PANASONIC MN101CF49K

MN101C49G, MN101C49H, MN101C49K
MN101C49G
Type
MN101C49H
MN101C49K
MN101CF49K
MN101CP49K
EPROM
Mask ROM
FLASH
ROM (byte)
128K
160K
224K
RAM (byte)
4K
6K
10K
Internal ROM type
Package (Lead-free)
Minimum Instruction
Execution Time
LQFP100-P-1414, QFP100-P-1818B
[Standard]
0.10 µs (at 4.5 V to 5.5 V, 20 MHz)
0.238 µs (at 2.7 V to 5.5 V, 8.39 MHz)
125 µs (at 2.0 V to 5.5 V, 32 kHz)*
[Double speed]
0.12 µs (at 4.5 V to 5.5 V, 8.39 MHz)
0.25 µs (at 3.0 V to 5.5 V, 4 MHz)
62.5 µs (at 2.0 V to 5.5 V, 32 kHz)*
* The lower limit for operation guarantee for EPROM built-in type is 2.7 V.
* The lower limit for operation guarantee for flash memory built-in type is 4.5 V.
 Interrupts
RESET, Watchdog, External 0 to 5, Timer 0 to 4, Timer 6, Timer 7 (2 systems), Time base, Serial 0 to 3, Automatic transfer finish,
A/D conversion finish, Key interrupts (8 lines)
 Timer Counter
Timer counter 0 : 8-bit × 1
(square-wave/8-bit PWM output, event count, generation of remote control carrier, pulse width measurement)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 0
Timer counter 1 : 8-bit × 1 (square-wave output, event count, synchronous output event)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 1
Timer counter 0, 1 can be cascade-connected.
Timer counter 2 : 8-bit × 1
(square-wave/8-bit PWM output, event count, synchronous output event, pulse width measurement)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 2
Timer counter 3 : 8-bit × 1 (square-wave output, event count, generation of remote control carrier)
Clock source................ 1/2, 1/8 of system clock frequency; 1/1, 1/4, 1/16, 1/64, 1/128 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; external clock input
Interrupt source ........... coincidence with compare register 3
Timer counter 2, 3 can be cascade-connected.
Timer counter 4 : 8-bit × 1
(square-wave/8-bit PWM output, event count, pulse width measurement, serial 1 baud rate timer)
Clock source................ 1/2, 1/4 of system clock frequency; 1/1, 1/4, 1/16, 1/32, 1/64 of OSC oscillation clock frequency; 1/1 of
XI oscillation clock frequency; 1/1 of external clock input frequency
Interrupt source ........... coincidence with compare register 4
Timer counter 6 : 8-bit freerun timer
Clock source................ 1/1 of system clock frequency; 1/1, 1/4096, 1/8192 of OSC oscillation clock frequency; 1/1, 1/4096,
1/8192 of XI oscillation clock frequency
Interrupt source ........... coincidence with compare register 6
MAD00011HEM
MN101C49G, MN101C49H, MN101C49K
Timer counter 7 : 16-bit × 1
(square-wave/16-bit PWM output, cycle / duty continuous variable, event count, synchronous output evevt, pulse width
measurement, input capture)
Clock source................ 1/1, 1/2, 1/4, 1/16 of system clock frequency; 1/1, 1/2, 1/4, 1/16 of OSC oscillation clock frequency; 1/1,
1/2, 1/4, 1/16 of external clock input frequency
Interrupt source ........... coincidence with compare register 7 (2 lines)
Time base timer (one-minute count setting)
Clock source................ 1/1 of OSC oscillation clock frequency; 1/1 of XI oscillation clock frequency
Interrupt source ........... 1/128, 1/256, 1/512, 1/1024, 1/8192, 1/32768 of clock source frequency
Watchdog timer
Interrupt source ........... 1/65536, 1/262144, 1/1048576 of system clock frequency
 Serial interface
Serial 0 : synchronous type/UART (full-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 2, 4; 1/2, 1/4, 1/16, 1/64 of OSC
oscillation clock frequency
Serial 1 : synchronous type/simple UART (half-duplex) × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 4; 1/2, 1/4, 1/16, 1/64 of OSC oscillation
clock frequency
Serial 2 : synchronous type × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation
clock frequency
Serial 3 : synchronous type/single-master I²C × 1
Clock source................ 1/2, 1/4 of system clock frequency; pulse output of timer counter 3; 1/2, 1/4, 1/16, 1/32 of OSC oscillation
clock frequency
 DMA controller
Max. Transfer cycles : 255
Starting factor : external request, various types of interrupt, software
Transfer mode : 1-byte transfer, word transfer, burst transfer
 I/O Pins
I/O
Input
73
(72)
15
(14)
Common use , Specified pull-up resistor available, Input/output selectable (bit unit)
( ) : Flash memory built-in type.
Common use , Specified pull-up resistor available
( ) : Flash memory built-in type.
 A/D converter
10-bit × 8-ch. (with S/H)
 D/A converter
8-bit × 4-ch.
 Special Ports
Buzzer output, remote control carrier signal output, high-current drive port
 ROM Correction
Correcting address designation : up to 3 addresses possible
MAD00011HEM
 Electrical Charactreistics (Supply current)
Parameter
Symbol
Operating supply current
Supply current at HALT
Limit
Condition
min
typ
max
Unit
IDD1
fosc = 20 MHz , VDD = 5 V
30
70
mA
IDD2
fosc = 8.39 MHz , VDD = 5 V
15
30
mA
IDD3
fx = 32.768 kHz , VDD = 3 V
40
120
µA
IDD4
fx = 32 kHz , VDD = 3 V (5 V), Ta = 25°C
5 (13) 11 (30)
µA
IDD5
fx = 32.768 kHz , VDD = 3 V (5 V) , Ta = 85°C
30 (90)
µA
Supply current at STOP
IDD6
VDD = 5 V , Ta = 25°C
3
µA
Supply current at STOP
IDD7
VDD = 5 V , Ta = 85°C
60
µA
(
) : Flash memory built-in type
 Development tools
In-circuit Emulator
PX-ICE101C/D+PX-PRB101C49-QFP100-P-1818B
PX-ICE101C/D+PX-PRB101C49-LQFP100-P-1414
75
74
73
72
71
70
69
68
67
66
65
64
63
62
61
60
59
58
57
56
55
54
53
52
51
P74, A12
P73, A11
P72, A10
P71, A9
P70, A8
P67, A7
P66, A6
P65, A5
P64, A4
P63, A3
P62, A2
P61, A1
P60, A0
P54, A17
P53, A16
P52, NCS
P51, NRE
P50, NWE
P47, KEY7
P46, KEY6
P45, KEY5
P44, KEY4
P43, KEY3
P42, KEY2
P41, KEY1
 Pin Assignment
MN101C49G
MN101C49H
MN101C49K
50
49
48
47
46
45
44
43
42
41
40
39
38
37
36
35
34
33
32
31
30
29
28
27
26
P40, KEY0
P37, NDKDMA
P36, NSTDMA
P35, NLDDMA, SCL, SBT3
P34, NBT, SBI3
P33, NBR, SDA, SBO3
P32, SBT1
P31, RXD1, SBI1
P30, TXD1, SBO1
P17(VPP)
P16, TM4IO
P15
P14, TM7IO
P13, TM3IO
P12, TM2IO
P11, TM1IO
P10, TM0IO, RMOUT
P27, NRST
P26(VDD2)
P25, IRQ5
P24, IRQ4
P23, IRQ3
P22, IRQ2
P21, IRQ1, SENS
P20, IRQ0
1
2
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
21
22
23
24
25
76
77
78
79
80
81
82
83
84
85
86
87
88
89
90
91
92
93
94
95
96
97
98
99
100
VREFAN0, PA0
AN1, PA1
AN2, PA2
AN3, PA3
AN4, PA4
AN5, PA5
AN6, PA6
AN7, PA7
VREF+
VDD
OSC2
OSC1
VSS
XI
XO
MMOD
SBO0, P00
SBI0, P01
SBT0, P02
SBO2, P03
SBI2, P04
SBT2, P05
NDK, BUZZER, P06
SYSCLK, P07
A13, P75
A14, P76
A15, P77
D0, LED0, P80
D1, LED1, P81
D2, LED2, P82
D3, LED3, P83
D4, LED4, P84
D5, LED5, P85
D6, LED6, P86
D7, LED7, P87
SDO0, PD0
SDO1, PD1
SDO2, PD2
SDO3, PD3
SDO4, PD4
SDO5, PD5
SDO6, PD6
SDO7, PD7
DAVSS
DA0, PC0
DA1, PC1
DA2, PC2
DA3, PC3
DAVDD
QFP100-P-1818B
LQFP100-P-1414
Note) ( ): Flash memory built-in type.
MAD00011HEM
Request for your special attention and precautions in using the technical information and
semiconductors described in this book
(1) If any of the products or technical information described in this book is to be exported or provided to non-residents, the laws and
regulations of the exporting country, especially, those with regard to security export control, must be observed.
(2) The technical information described in this book is intended only to show the main characteristics and application circuit examples
of the products, and no license is granted under any intellectual property right or other right owned by our company or any other
company. Therefore, no responsibility is assumed by our company as to the infringement upon any such right owned by any other
company which may arise as a result of the use of technical information described in this book.
(3) The products described in this book are intended to be used for standard applications or general electronic equipment (such as office
equipment, communications equipment, measuring instruments and household appliances).
Consult our sales staff in advance for information on the following applications:
– Special applications (such as for airplanes, aerospace, automobiles, traffic control equipment, combustion equipment, life support
systems and safety devices) in which exceptional quality and reliability are required, or if the failure or malfunction of the products may directly jeopardize life or harm the human body.
– Any applications other than the standard applications intended.
(4) The products and product specifications described in this book are subject to change without notice for modification and/or improvement. At the final stage of your design, purchasing, or use of the products, therefore, ask for the most up-to-date Product
Standards in advance to make sure that the latest specifications satisfy your requirements.
(5) When designing your equipment, comply with the range of absolute maximum rating and the guaranteed operating conditions
(operating power supply voltage and operating environment etc.). Especially, please be careful not to exceed the range of absolute
maximum rating on the transient state, such as power-on, power-off and mode-switching. Otherwise, we will not be liable for any
defect which may arise later in your equipment.
Even when the products are used within the guaranteed values, take into the consideration of incidence of break down and failure
mode, possible to occur to semiconductor products. Measures on the systems such as redundant design, arresting the spread of fire
or preventing glitch are recommended in order to prevent physical injury, fire, social damages, for example, by using the products.
(6) Comply with the instructions for use in order to prevent breakdown and characteristics change due to external factors (ESD, EOS,
thermal stress and mechanical stress) at the time of handling, mounting or at customer's process. When using products for which
damp-proof packing is required, satisfy the conditions, such as shelf life and the elapsed time since first opening the packages.
(7) This book may be not reprinted or reproduced whether wholly or partially, without the prior written permission of Matsushita
Electric Industrial Co., Ltd. Industrial Co., Ltd.