LTM2881 32LD, BGA-Pb, 15mm X 11.25mm X 3.42mm (TABLE OF MATERIAL DECLARATION) contains > 1000 ppm of Lead in the terminations No. Part Name Material Name 1 Substrate Circuit Board Component Weight (gram) 0.1592 Solder Paste Alloy 0.0064 3 Epoxy 0.0056 4 0.1936 5 6 7 Passive/Active Components Active Ics Wire Encapsulation Silicon Gold Epoxy Resin 0.0046 0.0012 0.6855 7 Solder Ball Alloy 0.0611 Materials Analysis (weight %) 1.58 0.04146 26.04 0.07459 0.00002 46.85 0.01 0.00001 0.01 0.00032 0.00204 0.00008 0.03257 0.00479 0.00005 0.00000 0.00003 0.20 1.28 0.05 20.46 3.01 0.03 0.00 0.02 14807-96-9 0.00029 0.18 461-58-5 7440-31-5 7440-36-0 7440-22-4 7440-21-3 7440-57-5 60676-86-0 14808-60-7 1333-86-4 7440-31-5 7439-92-1 0.00027 0.00001 0.00000 0.00004 0.00011 0.00606 0.00032 0.00045 0.00045 0.00469 0.07363 0.11994 0.00456 0.00118 0.52921 0.06101 0.06101 0.02057 0.00343 0.01028 0.03846 0.02259 0.17 0.01 0.00 0.02 0.07 95.00 5.00 8.00 8.00 84.00 38.04 61.96 100.00 99.99 77.20 8.90 8.90 3.00 0.50 1.50 63.00 37.00 CAS Number Barium Compounds Bismaleimide/Triazine/Resin/Filler Substances (Silica Crystalline) Copper Metal Copper Compounds Gold metal or alloy Nickel Zinc Continuos Filament Fiber Glass Acrylic Resin Epoxy Resin Chromium(III) Oxide Silica amorphous 7727-43-7 13776-74-4, 7631-86-9 7440-50-8 1328-53-6 7440-38-2, 7440-28-0 7440-57-5 7440-02-0 7440-66-6 1308-38-9 7631-86-9 Talc;not containing fibers like asbestos Aromatic Carbonyl compounds Cyanoguanidine Imidazole system curing reagent Amine compounds Leveling agent and others Sn Sb Di-ester resin Functionalized ester Silver Capacitor Transformer Silicon Au Fused Silica Epoxy Resin Phenol Resin Crytalline Silica Carbon Black Metal Hydroxide Tin (Sn) Lead (Pb) Ecotoxic substances 2 Material Mass (gram) 0.00252 Materials Analysis (element) Total Package Weight 1.1170 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts