517CP

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
UDFN18, 5.5x1.5, 0.5P/0.75P
CASE 517CP
ISSUE A
18
1
SCALE 2:1
PIN ONE
REFERENCE
2X
0.10 C
2X
ÏÏ
0.10 C
L2
A B
D
E
L
DETAIL A
A
DETAIL B
0.05 C
D3
DETAIL C
ÏÏ
ÎÎ
ÏÏ
ÎÎ
EXPOSED Cu
(A3)
A1
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.10 AND 0.20 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
5. EXPOSED ENDS OF TERMINALS ARE
ELECTRICALLY ACTIVE.
MOLD CMPD
DIM
A
A1
A3
b
D
D2
D3
E
E2
eA
eB
eC
L
L2
DETAIL B
0.10 C
NOTE 4
C
SIDE VIEW
1
DETAIL C
SEATING
PLANE
OPTIONAL
CONSTRUCTION
D2
eA
DETAIL A
D3
OPTIONAL
CONSTRUCTION
TOP VIEW
DATE 07 FEB 2013
11
18
12
eB
eC
NOTE 5
E2
18X
L
b
0.10
M
C A B
0.05
M
C
END VIEW
GENERIC
MARKING DIAGRAM*
XXXXM
G
NOTE 3
BOTTOM VIEW
XXXX
M
G
RECOMMENDED
SOLDERING FOOTPRINT*
6X
3X
6X
0.13
3X 0.50
0.45
0.75
PITCH
0.13
0.50
18X
0.50
MILLIMETERS
MIN
MAX
0.45
0.55
0.00
0.05
0.13 REF
0.15
0.25
5.50 BSC
0.35
0.45
0.10 REF
1.50 BSC
0.35
0.45
0.50 BSC
0.75 BSC
1.50 BSC
0.20
0.40
0.10 REF
= Specific Device Code
= Date Code
= Pb−Free Package
*This information is generic. Please refer
to device data sheet for actual part
marking.
1.80
1
0.50
PITCH
NOTE: CENTER PADS OPTIONAL
17X
0.30
1.50
PITCH
DIMENSION: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON84709E
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
UDFN18, 5.5X1.5, 0.5P/0.75P 1
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON84709E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
09 NOV 2012
A
ADDED PIN 1 TERMINAL OPTION DETAILS AND L2 DIMENSION. REQ. BY D.
TRUHITTE.
07 FEB 2013
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2013
February, 2013 − Rev. A
Case Outline Number:
517CP