EL1509 ® Data Sheet March 26, 2007 FN7015.2 Medium Power Differential Line Driver Features The EL1509 is a dual operational amplifier designed for customer premise line driving in DMT ADSL solutions. This device features a high drive capability of 250mA while consuming only 7.1mA of supply current per amplifier and operating from a single 5V to 12V supply. This driver achieves a typical distortion of less than -85dBc, at 150kHz into a 25Ω load. The EL1509 is available in the industry standard 8 Ld SOIC as well as the thermally-enhanced 8 Ld DFN package. Both are specified for operation over the full -40°C to +85°C temperature range. • Drives up to 250mA from a +12V supply The EL1509 is ideal for ADSL, SDSL, HDSL2 and VDSL line driving applications. PART NUMBER • -85dBc typical driver output distortion at full output at 150kHz • Low quiescent current of 7.5mA per amplifier • Pb-free plus anneal available (RoHS compliant) Applications • ADSL G.lite CO line driving • ADSL full rate CPE line driving • G.SHDSL, HDSL2 line driver Ordering Information PART MARKING • 20VP-P differential output drive into 100Ω TAPE & REEL PACKAGE PKG. DWG. # EL1509CS 1509CS - 8 Ld SOIC MDP0027 EL1509CS-T7 1509CS 7” 8 Ld SOIC MDP0027 EL1509CS-T13 1509CS 13" 8 Ld SOIC MDP0027 EL1509CSZ (See Note) 1509CSZ - 8 Ld SOIC (Pb-Free) MDP0027 EL1509CSZ-T7 (See Note) 1509CSZ 7” 8 Ld SOIC (Pb-Free) MDP0027 EL1509CSZ-T13 1509CSZ (See Note) 13" • Video distribution amplifier • Video twisted-pair line driver Pinouts EL1509 (8 LD SOIC) TOP VIEW OUTA 1 8 VS - INA- 2 8 Ld SOIC (Pb-Free) MDP0027 7 OUTB + INA+ 3 6 INB- EL1509CL 1509CL - 8 Ld DFN MDP0047 EL1509CL-T7 1509CL 7" 8 Ld DFN MDP0047 EL1509CL-T13 1509CL 13" 8 Ld DFN MDP0047 NOTE: Intersil Pb-free plus anneal products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. GND + 4 5 INB+ EL1509 (8 LD DFN) TOP VIEW OUTA 1 INA- 2 INA+ 3 GND 4 8 VS 7 OUTB + 1 AMP A + AMP B 6 INB5 INB+ CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002-2004, 2007. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. EL1509 Absolute Maximum Ratings (TA = +25°C) VS+ Voltage to Ground . . . . . . . . . . . . . . . . . . . . . . -0.3V to +14.6V VIN+ Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VS+ Current into any Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8mA Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 75mA Operating Temperature . . . . . . . . . . . . . . . . . . . . . . .-40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . . . . . .-60°C to +150°C Operating Junction Temperature . . . . . . . . . . . . . . .-40°C to +150°C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VS = +12V, RF = 1.5kΩ, RL = 100Ω connected to mid supply, TA = 25°C, unless otherwise specified. DESCRIPTION CONDITIONS MIN TYP MAX UNIT AC PERFORMANCE BW -3dB Bandwidth AV = +4 70 MHz HD Total Harmonic Distortion f = 150kHz, VO = 16VP-P, RL = 25Ω -85 dBc dG Differential Gain AV = +2, RL = 37.5Ω 0.15 % dθ Differential Phase AV = +2, RL = 37.5Ω 0.1 ° SR Slewrate VOUT from -3V to +3V 500 V/µs 350 DC PERFORMANCE VOS Offset Voltage -20 20 mV ΔVOS VOS Mismatch -10 10 mV ROL Transimpedance 2.5 MΩ VOUT from -4.5V to +4.5V 0.7 1.4 INPUT CHARACTERISTICS IB+ Non-Inverting Input Bias Current -5 5 µA IB- Inverting Input Bias Current -30 30 µA ΔIB- IB- Mismatch -30 30 µA eN Input Noise Voltage 2.8 nV/√ Hz iN -Input Noise Current 19 pA/√ Hz OUTPUT CHARACTERISTICS VOUT IOUT Loaded Output Swing (single ended) VS = ±6V, RL = 100Ω to GND ±4.8 ±5 V VS = ±6V, RL = 25Ω to GND ±4.4 ±4.7 V 450 mA Output Current RL = 0Ω VS Supply Voltage Single Supply IS Supply Current All Outputs at Mid Supply SUPPLY 2 5 14.2 12 V 18 mA FN7015.2 March 26, 2007 EL1509 Typical Performance Curves 28 20 16 24 RF=1kΩ RF=1.5kΩ RF=2kΩ AV=10 VS=±6V RL=100Ω RF=1.5kΩ GAIN (dB) GAIN (dB) 24 28 AV=10 VS=±6V RL=100Ω 16 RF=2kΩ 12 12 8 100K 1M 10M 8 100K 100M FREQUENCY (Hz) RF=1kΩ 18 14 RF=2kΩ 10 AV=5 VS=±6V RL=100Ω RF=1.5kΩ RF=1.5kΩ GAIN (dB) GAIN (dB) 100M 22 AV=5 VS=±6V RL=100Ω 6 RF=1kΩ 14 10 RF=2kΩ 6 2 100K 1M 10M 2 100K 100M FREQUENCY (Hz) 1M 10M 100M FREQUENCY (Hz) FIGURE 3. DIFFERENTIAL FREQUENCY RESPONSE vs RF (EL1509CS) FIGURE 4. DIFFERENTIAL FREQUENCY RESPONSE vs RF (EL1509CL) 22 22 AV=5 VS=±6V RL=100Ω RF=1.5kΩ CL=22pF CL=10pF 14 CL=0pF 10 6 2 100K 18 GAIN (dB) GAIN (dB) 10M FIGURE 2. DIFFERENTIAL FREQUENCY RESPONSE vs RF (EL1509CL) 22 18 1M FREQUENCY (Hz) FIGURE 1. DIFFERENTIAL FREQUENCY RESPONSE vs RF (EL1509CS) 18 RF=1kΩ 20 AV=5 VS=±6V RL=100Ω RF=1.5kΩ CL=22pF CL=10pF 14 CL=0pF 10 6 1M 10M 100M FREQUENCY (Hz) FIGURE 5. DIFFERENTIAL FREQUENCY RESPONSE vs CL (EL1509CS) 3 2 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 6. DIFFERENTIAL FREQUENCY RESPONSE vs CL (EL1509CL) FN7015.2 March 26, 2007 EL1509 Typical Performance Curves 55 -45 AV=5 RF=1.5kΩ RL=100Ω 53 51 -55 HD (dB) EL1509CL 49 BW (MHz) VS=±2.5V AV=5 RF=1.5kΩ RL=100Ω f=1MHz -50 47 45 EL1509CS 43 -60 -65 HD3 -70 41 -75 39 HD2 -80 37 35 2.5 -85 3 3.5 4 4.5 5 5.5 1 6 1.5 2 2.5 ±VS (V) FIGURE 7. DIFFERENTIAL BANDWIDTH vs SUPPLY VOLTAGE 3.5 4 4.5 5.5 -45 AV=5 RF=1.5kΩ RL=100Ω 3 -55 EL1509CS -60 HD (dB) 2 1 0 VS=±6V AV=5 RF=1.5kΩ RL=100Ω f=1MHz -50 -65 -70 HD3 -75 EL1509CL -80 -1 HD2 -85 -90 -2 2.5 3 3.5 4 4.5 5 5.5 1 6 3 5 7 FIGURE 9. DIFFERENTIAL PEAKING vs SUPPLY VOLTAGE -45 -55 13 -45 15 17 19 -55 THD (dB) VS=±2.5V -70 -75 -60 VS=±2.5V -65 VS=±6V -70 VS=±6V -80 AV=5V RF=1.5kΩ RL=100Ω f=1MHz -50 -60 -65 11 FIGURE 10. DIFFERENTIAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE (ALL PACKAGES) AV=5 RF=1.5kΩ RL=100Ω f=150kHz -50 9 VOP-P (V) ±VS (V) THD (dB) 5 FIGURE 8. DIFFERENTIAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE (ALL PACKAGES) 4 PEAKING (dB) 3 VOP-P (V) -75 -85 -90 -80 1 3 5 7 11 9 13 15 17 19 21 VOP-P (V) FIGURE 11. DIFFERENTIAL TOTAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE (ALL PACKAGES) 4 1 3 5 7 9 11 13 15 17 19 VOP-P (V) FIGURE 12. DIFFERENTIAL TOTAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT (ALL PACKAGES) FN7015.2 March 26, 2007 EL1509 Typical Performance Curves -10 100 VOLTAGE NOISE (nV/√Hz), CURRENT NOISE (pA/√Hz) -20 ISOLATION (dB) -30 -40 -50 B→A -60 -70 A→B -80 -90 IB10 EN IB+ -100 -110 10K 100K 10M 1M 1 10 100M 100 1K FIGURE 13. CHANNEL ISOLATION vs FREQUENCY 100K 1M 10M 100M FIGURE 14. VOLTAGE AND CURRENT NOISE vs FREQUENCY 30 100 OUTPUT IMPEDANCE (Ω) 20 10 0 PSRR (dB) 10K FREQUENCY (Hz) FREQUENCY (Hz) -10 -20 -30 PSRR- -40 -50 PSRR+ VS=±12V AV=1 RF=1.5kΩ 10 1 0.1 0.01 -60 -70 10K 100K 1M 10M 0.001 10K 100M 100K FIGURE 15. POWER SUPPLY REJECTION vs FREQUENCY MAGNITUDE (Ω) 100K 0.06 0 0.05 -50 -100 -150 10K -200 1K -250 1K 10K 100K 1M 10M -300 100M FREQUENCY (Hz) FIGURE 17. TRANSIMEDANCE (ROL) vs FREQUENCY 5 DIFFERENTIAL GAIN (%), DIFFERENTIAL PHASE (°) GAIN PHASE 100 100 100M FIGURE 16. OUTPUT IMPEDANCE vs FREQUENCY 50 PHASE (°) 10M 1M 10M 1M FREQUENCY (Hz) FREQUENCY (Hz) 0.04 GAIN 0.03 PHASE 0.02 0.01 0 0 1 2 3 4 5 NUMBER OF 150Ω LOADS FIGURE 18. DIFFERENTIAL GAIN & PHASE FN7015.2 March 26, 2007 EL1509 Typical Performance Curves 10 INPUT BIAS CURRENT (µA) SUPPLY CURRENT (mA) 14.5 14 13.5 13 8 6 IB- 4 2 0 -2 IB+ -4 -6 -8 12.5 -50 -25 0 25 50 75 100 125 -10 -50 150 -25 0 TEMPERATURE (°C) 25 50 75 100 125 150 TEMPERATURE (°C) FIGURE 19. SUPPLY CURRENT vs TEMPERATURE FIGURE 20. INPUT BIAS CURRENT vs TEMPERATURE 5.2 520 510 5.15 SLEW RATE (V/µs) OUTPUT VOLTAGE (±V) RL=100Ω 5.1 50.5 5 4.95 4.9 500 490 480 470 460 450 4.85 4.8 -50 -25 0 25 50 75 100 125 440 -50 150 -25 0 TEMPERATURE (°C) FIGURE 21. OUTPUT VOLTAGE vs TEMPERATURE 50 75 100 125 150 FIGURE 22. SLEW RATE vs TEMPERATURE 7 6 OFFSET VOLTAGE (mV) 16 14 12 IS (mA) 25 TEMPERATURE (°C) 10 8 6 4 2 5 4 3 2 1 0 -1 -2 0 0 1 2 3 4 5 6 7 ±VS (V) FIGURE 23. SUPPLY CURRENT vs SUPPLY VOLTAGE 6 -3 -50 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) FIGURE 24. OFFSET VOLTAGE vs TEMPERATURE FN7015.2 March 26, 2007 EL1509 Typical Performance Curves 0.9 POWER DISSIPATION (W) TRANSIMPEDANCE (MΩ) 3 2.5 2 1.5 1 0.5 JEDEC JESD51-3 AND SEMI G42-88 (SINGLE LAYER) TEST BOARD 0.8 781mW 0.7 SO 8 16 0.6 0.5 0° & DF N8 C/ W 0.4 0.3 0.2 0.1 0 -50 0 -25 0 25 50 75 100 125 150 TEMPERATURE (°C) 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 25. TRANSIMEDANCE vs TEMPERATURE FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY (4-LAYER) TEST BOARD (DFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5) POWER DISSIPATION (W) 3.5 2.907W 3 2.5 43 2 1.5 DF N8 °C /W 1.136W S O8 11 0° C/W 1 0.5 0 0 25 75 85 100 50 125 150 AMBIENT TEMPERATURE (°C) FIGURE 27. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Applications Information Product Description The EL1509 is a dual operational amplifier designed for customer premise line driving in DMT ADSL solutions. It is a dual current mode feedback amplifier with low distortion while drawing moderately low supply current. It is built using Elantec's proprietary complimentary bipolar process and is offered in industry standard pin-outs. Due to the current feedback architecture, the EL1509 closed-loop 3dB bandwidth is dependent on the value of the feedback resistor. First the desired bandwidth is selected by choosing the feedback resistor, RF, and then the gain is set by picking the gain resistor, RG. The curves at the beginning of the Typical Performance Curves section show the effect of varying both RF and RG. The 3dB bandwidth is somewhat dependent on the power supply voltage. 7 Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended. Lead lengths should be as short as possible, below ¼”. The power supply pins must be well bypassed to reduce the risk of oscillation. A 1.0µF tantalum capacitor in parallel with a 0.01µF ceramic capacitor is adequate for each supply pin. For good AC performance, parasitic capacitances should be kept to a minimum, especially at the inverting input. This implies keeping the ground plane away from this pin. Carbon resistors are acceptable, while use of wire-wound resistors should not be used because of their parasitic inductance. Similarly, capacitors should be low inductance for best performance. FN7015.2 March 26, 2007 EL1509 Capacitance at the Inverting Input Supply Voltage Range Due to the topology of the current feedback amplifier, stray capacitance at the inverting input will affect the AC and transient performance of the EL1509 when operating in the non-inverting configuration. The EL1509 has been designed to operate with supply voltages from ±2.5V to ±6V. Optimum bandwidth, slew rate, and video characteristics are obtained at higher supply voltages. However, at ±2.5V supplies, the 3dB bandwidth at AV = +2 is a respectable 40MHz. In the inverting gain mode, added capacitance at the inverting input has little effect since this point is at a virtual ground and stray capacitance is therefore not “seen” by the amplifier. Single Supply Operation If a single supply is desired, values from +5V to +12V can be used as long as the input common mode range is not exceeded. When using a single supply, be sure to either 1) DC bias the inputs at an appropriate common mode voltage and AC couple the signal, or 2) ensure the driving signal is within the common mode range of the EL1509. Feedback Resistor Values The EL1509 has been designed and specified with RF = 1.5kΩ for AV = +5. This value of feedback resistor yields extremely flat frequency response with little to no peaking out to 50MHz. As is the case with all current feedback amplifiers, wider bandwidth, at the expense of slight peaking, can be obtained by reducing the value of the feedback resistor. Inversely, larger values of feedback resistor will cause rolloff to occur at a lower frequency. See the curves in the Typical Performance Curves section which show 3dB bandwidth and peaking vs. frequency for various feedback resistors and various supply voltages. ADSL CPE Applications The EL1509 is designed as a line driver for ADSL CPE modems. It is capable of outputting 250mA of output current with a typical supply voltage headroom of 1.3V. It can achieve -85dBc of distortion at low 7.1mA of supply current per amplifier. The average line power requirement for the ADSL CPE application is 13dBm (20mW) into a 100Ω line. The average line voltage is 1.41VRMS. The ADSL DMT peak to average ratio (crest factor) of 5.3 implies peak voltage of 7.5V into the line. Using a differential drive configuration and transformer coupling with standard back termination, a transformer ratio of 1:2 is selected. The circuit configuration is as shown below. Bandwidth vs Temperature Whereas many amplifier's supply current and consequently 3dB bandwidth drop off at high temperature, the EL1509 was designed to have little supply current variations with temperature. An immediate benefit from this is that the 3dB bandwidth does not drop off drastically with temperature. + - 12.5 TX1 1.5k AFE 100 464Ω + - 1:2 12.5 1.5k 8 FN7015.2 March 26, 2007 EL1509 Small Outline Package Family (SO) A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X MDP0027 SMALL OUTLINE PACKAGE FAMILY (SO) INCHES SYMBOL SO-14 SO16 (0.300”) (SOL-16) SO20 (SOL-20) SO24 (SOL-24) SO28 (SOL-28) TOLERANCE NOTES A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX - A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 ±0.003 - A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 ±0.002 - b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 ±0.003 - c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 ±0.001 - D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 ±0.004 1, 3 E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 ±0.008 - E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 ±0.004 2, 3 e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic - L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 ±0.009 - L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic - h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference - 16 20 24 28 Reference - N SO-8 SO16 (0.150”) 8 14 16 Rev. M 2/07 NOTES: 1. Plastic or metal protrusions of 0.006” maximum per side are not included. 2. Plastic interlead protrusions of 0.010” maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994 9 FN7015.2 March 26, 2007 EL1509 Dual Flat No-Lead Package Family (DFN) MDP0047 A DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229) D MILLIMETERS N N-1 0.075 C 2X PIN #1 I.D. E 1 DFN8 DFN10 TOLERANCE A 0.85 0.90 ±0.10 A1 0.02 0.02 +0.03/-0.02 b 0.30 0.25 ±0.05 c 0.20 0.20 Reference D 4.00 3.00 Basic D2 3.00 2.25 Reference E 4.00 3.00 Basic E2 2.20 1.50 Reference e 0.80 0.50 Basic L 0.50 0.50 ±0.10 L1 0.10 0 Maximum 2 0.075 C B 2X TOP VIEW (D2) 4 SYMBOL L1 N-1 N L (N LEADS) Rev. 2 2/07 NOTES: (E2) 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Exposed lead at side of package is a non-functional feature. PIN #1 I.D. 1 2 5 3 e b 0.10 M C A B 4. Exposed leads may extend to the edge of the package or be pulled back. See dimension “L1”. 5. Inward end of lead may be square or circular in shape with radius (b/2) as shown. BOTTOM VIEW 0.10 3. Bottom-side pin #1 I.D. may be a diepad chamfer, an extended tiebar tab, or a small square as shown. 6. N is the total number of leads on the device. C C SEATING PLANE 0.08 C SEE DETAIL "X" (N LEADS & EXPOSED PAD) 2 C A (c) A1 DETAIL X All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN7015.2 March 26, 2007