D-3 PDTD113Z/123Y/143XQA series DF N1 010 50 V, 500 mA NPN resistor-equipped transistors Rev. 1 — 31 March 2016 Product data sheet 1. Product profile 1.1 General description NPN Resistor-Equipped Transistor (RET) family in a leadless ultra small DFN1010D-3 (SOT1215) Surface-Mounted Device (SMD) plastic package with visible and solderable side pads. Table 1. Product overview Type number R1 R2 Package NXP PNP complement PDTD113ZQA 1 k 10 k PDTB113ZQA PDTD123YQA 2.2 k 10 k DFN1010D-3 (SOT1215) PDTD143XQA 4.7 k 10 k PDTB123YQA PDTB143XQA 1.2 Features and benefits 500 mA output current capability Built-in bias resistors 10% resistor ratio tolerance Simplifies circuit design Reduces component count Reduced pick and place costs Low package height of 0.37 mm Suitable for Automatic Optical Inspection (AOI) of solder joint AEC-Q101 qualified 1.3 Applications Digital applications Cost saving alternative for BC807/BC817 series in digital applications Controlling IC inputs Switching loads 1.4 Quick reference data Table 2. Quick reference data Symbol Parameter Conditions Min Typ Max Unit VCEO collector-emitter voltage open base - - 50 V IO output current - - 500 mA PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 2. Pinning information Table 3. Pinning Pin Symbol Description 1 I input (base) 2 GND GND (emitter) Simplified outline Graphic symbol O 1 3 O output (collector) 4 O output (collector) R1 I 4 3 R2 GND 2 aaa-019964 Transparent top view 3. Ordering information Table 4. Ordering information Type number PDTD113ZQA PDTD123YQA PDTD143XQA Package Name Description Version DFN1010D-3 plastic thermal enhanced ultra thin small outline package; no leads; 3 terminals; body: 1.1 1.0 0.37 mm SOT1215 PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 2 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 4. Marking Table 5. Marking codes Type number Marking code PDTD113ZQA 01 11 11 PDTD123YQA 10 00 11 PDTD143XQA 01 10 01 4.1 Binary marking code description READING DIRECTION MARKING CODE (EXAMPLE) YEAR DATE CODE VENDOR CODE PIN 1 INDICATION MARK MARK-FREE AREA READING EXAMPLE: 11 01 10 aaa-008041 Fig 1. SOT1215 binary marking code description 5. Limiting values Table 6. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VCBO collector-base voltage open emitter - 50 V VCEO collector-emitter voltage open base - 50 V VEBO emitter-base voltage open collector PDTD113ZQA - 5 V PDTD123YQA - 5 V PDTD143XQA - 7 V PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 3 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors Table 6. Limiting values …continued In accordance with the Absolute Maximum Rating System (IEC 60134). Symbol Parameter Conditions Min Max Unit VI input voltage PDTD113ZQA 5 +10 V PDTD123YQA 5 +12 V PDTD143XQA 7 +30 V output current IO total power dissipation Ptot Tamb 25 C - 500 mA [1] - 325 mW [2] - 575 mW [3] - 525 mW [4] - 940 mW Tj junction temperature - 150 C Tamb ambient temperature 55 +150 C Tstg storage temperature 65 +150 C [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated; mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated; mounting pad for collector 1 cm2. aaa-020051 1 (1) Ptot (W) 0.8 0.6 (2) (3) 0.4 (4) 0.2 0 -75 -25 25 75 125 175 Tamb (ºC) (1) FR4 PCB, 4-layer copper, 1 cm2 (2) FR4 PCB, single-sided copper, 1 cm2 (3) FR4 PCB, 4-layer copper, standard footprint (4) FR4 PCB, single sided copper, standard footprint Fig 2. Power derating curves PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 4 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 6. Thermal characteristics Table 7. Thermal characteristics Symbol Parameter Conditions thermal resistance from junction to ambient Rth(j-a) in free air Min Typ Max Unit [1] - - 385 K/W [2] - - 218 K/W [3] - - 239 K/W [4] - - 133 K/W - - 40 K/W thermal resistance from junction to solder point Rth(j-sp) [1] Device mounted on an FR4 Printed-Circuit Board (PCB), single-sided copper, tin-plated and standard footprint. [2] Device mounted on an FR4 PCB, single-sided copper, tin-plated; mounting pad for collector 1 cm2. [3] Device mounted on an FR4 PCB, 4-layer copper, tin-plated and standard footprint. [4] Device mounted on an FR4 PCB, 4-layer copper, tin-plated; mounting pad for collector 1 cm2. aaa-020053 103 duty cycle = 1 Zth(j-a) (K/W) 0.75 0.5 0.33 102 0.2 0.1 0.05 10 0.02 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, single-sided copper, tin-plated and standard footprint. Fig 3. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 5 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020054 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, single-sided copper, tin-plated, mounting pad for collector 1 cm2. Fig 4. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values aaa-020058 103 Zth(j-a) (K/W) duty cycle = 1 0.75 102 0.5 0.33 0.2 0.1 0.05 10 0.02 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, 4-layer copper, tin-plated and standard footprint. Fig 5. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 6 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020057 103 Zth(j-a) (K/W) duty cycle = 1 102 0.75 0.5 0.33 0.2 0.1 10 0.05 0.02 0.01 0 1 10-5 10-4 10-3 10-2 10-1 1 10 102 103 tp (s) FR4 PCB, 4-layer copper, tin-plated; mounting pad for collector 1 cm2 Fig 6. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 7 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 7. Characteristics Table 8. Characteristics Tamb = 25 C unless otherwise specified. Symbol Parameter Conditions Min Typ Max Unit ICBO collector-base cut-off current VCB = 50 V; IE = 0 A - - 100 nA ICEO collector-emitter cut-off VCE = 50 V; IB = 0 A; current - - 0.5 A IEBO emitter-base cut-off current - - 0.8 mA PDTD123YQA - - 0.65 mA PDTD143XQA - - 0.6 mA PDTD113ZQA VEB = 5 V; IC = 0 A hFE DC current gain VCE = 5 V; IC = 50 mA 70 - - VCEsat collector-emitter saturation voltage IC = 50 mA; IB = 2.5 mA - - 100 mV VI(off) off-state input voltage VCE = 5 V; IC = 100 A 0.3 0.65 1 V PDTD123YQA 0.4 0.65 1 V PDTD143XQA 0.5 0.75 1.1 V 0.4 0.8 1.4 V 0.5 1 1.4 V 1 1.4 2 V PDTD113ZQA 0.7 1 1.3 k PDTD123YQA 1.54 2.2 2.86 k 3.3 4.7 6.1 k PDTD113ZQA VI(on) on-state input voltage PDTD113ZQA VCE = 0.3 V; IC = 20 mA PDTD123YQA PDTD143XQA R1 [1] bias resistor 1 (input) PDTD143XQA R2/R1 Cc fT [1] bias resistor ratio PDTD113ZQA 9 10 11 PDTD123YQA 4.1 4.55 5 PDTD143XQA 1.91 2.13 2.34 - 5 - pF - 210 - MHz collector capacitance transition frequency VCB = 10 V; IE = ie = 0 A; f = 1 MHz VCE = 5 V; IC = 50 mA; f = 100 MHz [1] See section test information for resistor calculation and test conditions. [2] Characteristics of built-in transistor. PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 [2] © NXP Semiconductors N.V. 2016. All rights reserved. 8 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020059 103 (1) IB (mA) = 2.05 IC (A) (2) hFE aaa-020107 0.5 (3) 0.4 1.85 1.65 1.45 102 1.25 0.3 1.05 0.85 0.2 0.65 10 0.45 0.1 0.25 1 10-1 1 10 102 0 103 0 1 2 3 4 IC (mA) 5 VCE (V) Tamb = 25 C VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 7. PDTD113ZQA: DC current gain as a function of collector current; typical values aaa-020109 10 Fig 8. PDTD113ZQA: Collector current as a function of collector-emitter voltage; typical values aaa-020112 1 (1) (2) VI(on) (V) VI(off) (V) (3) 1 (1) (2) (3) 10-1 10-1 1 10 102 103 10-1 10-1 IC (mA) 10 IC (mA) VCE = 0.3 V VCE = 5 V (1) Tamb = 40 C (1) Tamb = 40 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 100 C Fig 9. 1 PDTD113ZQA: On-state input voltage as a function of collector current; typical values Fig 10. PDTD113ZQA: Off-state input voltage as a function of collector current; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 9 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020108 10-1 aaa-020114 16 Cc (pF) VCEsat (V) 12 8 (1) (2) (3) 4 10-2 1 10 102 103 0 0 10 20 IC (mA) 30 40 50 VCB (V) f = 1 MHz; Tamb = 25 C IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 11. PDTD113ZQA: Collector-emitter saturation voltage as a function of collector current; typical values Fig 12. PDTD113ZQA: Collector capacitance as a function of collector-base voltage; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 10 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020115 103 aaa-020116 0.5 1.8 IB (mA) = 2 IC (A) hFE 1.6 0.4 102 1.4 1.2 (1) (2) (3) 0.3 1.0 0.8 0.2 0.6 10 0.4 0.1 0.2 1 10-1 1 10 102 103 0 0 1 2 3 4 IC (mA) 5 VCE (V) Tamb = 25 C VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 13. PDTD123YQA: DC current gain as a function of collector current; typical values aaa-020119 10 Fig 14. PDTD123YQA: Collector current as a function of collector-emitter voltage; typical values aaa-020117 1 (1) VI(on) (V) (2) VI(off) (V) (3) 1 (1) (2) (3) 10-1 10-1 1 10 102 103 10-1 10-1 IC (mA) 1 10 IC (mA) VCE = 0.3 V VCE = 5 V (1) Tamb = 40 C (1) Tamb = 40 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 100 C Fig 15. PDTD123YQA: On-state input voltage as a function of collector current; typical values Fig 16. PDTD123YQA: Off-state input voltage as a function of collector current; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 11 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020118 10-1 aaa-020120 16 Cc (pF) VCEsat (V) 12 8 (1) (2) (3) 4 10-2 1 10 102 103 0 0 10 20 IC (mA) 30 40 50 VCB (V) f = 1 MHz; Tamb = 25 C IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 17. PDTD123YQA: Collector-emitter saturation voltage as a function of collector current; typical values Fig 18. PDTD123YQA: Collector capacitance as a function of collector-base voltage; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 12 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020121 103 aaa-020122 0.5 IB (mA) = 2.05 IC (A) hFE 1.85 1.65 0.4 1.45 102 (1) (2) (3) 1.25 0.3 1.05 0.85 0.2 0.65 10 0.45 0.1 0.25 1 10-1 1 10 102 103 0 0 1 2 3 4 IC (mA) 5 VCE (V) Tamb = 25 C VCE = 5 V (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 19. PDTD143XQA: DC current gain as a function of collector current; typical values aaa-020125 102 VI(on) (V) Fig 20. PDTD143XQA: Collector current as a function of collector-emitter voltage; typical values aaa-020123 10 VI(off) (V) 10 (1) 1 (2) 1 (3) (1) (2) (3) 10-1 10-1 1 10 102 103 10-1 10-1 IC (mA) 1 10 IC (mA) VCE = 0.3 V VCE = 5 V (1) Tamb = 40 C (1) Tamb = 40 C (2) Tamb = 25 C (2) Tamb = 25 C (3) Tamb = 100 C (3) Tamb = 100 C Fig 21. PDTD143XQA: On-state input voltage as a function of collector current; typical values Fig 22. PDTD143XQA: Off-state input voltage as a function of collector current; typical values PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 13 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors aaa-020124 10-1 aaa-020126 16 Cc (pF) VCEsat (V) 12 8 (1) (2) (3) 4 10-2 1 10 102 0 103 0 10 20 IC (mA) 30 40 50 VCB (V) f = 1 MHz; Tamb = 25 C IC/IB = 20 (1) Tamb = 100 C (2) Tamb = 25 C (3) Tamb = 40 C Fig 23. PDTD143XQA: Collector-emitter saturation voltage as a function of collector current; typical values Fig 24. PDTD143XQA: Collector capacitance as a function of collector-base voltage; typical values aaa-020127 103 fT (MHz) 102 10 10-1 1 10 102 103 IC (mA) VCE = 5 V; f = 100 MHz; Tamb = 25 °C Fig 25. Transition frequency as a function of collector current; typical values of built-in transistor PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 14 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 8. Test information 8.1 Quality information This product has been qualified in accordance with the Automotive Electronics Council (AEC) standard Q101 - Stress test qualification for discrete semiconductors, and is suitable for use in automotive applications. 8.2 Resistor calculation • Calculation of bias resistor 1 (R1): V I I2 – V I I1 R1 = ----------------------------------I I2 – I I1 • Calculation of bias resistor ratio (R2/R1): R2 = V I I4 – V I I3 – 1 -----------------------------------------R1 R1 I I4 – I 13 n.c. II1; II2 R1 II3; II4 R2 GND aaa-020082 Fig 26. Resistor test circuit 8.3 Resistor test conditions Table 9. Resistor test conditions Type number R1 R2 Test conditions k k II1 PDTD113ZQA 1 10 PDTD123YQA 2.2 10 PDTD143XQA 4.7 10 II2 II3 II4 0.7 mA 0.8 mA 0.45 mA 0.55 mA 0.7 mA 0.8 mA 0.45 mA 0.55 mA 1.3 mA 1.5 mA 0.45 mA 0.55 mA PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 15 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 9. Package outline 0.87 0.95 0.75 1 0.95 1.05 2 0.34 0.40 Dimensions in mm 0.17 0.25 0.16 0.24 0.1 3 0.04 max 0.22 0.30 0.245 0.325 0.195 0.275 1.05 1.15 13-03-05 Fig 27. Package outline DFN1010D-3 (SOT1215) PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 16 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 10. Soldering Footprint information for reflow soldering of DFN1010D-3 package SOT1215 1.2 0.45 (2x) 0.3 1.1 0.35 (2x) 0.4 0.25 (2x) 0.75 0.3 0.5 1.5 1.4 0.4 0.5 0.4 0.3 0.5 1.3 0.4 0.3 0.4 0.5 1.3 solder land solder land plus solder paste occupied area solder resist Dimensions in mm Issue date 12-11-23 13-03-06 sot1215_fr Fig 28. Reflow soldering footprint DFN1010D-3 (SOT1215) PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 17 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 11. Revision history Table 10. Revision history Document ID Release date PDTD113Z_123Y_143XQA_SER v.1 20160331 Data sheet status Change notice Supersedes Product data sheet - PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 - © NXP Semiconductors N.V. 2016. All rights reserved. 18 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors 12. Legal information 12.1 Data sheet status Document status[1][2] Product status[3] Definition Objective [short] data sheet Development This document contains data from the objective specification for product development. Preliminary [short] data sheet Qualification This document contains data from the preliminary specification. Product [short] data sheet Production This document contains the product specification. [1] Please consult the most recently issued document before initiating or completing a design. [2] The term ‘short data sheet’ is explained in section “Definitions”. [3] The product status of device(s) described in this document may have changed since this document was published and may differ in case of multiple devices. The latest product status information is available on the Internet at URL http://www.nxp.com. 12.2 Definitions Draft — The document is a draft version only. The content is still under internal review and subject to formal approval, which may result in modifications or additions. NXP Semiconductors does not give any representations or warranties as to the accuracy or completeness of information included herein and shall have no liability for the consequences of use of such information. Short data sheet — A short data sheet is an extract from a full data sheet with the same product type number(s) and title. A short data sheet is intended for quick reference only and should not be relied upon to contain detailed and full information. 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However, NXP Semiconductors does not give any representations or warranties, expressed or implied, as to the accuracy or completeness of such information and shall have no liability for the consequences of use of such information. NXP Semiconductors takes no responsibility for the content in this document if provided by an information source outside of NXP Semiconductors. In no event shall NXP Semiconductors be liable for any indirect, incidental, punitive, special or consequential damages (including - without limitation - lost profits, lost savings, business interruption, costs related to the removal or replacement of any products or rework charges) whether or not such damages are based on tort (including negligence), warranty, breach of contract or any other legal theory. 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Unless otherwise agreed in writing, the product is not designed, authorized or warranted to be suitable for use in life support, life-critical or safety-critical systems or equipment, nor in applications where failure or malfunction of an NXP Semiconductors product can reasonably be expected to result in personal injury, death or severe property or environmental damage. NXP Semiconductors and its suppliers accept no liability for inclusion and/or use of NXP Semiconductors products in such equipment or applications and therefore such inclusion and/or use is at the customer's own risk. Applications — Applications that are described herein for any of these products are for illustrative purposes only. NXP Semiconductors makes no representation or warranty that such applications will be suitable for the specified use without further testing or modification. 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Customer is responsible for doing all necessary testing for the customer’s applications and products using NXP Semiconductors products in order to avoid a default of the applications and the products or of the application or use by customer’s third party customer(s). NXP does not accept any liability in this respect. Limiting values — Stress above one or more limiting values (as defined in the Absolute Maximum Ratings System of IEC 60134) will cause permanent damage to the device. Limiting values are stress ratings only and (proper) operation of the device at these or any other conditions above those given in the Recommended operating conditions section (if present) or the Characteristics sections of this document is not warranted. Constant or repeated exposure to limiting values will permanently and irreversibly affect the quality and reliability of the device. Terms and conditions of commercial sale — NXP Semiconductors products are sold subject to the general terms and conditions of commercial sale, as published at http://www.nxp.com/profile/terms, unless otherwise agreed in a valid written individual agreement. In case an individual agreement is concluded only the terms and conditions of the respective agreement shall apply. NXP Semiconductors hereby expressly objects to applying the customer’s general terms and conditions with regard to the purchase of NXP Semiconductors products by customer. PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 19 of 21 PDTD113Z/123Y/143XQA NXP Semiconductors 50 V, 500 mA NPN resistor-equipped transistors No offer to sell or license — Nothing in this document may be interpreted or construed as an offer to sell products that is open for acceptance or the grant, conveyance or implication of any license under any copyrights, patents or other industrial or intellectual property rights. Translations — A non-English (translated) version of a document is for reference only. The English version shall prevail in case of any discrepancy between the translated and English versions. Export control — This document as well as the item(s) described herein may be subject to export control regulations. Export might require a prior authorization from competent authorities. 12.4 Trademarks Quick reference data — The Quick reference data is an extract of the product data given in the Limiting values and Characteristics sections of this document, and as such is not complete, exhaustive or legally binding. Notice: All referenced brands, product names, service names and trademarks are the property of their respective owners. 13. Contact information For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] PDTD113Z_123Y_143XQA_SER All information provided in this document is subject to legal disclaimers. Product data sheet Rev. 1 — 31 March 2016 © NXP Semiconductors N.V. 2016. All rights reserved. 20 of 21 NXP Semiconductors PDTD113Z/123Y/143XQA 50 V, 500 mA NPN resistor-equipped transistors 14. Contents 1 1.1 1.2 1.3 1.4 2 3 4 4.1 5 6 7 8 8.1 8.2 8.3 9 10 11 12 12.1 12.2 12.3 12.4 13 14 Product profile . . . . . . . . . . . . . . . . . . . . . . . . . . 1 General description . . . . . . . . . . . . . . . . . . . . . 1 Features and benefits . . . . . . . . . . . . . . . . . . . . 1 Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Quick reference data . . . . . . . . . . . . . . . . . . . . 1 Pinning information . . . . . . . . . . . . . . . . . . . . . . 2 Ordering information . . . . . . . . . . . . . . . . . . . . . 2 Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3 Binary marking code description. . . . . . . . . . . . 3 Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 3 Thermal characteristics . . . . . . . . . . . . . . . . . . 5 Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Test information . . . . . . . . . . . . . . . . . . . . . . . . 15 Quality information . . . . . . . . . . . . . . . . . . . . . 15 Resistor calculation . . . . . . . . . . . . . . . . . . . . 15 Resistor test conditions . . . . . . . . . . . . . . . . . 15 Package outline . . . . . . . . . . . . . . . . . . . . . . . . 16 Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 17 Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18 Legal information. . . . . . . . . . . . . . . . . . . . . . . 19 Data sheet status . . . . . . . . . . . . . . . . . . . . . . 19 Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . 20 Contact information. . . . . . . . . . . . . . . . . . . . . 20 Contents . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 21 Please be aware that important notices concerning this document and the product(s) described herein, have been included in section ‘Legal information’. © NXP Semiconductors N.V. 2016. All rights reserved. For more information, please visit: http://www.nxp.com For sales office addresses, please send an email to: [email protected] Date of release: 31 March 2016 Document identifier: PDTD113Z_123Y_143XQA_SER