SD103AW - SD103CW Taiwan Semiconductor Small Signal Product Low VF SMD Schottky Barrier Diode FEATURES - Low power loss, high current capability, low VF - Surface device type mounting - Moisture sensitivity level (MSL): 1 - Matte Tin (Sn) lead finish with Nickel (Ni) under plate - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC - Halogen-free according to IEC 61249-2-21 SOD-123 MECHANICAL DATA - Case: SOD-123 small outline plastic package - Molding compound, UL flammability classification rating 94V-0 - Terminal: Matte tin plated, lead free, solderable per MIL-STD-202, Method 208 guaranteed - High temperature soldering guaranteed : 260°C/10s - Polarity: Indicated by cathode band - Weight: 0.01 g (approximately) MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted) PARAMETER Power Dissipation SYMBOL SD103AW SD103BW SD103CW UNIT PD 400 mW VRRM 40 30 20 Reverse Voltage VR 28 21 14 Mean Forward Current @ TL = 100°C IO Repetitive Peak Reverse Voltage @ t ≦ 1.0 s Repetitive Peak Forward Surge Current Thermal Resistance ( Junction to Ambient ) Junction Temperature Storage Temperature Range PARAMETER Reverse Breakdown Voltage Forward Voltage Reverse Leakage Current Junction Capacitance IR = 10 μA SD103BW IR = 10 μA SD103CW IR = 10 μA IF = 20 mA IF = 200 mA SD103AW VR = 30 V SD103BW VR = 20 V SD103CW VR = 10 V VR = 0 , f = 1.0 MHz V mA IFRM 1.5 A RθJA 300 °C/W TJ 125 °C TSTG -65 to +125 °C SYMBOL SD103AW 350 V MIN TYP MAX Units - - V 40 V(BR) 30 20 VF - - IR - - CJ 50 0.37 0.60 5 V μA pF Version: D1601 SD103AW - SD103CW Taiwan Semiconductor Small Signal Product RATINGS AND CHARACTERISTICS CURVES (TA=25℃ unless otherwise noted) Fig. 1 Typical Forward Characteristics Fig. 2 Forward Current Derating Curve 0.42 100 IO, Mean Forward Current (A) Instantaneous Forward Current (A) 1000 10 1 0.1 0.01 0.0 0.2 0.4 0.6 0.8 0.35 0.28 0.21 0.14 Fig. 3 0.07 0 1.0 0 25 50 Instantaneous Forward Voltage (V) 75 100 Terminal Temperature 125 150 Fig. 4 (°C) Fig. 4 Typical Junction Capacitance Fig. 3 Admissible Dissipation Fig. Power 3 100 450 350 Junction Capacitance (pF) Power Dissipation (mW) 400 300 250 200 150 100 10 50 0 1 0 25 50 75 100 Ambient Temperature (°C) 125 150 0 10 20 30 40 Reverse Voltage (V) Version: D1601 SD103AW - SD103CW Taiwan Semiconductor Small Signal Product ORDERING INFORMATION PART NO. PACKING CODE PACKING CODE SD103xW (Note 1, 2) SUFFIX RH G PACKAGE PACKING SOD-123 3K / 7" Reel Note 1: "x" is Device Code from "A" - "C". Note 2: Whole series with green compound EXAMPLE EXAMPLE P/N PART NO. PACKING CODE SD103AW RHG SD103AW RH PACKING CODE DESCRIPTION SUFFIX G Green compound PACKAGE OUTLINE DIMENSIONS SOD-123 DIM. Unit (mm) Unit (inch) Min Max Min Max A 1.40 1.80 0.055 0.071 B 3.55 3.85 0.140 0.152 C 0.45 0.70 0.018 0.028 D 2.55 2.85 0.100 0.112 E 0.95 1.35 0.037 0.053 F 0.05 0.15 0.002 0.006 G 0.50 REF 0.02 REF H - - 0.10 0.004 SUGGEST PAD LAYOUT Unit (mm) Unit (inch) Min Min G 2.25 0.089 X 0.90 0.035 X1 4.05 0.159 Y 0.95 0.037 DIM. MARKING Part No. Marking SD103AW S4 SD103BW S5 SD103CW S6 Version: D1601 SD103AW - SD103CW Taiwan Semiconductor Small Signal Product CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors or inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied, to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or selling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Version: D1601