TM HFA3046/3096/3127/3128 Transistor Array SPICE Models Application Note February 1994 MM3046.1 Introduction Package Models This application note describes the SPICE transistor models for the bipolar devices that comprise the HFA3046, HFA3096, HFA3127, and HFA3128 Ultra High Frequency Transistor Arrays. These arrays are fabricated on Intersil's complementary bipolar UHF1 process and contain a combination of NPN and/or PNP transistors. These transistors exhibit peak fT's of 9 GHz and 5.5 GHz respectively, as illustrated by the included performance curves. Rudimentary models for the available packages are included at the back of this application note. These models are preliminary and are a best estimate of package parasitics based on measurements and industry literature. Because package parasitics can be the limiting factor in high frequency circuits, simulations with these package models should not be considered a substitute for breadboarding the design. Parameters Not Modeled Model Description Some effects haven’t been included in this model. The major exclusions are listed below: While this model was developed for the PSpice simulator from MicroSim Corporation, it may be adaptable to other simulators. The performance curves included in this document were generated using PSpice. A cdsSpice compatible version of the model is available upon request. • Temperature Effects • Breakdown Effects Future releases of this model may include some of these effects. The PSpice model contains parameters for UHF NPN and PNP transistors. Only transistor type determines model selection, since all transistors within a type have the same geometry. The models emulate typical rather than worst case devices, at an ambient temperature of 25oC. 3-1 1-888-INTERSIL or 321-724-7143 | Intersil and Design is a trademark of Intersil Corporation. | Copyright © Intersil Corporation 2000 Application Note MM3046 PSpice Listing * *COPYRIGHT © 1994 INTERSIL CORPORATION *ALL RIGHTS RESERVED * *HFA3046/3096/3127/3128 PSpice MODEL *REV: 1-3-94 * ***** UHFN - LE = 3 WE = 50 ***** * * ----- BJT MODELS ----- * .model NUHFARRY NPN + (IS = 1.840E - 16 XTI= 3.000E + 00 EG = 1.110E + 00 + + VAF = 7.200E + 01 VAR = 4.500E + 00 BF = 1.036E + 02 ISE = 1.686E - 19 NE = 1.400E + 00 IKF = 5.400E - 02 XTB = 0.000E + 00 BR = 1.000E + 01 ISC = 1.605E - 14 + NC = 1.800E + 00 IKR = 5.400E - 02 RC = 1.140E + 01 CJC = 3.980E - 13 + MJC = 2.400E - 01 VJC = 9.700E - 01 FC = 5.000E - 01 CJE = 2.400E - 13 + MJE = 5.100E- 01 VJE = 8.690E - 01 TR = 4.000E - 09 TF = 10.51E - 12 + ITF = 3.500E - 02 XTF = 2.300E + 00 VTF = 3.500E + 00 PTF = 0.000E + 00 + XCJC = 9.000E - 01 CJS = 1.150E - 13 VJS = 7.500E - 01 MJS = 0.000E + 00 + RE = 1.848E + 00 RB = 5.007E + 01 RBM = 1.974E + 00 KF = 0.000E + 00 + AF = 1.000E + 00) * * ***** UHFP - LE = 3 WE = 50 **** * .model PUHFARRY PNP + (IS = 1.027E - 16 XTI = 3.000E + 00 EG = 1.110E + 00 VAF = 3.000E + 01 + VAR = 4.500E + 00 BF = 5.228E + 01 ISE = 9.398E - 20 NE = 1.400E + 00 + IKF = 5.412E - 02 XTB = 0.000E + 00 BR = 7.000E + 00 ISC = 1.027E - 14 + NC = 1.800E + 00 IKR = 5.412E - 02 RC = 3.420E + 01 CJC = 4.951E - 13 + MJC = 3.000E - 01 VJC = 1.230E + 00 FC = 5.000E - 01 CJE = 2.927E - 13 + MJE = 5.700E - 01 VJE = 8.800E - 01 TR = 4.000E - 09 TF = 20.05E - 12 + ITF = 2.001E - 02 XTF = 1.534E + 00 VTF = 1.800E + 00 PTF = 0.000E + 00 + XCJC = 9.000E - 01 CJS = 1.150E - 13 VJS = 7.500E - 01 MJS = 0.000E + 00 + RE = 1.848E + 00 RB= 3.271E + 01 RBM = 9.902E - 01 KF = 0.000E + 00 + AF = 1.000E + 00) 3-2 Application Note MM3046 Model Performance 12 8 VCE = -3V VCE = 5V VCE = -5V 10 6 VCE = 3V 6 fT (GHz) fT (GHz) 8 VCE = 1V 4 VCE = -1V 4 2 2 0 100µA 300µA 1.0mA 3.0mA IC 10mA 30mA 0 -100µA 100mA -300µA FIGURE 1. NPN fT vs IC -3.0mA IC -10mA -30mA -100mA -5 -6 FIGURE 2. PNP fT vs IC 30 -12 IB = 500µA 25 IB = 400µA -10 20 IB = 300µA -8 15 IB = 200µA 10 IB = 100µA IC (mA) IC (mA) -1.0mA IB = - 500µA IB = -400µA IB = -300µA -6 IB = -200µA -4 IB = -100µA 5 -2 0 0 1 2 3 4 5 0 6 0 -1 -2 -3 VCE (V) VCE (V) FIGURE 3. NPN IC vs VCE -4 FIGURE 4. PNP IC vs VCE 70 110 VCE = 5V 60 100 VCE = -5V 50 90 hFE hFE VCE = 3V VCE = 1V 80 40 VCE = -3V VCE = -1V 30 70 20 60 50 1nA 10 -1nA 10nA 100nA 1µA 10µA 100µA IC FIGURE 5. NPN hFE vs IC 3-3 1mA 10mA -10nA -100nA -1µA -10µA -100µA -1mA IC FIGURE 6. PNP hFE vs IC -10mA Application Note MM3046 Model Performance (Continued) 100mA -100mA VCB = 0V VCB = 0V 1mA -1mA IC IC 10µA -10µA IB IB 100nA -100nA 1nA 0.4 0.5 0.6 0.7 VBE (V) 0.8 0.9 -1nA -1.0 1.0 -0.9 -0.8 -0.7 -0.6 -0.5 -0.4 VBE (V) FIGURE 7. NPN IC AND IB vs VBE FIGURE 8. PNP IC AND IB vs VBE Package Models Equivalent Circuit: LL LB LEAD NO. 1 CL PCB INTERFACE CM LL LEAD NO. 2 DIE INTERFACE LB WHERE: CL = LEAD CAP. TO PCB GND PLANE, CM = LEAD TO LEAD CAP., LL = LEAD INDUCTANCE, LB = BOND WIRE INDUCTANCE CL ELEMENT VALUES 14 LEAD SOIC 16 LEAD SOIC LEAD NO. CL CM LL LB CL CM LL LB 1 0.2pF 0.05pF 1.9nH 1.1nH 0.2pF 0.05pF 2.1nH 1.1nH 2 0.2pF 0.05pF 1.3nH 1.1nH 0.2pF 0.05pF 1.5nH 1.1nH 3 0.2pF 0.05pF 0.9nH 1.1nH 0.2pF 0.05pF 0.9nH 1.1nH 4 0.2pF 0.05pF 0.7nH 1.1nH 0.2pF 0.05pF 0.7nH 1.1nH 5 0.2pF 0.05pF 0.9nH 1.1nH 0.2pF 0.05pF 0.7nH 1.1nH 6 0.2pF 0.05pF 1.3nH 1.1nH 0.2pF 0.05pF 0.9nH 1.1nH 7 0.2pF 0.05pF 1.9nH 1.1nH 0.2pF 0.05pF 1.5nH 1.1nH 8 0.2pF 0.05pF 1.9nH 1.1nH 0.2pF 0.05pF 2.1nH 1.1nH 9 0.2pF 0.05pF 1.3nH 1.1nH 0.2pF 0.05pF 2.1nH 1.1nH 10 0.2pF 0.05pF 0.9nH 1.1nH 0.2pF 0.05pF 1.5nH 1.1nH 11 0.2pF 0.05pF 0.7nH 1.1nH 0.2pF 0.05pF 0.9nH 1.1nH 12 0.2pF 0.05pF 0.9nH 1.1nH 0.2pF 0.05pF 0.7nH 1.1nH 13 0.2pF 0.05pF 1.3nH 1.1nH 0.2pF 0.05pF 0.7nH 1.1nH 14 0.2pF 0.05pF 1.9nH 1.1nH 0.2pF 0.05pF 0.9nH 1.1nH 15 X X X X 0.2pF 0.05pF 1.5nH 1.1nH 16 X X X X 0.2pF 0.05pF 2.1nH 1.1nH 3-4 Application Note MM3046 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil semiconductor products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site www.intersil.com Sales Office Headquarters NORTH AMERICA Intersil Corporation P. O. Box 883, Mail Stop 53-204 Melbourne, FL 32902 TEL: (321) 724-7000 FAX: (321) 724-7240 3-5 EUROPE Intersil SA Mercure Center 100, Rue de la Fusee 1130 Brussels, Belgium TEL: (32) 2.724.2111 FAX: (32) 2.724.22.05 ASIA Intersil (Taiwan) Ltd. 7F-6, No. 101 Fu Hsing North Road Taipei, Taiwan Republic of China TEL: (886) 2 2716 9310 FAX: (886) 2 2715 3029