 LD FLATPACK 5962F0721802V9A ISL73127RHVX -55 to +125 DIE 5962F0721802VXC ISL73127RHVF (Notes 1, 2) -55 to +125 16 LD FLATPACK 5962F0721803V9A ISL73128RHVX -55 to +125 DIE 5962F0721803VXC ISL73128RHVF (Notes 1, 2) -55 to +125 16 LD FLATPACK ISL73096RHF/PROTO ISL73096RHF/PROTO -55 to +125 ISL73096RHX/SAMPLE ISL73096RHX/SAMPLE -55 to +125 ISL73127RHF/PROTO ISL73127RHF/PROTO -55 to +125 ISL73127RHX/SAMPLE ISL73127RHX/SAMPLE -55 to +125 November 12, 2009 FN6475.3 1 DIE DIE CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2007, 2009. All Rights Reserved All other trademarks mentioned are the property of their respective owners.. ISL73096RH, ISL73127RH, ISL73128RH Radiation Hardened Ultra High Frequency NPN/PNP Transistor Arrays ISL73096RH, ISL73127RH, ISL73128RH Ordering Information (Continued) ORDERING NUMBER TEMP. RANGE (°C) PART NUMBER ISL73128RHF/PROTO ISL73128RHF/PROTO -55 to +125 ISL73128RHX/SAMPLE ISL73128RHX/SAMPLE -55 to +125 PACKAGE (Pb-free) DIE NOTES: 1. These Intersil Pb-free Hermetic packaged products employ 100% Au plate - e4 termination finish, which is RoHS compliant and compatible with both SnPb and Pb-free soldering operations. 2. For Moisture Sensitivity Level (MSL), please see device information page for ISL73096RH, ISL73127RH, ISL73128RH. For more information on MSL please see techbrief TB363. Pin Configurations ISL73127RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW ISL73096RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW Q1B 1 16 NC Q1C 1 16 Q1E Q1E 2 15 Q5C Q2C 2 15 Q1B Q1C 3 14 Q5B Q2E 3 14 Q5B Q2E 4 13 Q5E Q2B 4 13 Q5E 5 12 Q5C Q2B 5 12 Q4C NC Q2C 6 11 Q4B Q3C 6 11 Q4C Q3E 7 10 Q4E Q3E 7 10 Q4E Q3B 8 9 Q3C Q3B 8 9 Q4B ISL73128RH (16 LD FLATPACK) CDFP4-F16 TOP VIEW 2 Q1C 1 16 Q1E Q2C 2 15 Q1B Q2E 3 14 Q5B Q2B 4 13 Q5E NC 5 12 Q5C Q3C 6 11 Q4C Q3E 7 10 Q4E Q3B 8 9 Q4B FN6475.3 November 12, 2009 ISL73096RH, ISL73127RH, ISL73128RH Die Characteristics DIE DIMENSIONS: ASSEMBLY RELATED INFORMATION: 52.8 mils x 52.0 mils x 14 mils ±1 mil 1340μm x 1320µm x 355.6µm ±25.4µm INTERFACE MATERIALS: Substrate Potential: Floating ADDITIONAL INFORMATION: Glassivation: Worst Case Current Density: Type: Nitride Thickness: 4kÅ ±0.5kÅ 3.04 x 105A/cm2 Transistor Count: Top Metallization: 5 Type: Metal 1: AlCu (2%)/TiW Thickness: Metal 1: 8kÅ ±0.5kÅ Type: Metal 2: AlCu (2%) Thickness: Metal 2: 16kÅ ±0.8kÅ Substrate: UHF-1X Bonded Wafer, DI Backside Finish: Silicon Metallization Mask Layout (2) Q2C (1) Q1C(16) Q1E (15) Q1B (3) Q2E (14) Q5 (4) Q2B (13) Q5 (5) NC (12) Q5 (6) Q3C (11) Q4 (7) Q3E (8) Q3B (9) Q4B(10) Q4E FIGURE 1. ISL73096RH, ISL73127RH For additional products, see www.intersil.com/product_tree Intersil products are manufactured, assembled and tested utilizing ISO9000 quality systems as noted in the quality certifications found at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 3 FN6475.3 November 12, 2009 ISL73096RH, ISL73127RH, ISL73128RH Metallization Mask Layout (Continued) (15) Q1B (2) Q2C (1) Q1C(16) Q1E (3) Q2E (14) Q5B (4) Q2B (13) Q5E (5) NC (12) Q5C (6) Q3C (11) Q4C (7) Q3E (8) Q3B (9) Q4B(10) Q4E FIGURE 2. ISL73128RH Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to web to make sure you have the latest Rev. DATE REVISION CHANGE 11/12/09 FN6475.3 Converted to new Intersil template. Changed App Note Reference from “AN9315” to “AN1503” to reflect new app note for the radiation hardened product. Updated ordering information with package column, notes to match lead finish and MSL note. 03/23/09 FN6475.2 Under Pinouts, changed DIP symbols to flatpack symbols. Changed (16 LD SBDIP) CDIP2-T16 to (16 LD Flatpack) CDFP4-F16. Under Ordering Information, added the following flatpack device types: 5962F0721801VXC (ISL73096RHVF), 5962F0721802VXC (ISL73127RHVF) and 5962F0721803VXC (ISL73128RHVF). 12/2007 FN6475.1 Added ISL73127RH & ISL73128RH device types. 03/29/07 FN6475.0 Initial Release. Products Intersil Corporation is a leader in the design and manufacture of high-performance analog semiconductors. The Company's products address some of the industry's fastest growing markets, such as, flat panel displays, cell phones, handheld products, and notebooks. Intersil's product families address power management and analog signal processing functions. Go to www.intersil.com/products for a complete list of Intersil product families. *For a complete listing of Applications, Related Documentation and Related Parts, please see the respective device information page on intersil.com: ISL73096, ISL73127RH, ISL73128RH To report errors or suggestions for this datasheet, please go to www.intersil.com/askourstaff FITs are available from our website at http://rel.intersil.com/reports/search.php 4 FN6475.3 November 12, 2009