TSP10U60S_E15.pdf

TSP10U60S
Taiwan Semiconductor
10A, 60V Trench Schottky Rectifier
FEATURES
- Patented Trench Schottky technology
- Excellent high temperature stability
- Low forward voltage
- Lower power loss/ high efficiency
- High forward surge capability
- Ideal for automated placement
- Compliant to RoHS Directive 2011/65/EU and
in accordance to WEEE 2002/96/EC
- Halogen-free according to IEC 61249-2-21 definition
TO-277A (SMPC)
MECHANICAL DATA
Case: TO-277A (SMPC)
Molding compound, UL flammability classification rating 94V-0
Moisture sensitivity level: level 1, per J-STD-020
Packing code with suffix "G" means green compound (halogen-free)
Terminal: Matte tin plated leads, solderable per JESD22-B102
Meet JESD 201 class 2 whisker test
Polarity: Indicated by cathode band
Weight: 0.095g (approximately)
MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS (TA=25°C unless otherwise noted)
PARAMETER
TSP10U60S
SYMBOL
Marking code
UNIT
10U60
Maximum repetitive peak reverse voltage
VRRM
60
V
Maximum average forward rectified current
IF(AV)
10
A
Peak forward surge current, 8.3 ms single half sine-wave
superimposed on rated load
IFSM
280
A
Maximum instantaneous forward voltage
(Note 1)
IF = 5A
IF = 10A
IF = 10A
Maximum instantaneous reverse current
at rated reverse voltage
TJ = 25°C
VF
TJ = 125°C
TJ = 25°C
TJ = 125°C
IR
MIN
TYP
MAX
-
0.40
-
-
0.47
0.54
-
0.43
0.47
-
80
300
μA
-
-
100
mA
V
Maximum DC reverse voltage
VDC
42
V
Typical thermal resistance
RθJL
5
°C/W
TJ
- 55 to +150
°C
TSTG
- 55 to +150
°C
Operating junction temperature range
Storage temperature range
Note 1: Pulse Test with Pulse Width=300 μs, 1% Duty Cycle
Document Number: DS_D1411029
Version: E15
TSP10U60S
Taiwan Semiconductor
ORDERING INFORMATION
PACKING CODE
PACKING CODE
PART NO.
SUFFIX
S1
TSP10U60S
G
S2
PACKAGE
PACKING
SMPC
1,500/ 7" Plastic reel
SMPC
6,000/ 13" Plastic reel
Note: Whole series with green compound
EXAMPLE
PREFERRED
PART NO.
TSP10U60S S1G
PART NO.
PACKING CODE
TSP10U60S
S1
PACKING CODE
DESCRIPTION
SUFFIX
G
Green compound
RATINGS AND CHARACTERISTICS CURVES
(TA=25oC unless otherwise noted)
FIG.1 FORWARD CURRENT DERATING CURVE
FIG. 2 TYPICAL FORWARD CHARACTERISTICS
100
INSTANTANEOUS FORWARD CURRENT (A)
AVERAGE FORWARD CURRENT (A)
20
15
10
5
WITH HEATSINK
30mm x 30mm 4 oz.
pad PCB
0
0
25
50
75
100
125
10
TJ=150oC
TJ=125oC
1
TJ=100oC
0.1
TJ=85oC
TJ=25oC
0.01
150
0
0.1
0.2
LEAD TEMPERATURE (oC)
0.4
0.5
0.6
FORWARD VOLTAGE (V)
FIG. 3 TYPICAL REVERSE CHARACTERISTICS
FIG. 4 TYPICAL JUNCTION CAPACITANCE
100
10000
TJ=150oC
10
TJ=125oC
CAPACITANCE (pF)
INSTANTANEOUS REVERSE CURRENT (mA)
0.3
TJ=100oC
1
TJ=85oC
0.1
1000
f=1.0MHz
Vsig=50mVp-p
TJ=25oC
0.01
10
20
30
40
50
60
70
80
PERCENT OF RATED PEAK REVERSE VOLTAGE.(%)
Document Number: DS_D1411029
90
100
100
0.1
1
10
100
REVERSE VOLTAGE (V)
Version: E15
TSP10U60S
Taiwan Semiconductor
FIG. 5 MAXIMUM NON-REPETITIVE FORWARD
SURGE CURRENT
PEAK FORWARD SURGE CURRENT (A)
300
270
8.3ms Single Half Sine Wave
240
210
180
150
120
90
60
30
0
1
10
NUMBER OF CYCLES AT 60 Hz
Document Number: DS_D1411029
100
Version: E15
TSP10U60S
Taiwan Semiconductor
PACKAGE OUTLINE DIMENSIONS
TO-277A (SMPC)
DIM.
Unit (mm)
Unit (inch)
Min
Max
Min
Max
A
5.650
5.750
0.222
0.226
B
6.350
6.650
0.250
0.262
C
4.550
4.650
0.179
0.183
D
3.540
3.840
0.139
0.151
E
4.235
4.535
0.167
0.179
F
1.850
2.150
0.073
0.085
G
3.170
3.470
0.125
0.137
H
I
1.043
1.000
1.343
1.300
0.041
0.039
0.053
0.051
J
1.930
2.230
0.076
0.088
K
0.175
0.325
0.007
0.013
L
1.000
1.200
0.039
0.047
SUGGESTED PAD LAYOUT
Symbol
Unit (mm)
Unit (inch)
A
4.80
0.189
B
4.72
0.186
C
1.40
0.055
D
1.27
0.050
E
6.80
0.268
F
1.04
0.041
MARKING DIAGRAM
P/N
= Marking Code
YW
= Date Code
F
= Factory Code
Document Number: DS_D1411029
Version: E15
TSP10U60S
Taiwan Semiconductor
CREAT BY ART
Notice
Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf,
assumes no responsibility or liability for any errors or inaccuracies.
Information contained herein is intended to provide a product description only. No license, express or implied, to
any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of
sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty,
relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose,
merchantability, or infringement of any patent, copyright, or other intellectual property right.
The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications.
Customers using or selling these products for use in such applications do so at their own risk and agree to fully
indemnify TSC for any damages resulting from such improper use or sale.
Document Number: DS_D1411029
Version: E15