EL1510 ® Data Sheet March 26, 2007 FN7122.2 Medium Power Differential Line Driver Features The EL1510 is a dual operational amplifier designed for central office and customer premise line driving in both SDSL and ADSL solutions. This device features a high drive capability of 250mA while consuming only 7.5mA of supply current per amplifier, operating from ±12V supplies. This driver achieves a typical distortion of less than -85dBc, at 150kHz into a 25Ω load. The EL1510 is available in the power 8 Ld DFN package and is specified for operation over the full -40°C to +85°C temperature range. The DFN package has the potential for a very low junction to ambient thermal resistance of 43°C/W, making it suitable for high power applications. The EL1510 is in the 8 Ld SOIC package and thus is limited to applications where the power dissipation in the device is less than 781mW. • 40VP-P differential output drive into 100Ω The EL1510 is ideal for CPE modem applications in ADSL, HDSL2, G.SHDSL, and VDSL. • -85dBc typical driver output distortion at full output at 150kHz • Low quiescent current of 7.5mA per amplifier • Pb-free plus anneal available (RoHS compliant) Applications • ADSL G.lite CO line driving • G.SHDSL, HDSL2 line drivers • ADSL full rate CPE line driving • Video distribution amplifiers • Video twisted-pair line drivers Ordering Information Pinouts PART NUMBER PART TAPE & MARKING REEL PACKAGE PKG. DWG. # EL1510CS 1510CS - 8 Ld SOIC MDP0027 EL1510CS-T7 1510CS 7” 8 Ld SOIC MDP0027 EL1510CS-T13 1510CS 13” 8 Ld SOIC MDP0027 7 OUTB EL1510CSZ (See Note) 1510CSZ - 8 Ld SOIC (Pb-Free) MDP0027 6 INB- EL1510CSZ-T7 (See Note) 1510CSZ 7” 8 Ld SOIC (Pb-Free) MDP0027 EL1510CSZ-T13 1510CSZ (See Note) 13” 8 Ld SOIC (Pb-Free) MDP0027 EL1510 (8 LD SOIC) TOP VIEW OUTA 1 8 VS INA- 2 + INA+ 3 GND 5 INB+ + 4 EL1510 (8 LD DFN) TOP VIEW OUTA 1 INA- 2 INA+ 3 + - Amp A GND + 4 8 VS 7 OUTB 6 INB- 5 INB+ EL1510CL 1510CL - 8 Ld DFN MDP0047 EL1510CL-T7 1510CL 7” 8 Ld DFN MDP0047 EL1510CL-T13 1510CL 13” 8 Ld DFN MDP0047 NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020C. Amp B 1 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-468-3774 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright © Intersil Americas Inc. 2002, 2004, 2007. All Rights Reserved. All other trademarks mentioned are the property of their respective owners. EL1510 Absolute Maximum Ratings (TA = +25°C) VS+ Voltage to Ground . . . . . . . . . . . . . . . . . . . . . . -0.3V to +26.4V VIN+ Voltage . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . GND to VS+ Current into any Input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8mA Continuous Output Current . . . . . . . . . . . . . . . . . . . . . . . . . . . 75mA Ambient Operating Temperature Range . . . . . . . . . .-40°C to +85°C Storage Temperature Range . . . . . . . . . . . . . . . . . .-60°C to +150°C Operating Junction Temperature . . . . . . . . . . . . . . .-40°C to +150°C Power Dissipation . . . . . . . . . . . . . . . . . . . . . . . . . . . . . See Curves CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. IMPORTANT NOTE: All parameters having Min/Max specifications are guaranteed. Typical values are for information purposes only. Unless otherwise noted, all tests are at the specified temperature and are pulsed tests, therefore: TJ = TC = TA Electrical Specifications PARAMETER VS = ±12V, RF = 1.5kΩ, RL = 100Ω to mid supply, TA = 25°C unless otherwise specified. DESCRIPTION CONDITIONS MIN TYP MAX UNIT AC PERFORMANCE BW -3dB Bandwidth AV = +4 70 MHz HD Total Harmonic Distortion f = 1MHz, VO = 16VP-P, RL = 50Ω -75 dBc dG Differential Gain AV = +2, RL = 37.5Ω 0.17 % dθ Differential Phase AV = +2, RL = 37.5Ω 0.1 ° SR Slewrate VOUT from -4.5V to +4.5V 500 V/µs 350 DC PERFORMANCE VOS Offset Voltage -17 17 mV ΔVOS VOS Mismatch -10 10 mV ROL Transimpedance 3.5 MΩ VOUT from -4.5V to +4.5V 1 2 INPUT CHARACTERISTICS IB+ Non-Inverting Input Bias Current -5 5 µA IB- Inverting Input Bias Current -30 30 µA ΔIB- IB- Mismatch -20 20 µA eN Input Noise Voltage 2.8 nV/√ Hz iN+ +Input Noise Current 1.8 pA/√ Hz iN- -Input Noise Current 19 pA/√ Hz OUTPUT CHARACTERISTICS VOUT Loaded Output Swing Single Ended RL = 100Ω to GND ±10.3 ±10.9 V VOUT P Loaded Output Swing Single Ended RL = 25Ω to GND 9.5 10.2 V VOUT N Loaded Output Swing Single Ended RL = 25Ω to GND -8.2 -9.8 V IOUT Output Current RL = 0Ω 500 mA VS Supply Voltage Single Supply IS Supply Current per Amplifier All Outputs at 0V SUPPLY 2 5 7.5 24 V 9 mA FN7122.2 March 26, 2007 EL1510 Typical Performance Curves 28 24 55 VS=±12V AV=10 RL=100Ω 51 49 20 RF=1kΩ 16 BW (MHz) RF=1.5kΩ GAIN (dB) AV=5 RF=1.5kΩ RL=100Ω 53 8 Ld DFN 47 45 43 RF=2kΩ 8 Ld SO 41 12 39 37 8 100K 35 1M 10M 100M 5 6 8 7 FIGURE 1. DIFFERENTIAL FREQUENCY RESPONSE vs RF 11 12 FIGURE 2. DIFFERENTIAL BANDWIDTH vs SUPPLY VOLTAGE 16 22 18 10 9 ±VS (V) FREQUENCY (Hz) VS=±12V AV=5 RL=100Ω 14 12 RF=1kΩ 14 10 IS (mA) GAIN (dB) RF=1.5kΩ 10 8 6 RF=2kΩ 4 6 2 2 100K 0 1M 10M 100M 0 1 2 4 3 5 FREQUENCY (Hz) 8 9 10 11 12 13 FIGURE 4. SUPPLY CURRENT vs SUPPLY VOLTAGE -45 22 VS=±12V AV=5 RL=100Ω RF=1.5kΩ CL=22pF VS=±6V AV=5 RF=1.5kΩ RL=100Ω f=1MHz -50 -55 CL=10pF -60 14 THD (dB) GAIN (dB) 7 ±VS (V) FIGURE 3. DIFFERENTIAL FREQUENCY RESPONSE vs RF 18 6 10 CL=0pF -65 -70 VS=±6V VS=±12V -75 -80 6 -85 2 100K -90 1M 10M 100M FREQUENCY (Hz) FIGURE 5. DIFFERENTIAL FREQUENCY RESPONSE vs CL 3 1 5 9 13 17 21 25 29 33 37 41 45 VOP-P (V) FIGURE 6. DIFFERENTIAL TOTAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE - ALL PACKAGES FN7122.2 March 26, 2007 EL1510 Typical Performance Curves (Continued) -50 -40 VS=±6V AV=5 RF=1.5kΩ RL=100Ω f=1MHz -55 -60 -60 -70 THD (dB) -65 HD (dB) VS=±12V RLOAD=200Ω (DIFF) AV=10 & 15 -50 HD3 -75 -70 100kHz -80 HD2 -90 -85 -90 50kHz -100 1 3 5 7 9 11 13 15 17 19 0 5 10 15 25 FIGURE 8. DISTORTION RESULTS FIGURE 7. DIFFERENTIAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE - ALL PACKAGES -50 -30 VS=±12V AV=5 RF=1.5kΩ RL=100Ω f=1MHz -60 VS=±6V RLOAD=200Ω (DIFF) AV=10 & 15 -40 -50 -65 THD (dB) -55 HD3 -70 -75 -60 100kHz -70 200kHz -80 -80 -85 HD2 50kHz -90 -90 1 5 9 13 17 21 25 29 33 37 41 0 45 1 2 3 VOP-P (V) 4 5 6 7 8 9 10 VOUT PTP (V) FIGURE 10. DISTORTION RESULTS FIGURE 9. DIFFERENTIAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE - ALL PACKAGES 100 -50 -60 OUTPUT IMPEDANCE (Ω) AV=5 RF=1.5kΩ RL=100Ω f=1MHz -55 THD (dB) 20 VOUT PTP (V) VOP-P (V) HD (dB) 200kHz -80 -65 VS=±6V -70 VS=±12V -75 10 VS=±12V AV=1 RF=1.5kΩ 1 0.1 0.01 -80 -85 1 5 9 13 17 21 25 29 33 37 41 45 VOP-P (V) FIGURE 11. DIFFERENTIAL TOTAL HARMONIC DISTORTION vs DIFFERENTIAL OUTPUT VOLTAGE - ALL PACKAGES 4 0.001 10K 100K 1M 10M 100M FREQUENCY (Hz) FIGURE 12. OUTPUT IMPEDANCE vs FREQUENCY FN7122.2 March 26, 2007 EL1510 Typical Performance Curves (Continued) 100 VOLTAGE NOISE (nV/√Hz), CURRENT NOISE (pA/√Hz) CHANNEL SEPARATION (dB) -10 -30 -50 -70 B→A A→B -90 IB- 10 EN IB+ 1 -110 10K 100K 1M 10M 10 100M 100 1K 10K 100K 1M 10M FREQUENCY (Hz) FREQUENCY (Hz) FIGURE 13. CHANNEL SEPARATION vs FREQUENCY FIGURE 14. VOLTAGE AND CURRENT NOISE vs FREQUENCY 20 0.18 0.16 DIFFERENTIAL GAIN (%) PSRR (dB) 0 -20 -40 PSRR- PSRR+ -60 VS=±12V 0.14 VS=±6V 0.12 0.1 0.08 0.06 0.04 0.02 02 -80 10K 100K 1M 10M 0 100M 1 2 3 4 5 NUMBER of 150Ω LOADS FREQUENCY (Hz) FIGURE 15. PSRR vs FREQUENCY FIGURE 16. DIFFERENTIAL GAIN 0.12 40 10M PHASE -80 100K -120 -160 10K GAIN -200 -240 1K PHASE (°) MAGNITUDE (Ω) -40 DIFFERENTIAL PHASE (°) 0 1M 0.1 0.08 VS=±6V 0.06 VS=±12V 0.04 0.02 -280 100 1K 10K 100K 1M 10M -320 100M FREQUENCY (Hz) FIGURE 17. TRANSIMPEDANCE (ROL) vs FREQUENCY 5 0 0 1 2 3 4 5 NUMBER of 150Ω LOADS FIGURE 18. DIFFERENTIAL PHASE FN7122.2 March 26, 2007 EL1510 (Continued) 16 490 15.5 470 SLEW RATE (V/µs) SUPPLY CURRENT (mA) Typical Performance Curves 15 14.5 14 13.5 13 -50 450 430 410 390 370 -25 0 25 50 75 100 125 350 -50 150 -25 0 DIE TEMPERATURE (°C) FIGURE 19. SUPPLY CURRENT vs TEMPERATURE 50 75 100 125 150 FIGURE 20. SLEW RATE vs TEMPERATURE 11.1 18 VS=±12V RL=200Ω 16 14 11 12 10 VOUT INPUT BIAS CURRENT (µA) 25 DIE TEMPERATURE (°C) 8 IB- 6 10.9 4 10.8 2 IB+ 0 -2 -50 -25 0 25 50 75 100 125 10.7 -50 150 0 FIGURE 21. INPUT BIAS CURRENT vs TEMPERATURE 100 150 FIGURE 22. OUTPUT VOLTAGE vs TEMPERATURE 10 -10.6 VS=±12V RL=200Ω 8 6 -10.8 VOUT OFFSET VOLTAGE (mV) 50 DIE TEMPERATURE (°C) DIE TEMPERATURE (°C) 4 2 -11 0 -2 -50 -25 0 25 50 75 100 125 DIE TEMPERATURE (°C) FIGURE 23. OFFSET VOLTAGE vs TEMPERATURE 6 150 -11.2 -50 0 50 100 150 DIE TEMPERATURE (°C) FIGURE 24. OUTPUT VOLTAGE vs TEMPERATURE FN7122.2 March 26, 2007 EL1510 Typical Performance Curves (Continued) 3.5 1.8 1.6 POWER DISSIPATION (W) TRANSIMPEDANCE (MΩ) 3 JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 2.5 2 1.5 1 0.5 1.4 1.136W 1.2 1 θJ 0.8 SO 8 10 °C /W A =1 0.6 0.4 0.2 0 -50 -25 0 25 50 75 100 125 0 150 0 25 75 85 50 100 125 150 DIE TEMPERATURE (°C) AMBIENT TEMPERATURE (°C) FIGURE 25. TRANSIMPEDANCE vs TEMPERATURE 4.5 FIGURE 26. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE JEDEC JESD51-7 HIGH EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD - DFN EXPOSED DIEPAD SOLDERED TO PCB PER JESD51-5 1.2 POWER DISSIPATION (W) POWER DISSIPATION (W) 4 3.5 2.907W 3 DF N8 θJ A =4 3 °C /W 2.5 2 1.5 1 JEDEC JESD51-3 LOW EFFECTIVE THERMAL CONDUCTIVITY TEST BOARD 1 781mW 0.8 SO θJ 0.6 A =1 8& 60 DF N8 °C /W 0.4 0.2 0.5 0 0 0 25 75 85 50 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 27. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Applications Information Product Description The EL1510 is a dual operational amplifier designed for line driving in DMT ADSL solutions. It is a dual current mode feedback amplifier with low distortion while drawing moderately low supply current. It is built using Elantec's proprietary complimentary bipolar process and is offered in industry standard pin-outs. Due to the current feedback architecture, the EL1510 closed-loop 3dB bandwidth is dependent on the value of the feedback resistor. First the desired bandwidth is selected by choosing the feedback resistor, RF, and then the gain is set by picking the gain resistor, RG. The curves at the beginning of the Typical Performance Curves section show the effect of varying both RF and RG. The 3dB bandwidth is somewhat dependent on the power supply voltage. 7 0 25 50 75 85 100 125 150 AMBIENT TEMPERATURE (°C) FIGURE 28. PACKAGE POWER DISSIPATION vs AMBIENT TEMPERATURE Power Supply Bypassing and Printed Circuit Board Layout As with any high frequency device, good printed circuit board layout is necessary for optimum performance. Ground plane construction is highly recommended. Lead lengths should be as short as possible, below ¼”. The power supply pins must be well bypassed to reduce the risk of oscillation. A 1.0µF tantalum capacitor in parallel with a 0.01µF ceramic capacitor is adequate for each supply pin. For good AC performance, parasitic capacitances should be kept to a minimum, especially at the inverting input. This implies keeping the ground plane away from this pin. Carbon resistors are acceptable, while use of wire-wound resistors should not be used because of their parasitic inductance. Similarly, capacitors should be low inductance for best performance. FN7122.2 March 26, 2007 EL1510 Capacitance at the Inverting Input Supply Voltage Range and Operation Due to the topology of the current feedback amplifier, stray capacitance at the inverting input will affect the AC and transient performance of the EL1510 when operating in the non-inverting configuration. The EL1510 has been designed to operate with supply voltages from ±2.5V to ±12V. If a single supply is desired, values from +5V to +24V can be used as long as the input common mode range is not exceeded. When using a single supply, be sure to either 1) DC bias the inputs at an appropriate common mode voltage and AC couple the signal, or 2) ensure the driving signal is within the common mode range of the EL1510. In the inverting gain mode, added capacitance at the inverting input has little effect since this point is at a virtual ground and stray capacitance is therefore not “seen” by the amplifier. Feedback Resistor Values The EL1510 has been designed and specified with RF=1.5kΩ for AV=+5. This value of feedback resistor yields extremely flat frequency response with no peaking out to 40MHz. As is the case with all current feedback amplifiers, wider bandwidth, at the expense of slight peaking, can be obtained by reducing the value of the feedback resistor. Inversely, larger values of feedback resistor will cause rolloff to occur at a lower frequency. See the curves in the Typical Performance Curves section which show 3dB bandwidth and peaking vs frequency for various feedback resistors and various supply voltages. Bandwidth vs Temperature Whereas many amplifiers’ supply current and consequently 3dB bandwidth drop-off at high temperature, the EL1510 was designed to have little supply current variations with temperature. An immediate benefit from this is that the 3dB bandwidth does not drop off drastically with temperature. ADSL CPE Applications The EL1510 is designed as a line driver for ADSL CPE modems. It is capable of outputting 400mA of output current with a typical supply voltage headroom of 1.8V. It can achieve -85dBc of distortion at low 7.5mA of supply current per amplifier. The average line power requirement for the ADSL CPE application is 13dBm (20mW) into a 100Ω line. The average line voltage is 1.41VRMS. The ADSL DMT peak to average ratio (crest factor) of 5.3 implies peak voltage of 7.5V into the line. Using a differential drive configuration and transformer coupling with standard back termination, a transformer ratio of 1:1 is selected. The circuit configuration is as shown below. + - 50 1.5k TX1 AFE 100 300Ω + - 1:1 50 1.5k 8 FN7122.2 March 26, 2007 EL1510 Small Outline Package Family (SO) A D h X 45° (N/2)+1 N A PIN #1 I.D. MARK E1 E c SEE DETAIL “X” 1 (N/2) B L1 0.010 M C A B e H C A2 GAUGE PLANE SEATING PLANE A1 0.004 C 0.010 M C A B L b 0.010 4° ±4° DETAIL X MDP0027 SMALL OUTLINE PACKAGE FAMILY (SO) INCHES SYMBOL SO-14 SO16 (0.300”) (SOL-16) SO20 (SOL-20) SO24 (SOL-24) SO28 (SOL-28) TOLERANCE NOTES A 0.068 0.068 0.068 0.104 0.104 0.104 0.104 MAX - A1 0.006 0.006 0.006 0.007 0.007 0.007 0.007 ±0.003 - A2 0.057 0.057 0.057 0.092 0.092 0.092 0.092 ±0.002 - b 0.017 0.017 0.017 0.017 0.017 0.017 0.017 ±0.003 - c 0.009 0.009 0.009 0.011 0.011 0.011 0.011 ±0.001 - D 0.193 0.341 0.390 0.406 0.504 0.606 0.704 ±0.004 1, 3 E 0.236 0.236 0.236 0.406 0.406 0.406 0.406 ±0.008 - E1 0.154 0.154 0.154 0.295 0.295 0.295 0.295 ±0.004 2, 3 e 0.050 0.050 0.050 0.050 0.050 0.050 0.050 Basic - L 0.025 0.025 0.025 0.030 0.030 0.030 0.030 ±0.009 - L1 0.041 0.041 0.041 0.056 0.056 0.056 0.056 Basic - h 0.013 0.013 0.013 0.020 0.020 0.020 0.020 Reference - 16 20 24 28 Reference - N SO-8 SO16 (0.150”) 8 14 16 Rev. M 2/07 NOTES: 1. Plastic or metal protrusions of 0.006” maximum per side are not included. 2. Plastic interlead protrusions of 0.010” maximum per side are not included. 3. Dimensions “D” and “E1” are measured at Datum Plane “H”. 4. Dimensioning and tolerancing per ASME Y14.5M-1994 9 FN7122.2 March 26, 2007 EL1510 Dual Flat No-Lead Package Family (DFN) MDP0047 A DUAL FLAT NO-LEAD PACKAGE FAMILY (JEDEC REG: MO-229) D MILLIMETERS N N-1 0.075 C 2X PIN #1 I.D. E 1 DFN8 DFN10 TOLERANCE A 0.85 0.90 ±0.10 A1 0.02 0.02 +0.03/-0.02 b 0.30 0.25 ±0.05 c 0.20 0.20 Reference D 4.00 3.00 Basic D2 3.00 2.25 Reference E 4.00 3.00 Basic E2 2.20 1.50 Reference e 0.80 0.50 Basic L 0.50 0.50 ±0.10 L1 0.10 0 Maximum 2 0.075 C B 2X TOP VIEW (D2) 4 SYMBOL L1 N-1 N L (N LEADS) Rev. 2 2/07 NOTES: (E2) 1. Dimensioning and tolerancing per ASME Y14.5M-1994. 2. Exposed lead at side of package is a non-functional feature. PIN #1 I.D. 1 2 5 3 e b 0.10 M C A B 4. Exposed leads may extend to the edge of the package or be pulled back. See dimension “L1”. 5. Inward end of lead may be square or circular in shape with radius (b/2) as shown. BOTTOM VIEW 0.10 3. Bottom-side pin #1 I.D. may be a diepad chamfer, an extended tiebar tab, or a small square as shown. 6. N is the total number of leads on the device. C C SEATING PLANE 0.08 C SEE DETAIL "X" (N LEADS & EXPOSED PAD) 2 C A (c) A1 DETAIL X All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9000 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 10 FN7122.2 March 26, 2007