TSP10U60S Taiwan Semiconductor Trench Schottky Rectifier FEATURES - Patented Trench Schottky technology - Excellent high temperature stability - Low forward voltage - Lower power loss/ High efficiency - High forward surge capability - Ideal for automated placement - Moisture sensitivity level: level 1, per J-STD-020 - Compliant to RoHS Directive 2011/65/EU and in accordance to WEEE 2002/96/EC TO-277A (SMPC) - Halogen-free according to IEC 61249-2-21 definition MECHANICAL DATA Case: TO-277A (SMPC) Molding compound, UL flammability classification rating 94V-0 Base P/N with suffix "G" on packing code - halogen-free Terminal: Matte tin plated leads, solderable per JESD22-B102 Meet JESD 201 class 1A whisker test Polarity: Indicated by cathode band Weight: 0.095g (approximately) o MAXIMUM RATINGS AND ELECTRICAL CHARACTERISTICS(TA=25 C unless otherwise noted) PARAMETER TSP10U60S Symbol Marking code UNIT 10U60 Maximum repetitive peak reverse voltage VRRM 60 V Maximum average forward rectified current (Note 1) IF(AV) 10 A Peak forward surge current, 8.3 ms single half sine-wave superimposed on rated load per diode IFSM 280 A Maximum instantaneous forward voltage per diode (Note 2) IF = 5A IF = 10A IF = 10A Maximum instantaneous reverse current per diode at rated reverse voltage TJ = 25°C VF TJ = 125°C TJ = 25°C TJ = 125°C Maximum DC reverse voltage IR VDC MIN TYP MAX - 0.40 - - 0.47 0.54 - 0.43 0.47 - 80 300 μA - - 100 mA V 42 V O Typical thermal resistance per diode RθjC 6 Operating junction temperature range TJ - 40 to +150 O C - 40 to +150 O C Storage temperature range TSTG C/W Note1 : Mounted on 30 mm x 30 mm 4 oz. pad PCB Note2 : Pulse Test with Pulse Width=300 μs, 1% Duty Cycle Document Number: DS_D1311023 Version: A13 TSP10U60S Taiwan Semiconductor ORDERING INFORMATION GREEN COMPOUND PACKING CODE PART NO. CODE S1 TSP10U60S Suffix "G" S2 PACKAGE PACKING SMPC 1,500/ 7" Plastic reel SMPC 6,000/ 13" Plastic reel Note : For SMPC: Packing code (Whole series with green compound) EXAMPLE PREFERRED P/N PART NO. PACKING CODE TSP10U60S S1G TSP10U60S S1 GREEN COMPOUND DESCRIPTION CODE G Green compound RATINGS AND CHARACTERISTICS CURVES (TA=25oC unless otherwise noted) FIG.1 FORWARD CURRENT DERATING CURVE FIG. 2 TYPICAL FORWARD CHARACTERISTICS 100 INSTANTANEOUS FORWARD CURRENT (A) AVERAGE FORWARD CURRENT (A) 20 15 10 5 WITH HEATSINK 30mm x 30mm 4 oz. pad PCB 0 0 25 50 75 100 CASE TEMPERATURE 125 10 TJ=125oC 1 TJ=100oC 0.1 TJ=85oC TJ=25oC 0.01 150 0 0.1 0.2 (oC) 0.3 0.4 0.5 0.6 FORWARD VOLTAGE (V) FIG. 3 TYPICAL REVERSE CHARACTERISTICS FIG. 4 TYPICAL JUNCTION CAPACITANCE 100 10000 TJ=150oC 10 TJ=125oC CAPACITANCE (pF) INSTANTANEOUS REVERSE CURRENT (mA) TJ=150oC TJ=100oC 1 1000 TJ=85oC 0.1 f=1.0MHz Vsig=50mVp-p TJ=25oC 0.01 10 20 30 40 50 60 70 80 PERCENT OF RATED PEAK REVERSE VOLTAGE.(%) Document Number: DS_D1311023 90 100 100 0.1 1 10 100 REVERSE VOLTAGE (V) Version: A13 TSP10U60S Taiwan Semiconductor PACKAGE OUTLINE DIMENSIONS DIM. Unit (mm) Unit (inch) Min Max Min Max A 5.650 5.750 0.222 0.226 B 6.350 6.650 0.250 0.262 C 4.550 4.650 0.179 0.183 D 3.540 3.840 0.139 0.151 E 4.235 4.535 0.167 0.179 F 1.850 2.150 0.073 0.085 G 3.170 3.470 0.125 0.137 H I 1.043 1.000 1.343 1.300 0.041 0.039 0.053 0.051 J 1.930 2.230 0.076 0.088 K 0.175 0.325 0.007 0.013 L 1.000 1.200 0.039 0.047 SUGGESTED PAD LAYOUT Symbol Unit (mm) Unit (inch) A 4.80 0.189 B 4.72 0.186 C 1.40 0.055 D 1.27 0.050 E 6.80 0.268 F 1.04 0.041 MARKING DIAGRAM P/N = Marking Code YW = Date Code F = Factory Code Document Number: DS_D1311023 Version: A13 TSP10U60S Taiwan Semiconductor CREAT BY ART Notice Specifications of the products displayed herein are subject to change without notice. TSC or anyone on its behalf, assumes no responsibility or liability for any errors inaccuracies. Information contained herein is intended to provide a product description only. No license, express or implied,to any intellectual property rights is granted by this document. Except as provided in TSC's terms and conditions of sale for such products, TSC assumes no liability whatsoever, and disclaims any express or implied warranty, relating to sale and/or use of TSC products including liability or warranties relating to fitness for a particular purpose, merchantability, or infringement of any patent, copyright, or other intellectual property right. The products shown herein are not designed for use in medical, life-saving, or life-sustaining applications. Customers using or seling these products for use in such applications do so at their own risk and agree to fully indemnify TSC for any damages resulting from such improper use or sale. Document Number: DS_D1311023 Version: A13