PANASONIC EXC18CE900U

Common mode Noise Filter Array
Common mode Noise Filter Array
Type:
EXC18CE
■ Features
■ Recommended Applications
● 2 Common mode noise filters in one package
● Small size and low-profile
(L 1.6 mmW 0.8 mmH 0.4 mm)
● Filtering the noise of high-speed differential signaling
lines and minimizing deformations of transmitted signal
waveforms
● Low DC resistance and insertion loss
● Rigidly layered and sintered structure with high
resistance to reflow heat and mounting reliability
● Lead, halogen, and antimony free
● Mobile phone, DSC, notebook PCs, and Digital displays
● Noise reduction of high-speed data lines such as USB,
LVDS, and HDMI lines
■ Explanation of Part Numbers
1
2
3
4
5
6
7
8
9
10
11
E
X
C
1
8
C
E
9
0
0
U
Size
Number of
Terminals
Product Code
Noise Filter
Code Dimensions(mm)
1
8 Terminals C
Type Characteristics
Coupled
type
1.6 0.8 0.4
(L) (W) (H)
■ Construction
E
Nominal Impedance
12
Form
Suffix
High speed
The first two digits are
Code
Packing
Differential transmission significant figure of
impedance value, and the
Embossed Carrier Taping
U
third one denotes the
5000 pcs.
number of zeros following
■ Dimensions in mm (not to scale)
F
Ferrite
D
C
E
A
B
Inner Conductor
Dimensions (mm)
Type
(inches)
Electrode
A
B
C
D
E
F
EXC18C첸 0.8±0.1 1.6±0.1 0.4±0.1 0.2±0.1 0.4±0.1 0.2±0.1
(0603)
Mass
(Weight)
[mg/pc.]
2.6
■ Circuit Configuration(No Polarity)
8
7
6
5
8
7
6
5
1
2
3
4
1
2
3
4
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2009
Common mode Noise Filter Array
■ Ratings
Impedance () at 100 MHz
Common Mode
Differential Mode
Part Number
Rated Voltage
(V DC)
Rated Current
(mA DC)
DC Resistance
() max.
EXC18CE650U
65 ±20 %
18 max.
5
140
1.8
EXC18CE900U
90 ±20 %
20 max.
5
130
2.0
EXC18CE201U
200 ±20 %
22 max.
5
100
3.5
■ Impedance Characteristics (Typical)
● EXC18CE650U
● EXC18CE900U
1000
1000
Common Mode
100
Impedance ()
Impedance ()
Common Mode
10
100
10
Differential Mode
Differential Mode
1
1
10
100
1000
10000
1
1
10
100
1000
10000
Frequency (MHz)
Frequency (MHz)
● EXC18CE201U
1000
Impedance ()
Common Mode
100
10
Differential Mode
1
1
10
100
1000
10000
Frequency (MHz)
● Measurement Circuit
(A) Common Mode
(B) Differential Mode
Z
■ Packaging Methods(Taping) and Recommended Land Pattern Design
■ Recommended Soldering Conditions and Safety Precations
Z
Refer 126 page.
Refer 127 page.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2009
Common mode Noise Filters
■ Packaging Methods (Taping)
● Standard Quantity
Part Number
Kind of Taping
EXC14C첸첸첸첸U
Embossed Carrier Taping
EXC18C첸첸첸첸U
EXC24C첸첸첸첸U
● Embossed Carrier Taping
t1
Pitch (P1)
Quantity
2 mm
10000 pcs./reel
4 mm
5000 pcs./reel
● Embossed Carrier Taping
P0
t1
Sprocket hole
Compartment
φD0
Chip component
B
P2
Tape running
direction
Compartment
A
B
W
F
E
P2
φD0
P0
EXC14C첸 2.0±0.1 4.0±0.1
t1
P2
P0
Chip component
P1
EXC14C첸 0.75±0.10 0.95±0.10 8.0±0.2 3.50±0.05 1.75±0.10 2.0±0.1
Type
P1
t2
(mm)
Embossed Carrier Dimensions
Type
F
W
F
P1
t2
Tape running direction
–0
1.5+0.1
0.25±0.05 0.85±0.15
(mm)
Embossed Carrier Dimensions
Type
A
B
W
EXC18C첸 1.00±0.10 1.80±0.10
EXC24C첸 1.20±0.15 1.45±0.15
t2
W
A
A
B
φ D0
E
E
Sprocket hole
Type
EXC18C첸
EXC24C첸
P2
2.0±0.1 4.0±0.1
E
P1
8.0±0.2 3.5±0.1 1.75±0.10 4.0±0.1
φD0
P0
F
t1
t2
1.5+0.1
0.25±0.05
–0
0.50±0.05
0.90±0.15
● Taping Reel
T
φC
φB
φD
E
φA
(mm)
Standard Reel Dimensions
W
t
Type
φA
φB
EXC14C첸
EXC18C첸 180.0±3.0 60.0±1.0
EXC24C첸
φC
φD
13.0±0.5
21.0±0.8
Type
E
W
T
t
EXC14C첸
EXC18C첸
EXC24C첸
2.0±0.5
9.0±0.3
11.4±1.5
1.2±0.2
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2009
Common mode Noise Filters
■ Recommended Land Pattern Design
● EXC14C첸, EXC24C첸
● EXC18C첸
B
B
F
F
E
Type
A
D
E
D
C
C
D
A
D
E
Dimensions (mm)
A
B
C
D
E
F
EXC14C첸
0.80 to 1.00
0.80
0.30
0.25 to 0.35
0.30
0.20
EXC24C첸
1.60 to 2.00
0.95
0.70
0.45 to 0.65
0.35
0.25
Dimensions (mm)
Type
EXC18C첸
A
B
C
D
E
F
1.4
1.4
0.4
0.5
0.2
0.4
■ Recommended Soldering Conditions
Recommendations and precautions are described below
● Recommended soldering conditions for reflow
· Reflow soldering shall be performed a maximum of
two times.
· Please contact us for additional information when
used in conditions other than those specified.
· Please measure the temperature of the terminals
and study every kind of solder and printed circuit
board for solderability before actual use.
Temperature
Peak
Preheating
Heating
For soldering (Example : Sn-37Pb)
Preheating
Main heating
Peak
Temperature
140 °C to 160 °C
Above 200 °C
235 ± 10 °C
Time
60 s to 120 s
30 s to 40 s
max. 10 s
For lead-free soldering (Example : Sn/3Ag/0.5Cu)
Temperature
Time
Preheating
150 °C to 170 °C
60 s to 120 s
Main heating
Above 230 °C
30 s to 40 s
Peak
max. 260 °C
max. 10 s
Time
● Flow soldering
· We do not recommend flow soldering , because flow soldering may cause bridges betwwn the electrodes.
<Repair with hand soldering>
● Preheat with a blast of hot air or similar method. Use a soldering iron with a tip temperature of 350 °C or less. Solder
each electrode for 3 seconds or less.
● Never touch this product with the tip of a soldering iron.
Safety Precations
The following are precautions for individual products. Please also refer to the precautions common to EMI Filters,
ESD Suppressors, Fuses, and MR Sensors shown on page EL113 of this catalog.
1. Use rosin-based flux or halogen-free flux.
2. For cleaning, use an alcohol-based cleaning agent. Before using any other type, consult with our sales person
in advance.
3. Do not apply shock to Common mode Noise Filters (hereafter called the filters) or pinch them with a hard tool
(e.g. pliers and tweezers). Otherwise, their bodies may be chipped, affecting their performance. Excessive mechanical stress may damage the filters. Handle with care.
4. Store the filters in a location with a temperature ranging from –5 °C to +40 °C and a relative humidity of 40 % to 60 %,
where there are no rapid changes in temperature or humidity.
5. Use the filters within half a year after the date of the outgoing inspection indicated on the packages.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
Jun. 2009
Safety Precautions (Common precautions for EMI Filters, ESD Suppressors, Fuses, and MR Sensors)
• When using our products, no matter what sort of equipment they might be used for, be sure to make a written
agreement on the specifications with us in advance. The design and specifications in this catalog are subject
to change without prior notice.
• Do not use the products beyond the specifications described in this catalog.
• This catalog explains the quality and performance of the products as individual components. Before use, check
and evaluate their operations when installed in your products.
• Install the following systems for a failsafe design to ensure safety if these products are to be used in equipment
where a defect in these products may cause the loss of human life or other significant damage, such as damage to
vehicles (automobile, train, vessel), traffic lights, medical equipment, aerospace equipment, electric heating
appliances, combustion/gas equipment, rotating equipment, and disaster/crime prevention equipment.
✽ Systems equipped with a protection circuit and a protection device
✽ Systems equipped with a redundant circuit or other system to prevent an unsafe status in the event of a single fault
(1) Precautions for use
• These products are designed and manufactured for general and standard use in general electronic equipment
(e.g. AV equipment, home electric appliances, office equipment, information and communication equipment)
• These products are not intended for use in the following special conditions. Before using the products,
carefully check the effects on their quality and performance, and determine whether or not they can be used.
1. In liquid, such as water, oil, chemicals, or organic solvent
2. In direct sunlight, outdoors, or in dust
3. In salty air or air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
4. Electric Static Discharge (ESD) Environment (except ESD Suppressors)
These components are sensitive to static electricity and can be damaged under static shock (ESD).
Please take measures to avoid any of these environments.
Smaller components are more sensitive to ESD environment.
5. Electromagnetic Environment
Avoid any environment where strong electromagnetic waves exist.
6. In an environment where these products cause dew condensation
7. Sealing or coating of these products or a printed circuit board on which these products are mounted, with
resin or other materials
• These products generate Joule heat when energized. Carefully position these products so that their heat will
not affect the other components.
• Carefully position these products so that their temperatures will not exceed the category temperature range due
to the effects of neighboring heat-generating components. Do not mount or place heat-generating components
or inflammables, such as vinyl-coated wires, near these products (except Thermal Cutoffs).
• Note that non-cleaning solder, halogen-based highly active fl ux, or water-soluble flux may deteriorate the
performance or reliability of the products.
• Carefully select a flux cleaning agent for use after soldering. An unsuitable agent may deteriorate the performance
or reliability. In particular, when using water or a water-soluble cleaning agent, be careful not to leave water
residues. Otherwise, the insulation performance may be deteriorated.
(2) Precautions for storage
The performance of these products, including the solderability, is guaranteed for a year from the date of arrival
at your company, provided that they remain packed as they were when delivered and stored at a temperature
of 5 °C to 35 °C and a relative humidity of 45 % to 85 %. (Micro Chip Fuses: Guaranteed for 6 months from the
date of arrival at your company)
The performance of EMI Filters is guaranteed for 6 months or a year from the outgoing inspection date indicated on
the packages, provided that they are stored at a temperature of -5 °C to +40 °C and a relative humidity of 40 %
to 60 %. Check the guarantee period in the specifications. The performance of Thermal Cutoffs is guaranteed for a
year from the outgoing inspection date indicated on the packages, provided that they are stored at a temperature of
-10 °C to +40 °C and a relative humidity of 30 % to 75 %.
Even within the above guarantee periods, do not store these products in the following conditions. Otherwise,
their electrical performance and/or solderability may be deteriorated, and the packaging materials (e.g. taping
materials) may be deformed or deteriorated, resulting in mounting failures.
1. In salty air or in air with a high concentration of corrosive gas, such as Cl2, H2S, NH3, SO2, or NO2
2. In direct sunlight
<Package markings>
Package markings include the product number, quantity, and country of origin.
In principle, the country of origin should be indicated in English.
Jan. 2008
– EL113 –