No. 1 October 2009 LTM2881 32LD 15mm X 11.25mm X 2.82mm (TABLE OF MATERIAL DECLARATION) The LTM2881 is RoHS compliant per EU RoHS Directive 2003/95/EC. It contains less than 100ppm cadmium (Cd) and less than 1,000ppm of each - lead (Pb), mercury (Hg), hexavalent chromium (Cr+), polybrominated biphenyl (PBB) and polybrominated diphenyl ether (PBDE) Material Mass Materials Analysis Component Materials Analysis (element) CAS Number Part Name Material Name (gram) (weight %) Weight (gram) Barium Compounds 7727-43-7 0.00252 1.5800 0.1592 Substrate Circuit Board Bismaleimide/Triazine/Resin/Filler 13776-74-4, 0.04146 26.0400 Substances (Silica Crystalline) 7631-86-9 Copper Metal 7440-50-8 0.07459 46.8500 Copper Compounds 1328-53-6 0.00002 0.0140 7440-38-2, Ecotoxic substances 0.00001 0.0050 7440-28-0 Gold metal or alloy 7440-57-5 0.00032 0.2000 Nickel 7440-02-0 0.00204 1.2800 Zinc 7440-66-6 0.00008 0.0510 Continuos Filament Fiber Glass 0.03257 20.4600 Acrylic Resin 0.00479 3.0100 Epoxy Resin 0.00005 0.0340 Chromium(III) Oxide 1308-38-9 0.00000 0.0020 Silica amorphous 7631-86-9 0.00003 0.0190 Alloy 0.0064 2 Solder Paste 3 Epoxy 0.0056 4 Passive/Active Components Active Ics Wire Encapsulation 0.1936 5 6 7 Silicon Gold Epoxy Resin 0.0046 0.0012 0.6855 Talc;not containing fibers like asbestos 14807-96-9 0.00029 0.1800 Aromatic Carbonyl compounds Cyanoguanidine Imidazole system curing reagent Amine compounds Leveling agent and others Sn Sb Di-ester resin Functionalized ester Silver Capacitor Transformer Silicon Au Fused Silica Epoxy Resin Phenol Resin Crytalline Silica Carbon Black Metal Hydroxide 461-58-5 7440-31-5 7440-36-0 7440-22-4 7440-21-3 7440-57-5 60676-86-0 14808-60-7 1333-86-4 - 0.00027 0.00001 0.00000 0.00004 0.00011 0.00606 0.00032 0.00045 0.00045 0.00469 0.07363 0.11994 0.00456 0.00118 0.52917 0.06101 0.06101 0.02056 0.00343 0.01028 0.1700 0.0050 0.0030 0.0220 0.0690 95.0000 5.0000 8.0000 8.0000 84.0000 38.0379 61.9621 100.0000 99.9900 77.2000 8.9000 8.9000 3.0000 0.5000 1.5000 Total Package Weight 1.0560 Note: Composition derived from MSDS and material C of C from Vendors Component Weight based on assembly of generic parts