527AD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
SOT−963
CASE 527AD−01
ISSUE E
DATE 09 FEB 2010
SCALE 4:1
X
Y
D
6
5
4
1
2
3
A
HE
E
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME
Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD
FLASH, PROTRUSIONS, OR GATE BURRS.
DIM
A
b
C
D
E
e
HE
L
L2
C
SIDE VIEW
TOP VIEW
e
6X
6X L2
6X
BOTTOM VIEW
L
MILLIMETERS
MIN
NOM
MAX
0.34
0.37
0.40
0.10
0.15
0.20
0.07
0.12
0.17
0.95
1.00
1.05
0.75
0.80
0.85
0.35 BSC
0.95
1.00
1.05
0.19 REF
0.05
0.10
0.15
GENERIC
MARKING DIAGRAM*
b
0.08 X Y
XM
1
STYLE 1:
PIN 1. EMITTER 1
2. BASE 1
3. COLLECTOR 2
4. EMITTER 2
5. BASE 2
6. COLLECTOR 1
STYLE 2:
PIN 1. EMITTER 1
2. EMITTER2
3. BASE 2
4. COLLECTOR 2
5. BASE 1
6. COLLECTOR 1
STYLE 3:
PIN 1. CATHODE 1
2. CATHODE 1
3. ANODE/ANODE 2
4. CATHODE 2
5. CATHODE 2
6. ANODE/ANODE 1
STYLE 4:
PIN 1. COLLECTOR
2. COLLECTOR
3. BASE
4. EMITTER
5. COLLECTOR
6. COLLECTOR
STYLE 5:
PIN 1. CATHODE
2. CATHODE
3. ANODE
4. ANODE
5. CATHODE
6. CATHODE
STYLE 6:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. CATHODE
6. CATHODE
STYLE 7:
PIN 1. CATHODE
2. ANODE
3. CATHODE
4. CATHODE
5. ANODE
6. CATHODE
STYLE 8:
PIN 1. DRAIN
2. DRAIN
3. GATE
4. SOURCE
5. DRAIN
6. DRAIN
STYLE 9:
PIN 1. SOURCE 1
2. GATE 1
3. DRAIN 2
4. SOURCE 2
5. GATE 2
6. DRAIN 1
STYLE 10:
PIN 1. CATHODE 1
2. N/C
3. CATHODE 2
4. ANODE 2
5. N/C
6. ANODE 1
DOCUMENT NUMBER:
X
M
= Specific Device Code
= Month Code
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
MOUNTING FOOTPRINT
6X
0.20
6X
0.35
PACKAGE
OUTLINE
1.20
0.35
PITCH
DIMENSIONS: MILLIMETERS
98AON26456D
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
SOT−963, 1X1, 0.35P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
1
1
DOCUMENT NUMBER:
98AON26456D
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
08 FEB 2008
A
UPDATED DIMENSION C VALUES. REQ. BY D. TRUHITTE.
26 MAR 2008
B
CHANGED DATUM BOXES OF X AND Y TO JEDEC STANDARDS OF A, B & C.
REMOVED PB−FREE DOT FROM MARKING. REQ. BY D. TRUHITTE.
11 APR 2008
C
CORRECTED DEVICE MARKING INFORMATION TO REFLECT ONLY ONE CHARACTER FOR DEVICE CODE. REQ. BY D. TRUHITTE.
06 MAY 2008
D
CORRECTED ENGLISH DIMENSIONS FOR PAD SIZES ON SOLDERING FOOTPRINT FROM 0.08 TO 0.008. REQ. BY D. TRUHITTE.
30 JUL 2008
E
REDREW DRAWING TO SHOW BOTTOM VIEW AND REFLECT LENGTH OF
LEADS. CORRECTED SOLDER FOOTPRINT. REQ. BY D. TRUHITTE.
09 FEB 2010
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2010
February, 2010 − Rev. 01E
Case Outline Number:
527AD