PANASONIC MN102H950F

MN102H950F
MN102H950F
Type
Internal ROM type
External
ROM (byte)

RAM (byte)
10K
Package (Lead-free)
Minimum Instruction
Execution Time
LQFP100-P-1414
[With main clock operated]
58 ns (at 3.0 V to 3.6 V, 34 MHz)
 Interrupts
/RST pin, Watchdog, /NMI pin, Timer counter 0 to 9 underflow, Timer counter 10 to 14 underflow, Timer counter 10 to 14 compare
capture A, Timer counter 10 to 14 compare capture B, ATC ch.0 to ch.3 tra nsfer finish, External 0 to 4, Serial ch.0 to ch.4 tra
nsmission, Serial ch.0 to ch.4 reception, A/D conversion finish
 Timer Counter
Timer counter 0 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 8; TM0IO pin; system clock (BOSC)
Interrupt source ........... underflow of timer counter 0
Timer counter 1 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 8, 9; timer counter 0 output
Interrupt source ........... underflow of timer counter 1
Timer counter 2 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 8; TM2IO pin; timer counter 1 output
Interrupt source ........... underflow of timer counter 2
Timer counter 3 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 8; TM3IO pin; timer counter 2 output
Interrupt source ........... underflow of timer counter 3
Timer counter 4 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 9; TM4IO pin; system clock (BOSC)
Interrupt source ........... underflow of timer counter 4
Timer counter 5 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 8, 9; timer counter 4 output
Interrupt source ........... underflow of timer counter 5
Timer counter 6 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 9; TM6IO pin; timer counter 5 output
Interrupt source ........... underflow of timer counter 6
Timer counter 7 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 9; TM7IO pin; timer counter 6 output
Interrupt source ........... underflow of timer counter 7
Timer counter 8 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; system clock (BOSC); 1/4 of system clock (XI) frequency;
TM8IO pin
Interrupt source ........... underflow of timer counter 8
Timer counter 9 : 8-bit × 1
Clock source................ 1/2 of system clock (BOSC) frequency; underflow of timer counter 8; TM9IO pin; timer counter 8 output
Interrupt source ........... underflow of timer counter 9
Timer counter 10 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ underflow of timer counter 8, 9; TM10IOB pin; 1/2 of system clock (BOSC) frequency; 2-phase encode
of TM10IOA pin/TM10IOB pin (1 ×, 4 ×)
Interrupt source ........... underflow of timer counter 10; timer counter 10 compare capture A; timer counter 10 compare capture B
MAE00021CEM
MN102H950F
Timer counter 11 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ underflow of timer counter 8, 9; TM11IOB pin; 1/2 of system clock (BOSC) frequency; 2-phase encode
of TM11IOA pin/TM11IOB pin (1 ×, 4 ×)
Interrupt source ........... underflow of timer counter 11; timer counter 11 compare capture A; timer counter 11 compare capture B
Timer counter 12 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ underflow of timer counter 8, 9; TM12IOB pin; 1/2 of system clock (BOSC) frequency; 2-phase encode
of TM12IOA pin/TM12IOB pin (1 ×, 4 ×)
Interrupt source ........... underflow of timer counter 12; timer counter 12 compare capture A; timer counter 12 compare capture B
Timer counter 13 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ underflow of timer counter 8, 9; TM13IOB pin; 1/2 of system clock (BOSC) frequency; 2-phase encode
of TM13IOA pin/TM13IOB pin (1 ×, 4 ×)
Interrupt source ........... underflow of timer counter 13; timer counter 13 compare capture A; timer counter 13 compare capture B
Timer counter 14 : 16-bit × 1
(timer output, event count, input capture, PWM output, 2-phase encoder input)
Clock source................ underflow of timer counter 8, 9; TM14IOB pin; 1/2 of system clock (BOSC) frequency; 2-phase encode
of TM14IOA pin/TM14IOB pin (1 ×, 4 ×)
Interrupt source ........... underflow of timer counter 14; timer counter 14 compare capture A; timer counter 14 compare capture B
 Serial interface
Serial 0, 1 : 8-bit × 1 (transfer direction of MSB / LSB selectable, transmission / reception of 7, 8-bit length)
Clock source................ 1/8 of timer counter 6 underflow frequency; 1/8, 1/2 of timer counter 0 underflow frequency; external pin
Serial 2, 3 : 8-bit × 1 (transfer direction of MSB / LSB selectable, transmission / reception of 7, 8-bit length)
Clock source................ 1/8 of timer counter 2 underflow frequency; 1/8, 1/2 of timer counter 4 underflow frequency; external pin
UART × 4 (common use with serial 0 to 3)
I²C × 2 (common use with serial 1,3; single master)
 I/O Pins
I/O
63
Common use : 43 (use of full address, address data separate 16-bit mode)
Common use : 57 (use of address 16-bit, address data separate 8-bit mode)
Common use : 56 (use of full address, address data multiplex 16-bit mode)
Common use : 63 (use of address 16-bit, address data multiplex 8-bit mode)
 A/D converter
10-bit × 12-ch. (with S/H)
 D/A converter
8-bit × 4-ch.
 PWM
16-bit × 5-ch. (timer counter 10 to 14)
 ICR
16-bit × 5-ch. (timer counter 10 to 14)
 OCR
16-bit × 5-ch. (timer counter 10 to 14)
 Notes
Address / data separate bus interface; 8 / 16-bit bus width selectable; SRAM interface
Address / data multiplex bus interface support
MAE00021CEM
 Electrical Charactreistics (Supply current)
Parameter
Symbol
Operating supply current
IDDopr
Supply current at STOP
IDDS
Supply current at HALT0
IDDH
Limit
Condition
min
typ
max
Unit
VI = VDD or VSS, output open
60
mA
f = 34 MHz , VDD = 3.3 V
Pin with pull-up resistor is open all other input pins and
70
µA
Hi-Z state input/output pins are simultaneously applied
VDD or VSS level
30
mA
f = 34 MHz , VDD = 3.3 V, output open
(Ta = –40°C to +85°C , VDD = AVDD = 3.3 V , VSS = AVSS = 0 V)
 Development tools
In-circuit Emulator
PX-ICE102H930F-LQFP100-P-1414
MN102H950F
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
MODE
OSCO
OSCI
VDD
XO
PB2, XI
VSS
PB1, /NMI
VDD
/RST
PB0, BOSC
PA5, ADSEP
PA4, /IRQ4, TM14IC
PA3, /IRQ3, TM13IC
PA2, /IRQ2, TM12IC
PA1, /IRQ1, TM11IC
PA0, /IRQ0, TM10IC
P77, TM9IO
P76, TM8IO
P75, SBO1, SDA1, TM7IO
P74, SBI1, TM6IO
P73, SBT1, SCL1, TM4IO
P72, SBO0, TM3IO
P71, SBI0, TM2IO
P70, SBT0, TM0IO
ALE, P56
/WORD, P57
WAIT, P60
/RE
/WEL, P62
/WEH, P63
VDD
TM10IOA, /DMAREQ1, P80
TM10IOB, /DMAACK1, P81
TM11IOA, SBT2, P82
TM11IOB, SBI2, P83
TM12IOA, SBO2, P84
TM12IOB, SBT3, SCL3, P85
TM13IOA, SBI3, P86
TM13IOB, SBO3, SDA3, P87
AVDD
DAC0, AN4, P90
DAC1, AN5, P91
DAC2, AN6, P92
DAC3, AN7, P93
AN8, P94
AN9, P95
AN10, P96
AN11, P97
AVSS
AD7, A7
AD8, A8
AD9, A9
AD10, A10
AD11, A11
VSS
AD12, A12
AD13, A13
AD14, A14
AD15, A15
TM0O, A16, P40
TM2O, A17, P41
TM3O, A18, P42
TM4O, A19, P43
VDD
AN0, A20, P44
AN1, A21, P45
STOP, AN2, A22, P46
WDOUT, AN3, A23, P47
/CS0
/CS1, P51
/CS2, P52
/CS3, P53
TM14IOA, /DMAREQ0, /BREQ, /WR, P54
TM14IOB, /DMAACK0, /BRACK, P55
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
A6, AD6
A5, AD5
A4, AD4
A3, AD3
A2, AD2
A1, AD1
A0, AD0
VDD
P17, D15
P16, D14
P15, D13
P14, D12
P13, D11
P12, D10
P11, D9
P10, D8
VSS
P07, D7
P06, D6
P05, D5
P04, D4
P03, D3
P02, D2
P01, D1
P00, D0
 Pin Assignment
LQFP100-P-1414
MAE00021CEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
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Electric Industrial Co., Ltd. Industrial Co., Ltd.