SANKEN ELECTRIC CO., LTD. FMLB-4204S １ Scope The present specifications shall apply to an FMLB-4204S. ２ Outline Type Silicon Diode Structure Resin Molded Applications High Frequency Rectification ３ Flammability UL94V-0 (Equivalent) 120614 SSA-05446 1／8 61426-01 SANKEN ELECTRIC CO., LTD. ４ FMLB-4204S Absolute maximum ratings No. Item Symbol Unit Rating Conditions 1 Transient Peak Reverse Voltage VRSM V 400 2 Peak Reverse Voltage VRM V 400 3 Average Forward Current IF(AV) A 20 Refer to Derating of 7 4 Peak Surge Forward Current IFSM A 100 Half sinewave, one shot 5 I2t Limiting Value I2t A2s 50 1msec≦t≦10msec 6 Junction Temperature Tj ℃ -40～+150 7 Storage Temperature Tstg ℃ -40～+150 8 Dielectric Strength ― kV A.C.1.0 Between lead and case (1minute) No.1,2,4&5 show ratings per one chip. ５ Electrical characteristics (Ta=25℃ ，unless otherwise specified) No Item Symbol Unit Value Conditions 1 Forward Voltage Drop VF V 1.3 max. IF=10A 2 Reverse Leakage Current IR uA 200 max. VR=VRM 3 Reverse Leakage Current Under High Temperature H･IR uA 400 max. VR=VRM, Tj=150℃ trr-1 ns 50 max. trr-2 ns 35 max. Rth(j-c) ℃/W 2.0 max. 4 5 Reverse Recovery Time Thermal Resistance IF=IRP=500mA 90% Recovery point, Tj=25℃ IF=500mA, IRP=1A 75% Recovery point, Tj=25℃ Between Junction and case No.1,2,3&4 show characteristics per one chip. 120614 SSA-05446 2／8 61426-01 SANKEN ELECTRIC CO., LTD. FMLB-4204S ６ Characteristics IF(AV) － PF 40 Tj=150℃ t T Forward Power Dissipation (W) 30 t/T=1/6 t/T=1/3,sinewave 20 t/T=1/2 DC 10 0 0 5 10 15 20 Average Forward Current (A) VR － P R 0.5 Tj=150℃ t Reverse Power Dissipation (W) 0.4 T 0.3 0.2 1-t/T=5/6 1-t/T=2/3 0.1 1-t/T=1/2 sinewave 0 0 100 200 300 400 Reverse Voltage (V) 120614 SSA-05446 3／8 61426-01 SANKEN ELECTRIC CO., LTD. ７ FMLB-4204S Derating Tc － IF(AV) VR=400(V) 20 t/T=1/6 Average Forward Current (A) DC t/T=1/3，sinewave 10 t/T=1/2 Tj=150℃ t T 0 50 100 150 Case Temperature (℃) 120614 SSA-05446 4／8 61426-01 SANKEN ELECTRIC CO., LTD. FMLB-4204S ８ Package information ８-１Package type, physical dimensions and material ※ 1 ※ 2 ※ 3 ※：root dimension ※ ※ ※ tolerance － ±0.2 Dimensions in ㎜ ８-２ Appearance The body shall be clean and shall not bear any stain, rust or flaw. ８-３ Marking Marking Type Name ＊1 ＊2 ＊3 Type Name Polarity Lot number 1st letter: Last digit of year FMLB-4204S 2nd letter: Month From 1 to 9 for Jan. to Sep., O for Oct., N for Nov., D for Dec. LB4204S 3rd & 4th letter: Day ex. 2614 (June 14, 2012) ９ Internal structure diagram No. Name of part Materials ②,⑥ ① Frame: Heat Sink Nickel Plated Copper ③ ② Chip Silicon ④ ③ Inner Leads Aluminum Wire ⑤ ④ Resin Body Epoxy Resin ① ⑤ Frame: Pin Nickel Plated Copper + Solder Dipped Weight of products: Approx. 6.5g ⑥ 120614 Junction Coating Resin polyimide SSA-05446 5／8 61426-01 SANKEN ELECTRIC CO., LTD. FMLB-4204S １０ Reliability No. Item Rating Conditions 1 Thermal Fatigue Test 5000 cycles ⊿Tj=100℃ 2 High Temperature Reverse Bias Test 1000 hours Ta=150℃, 3 Humidity Reverse Bias Test 500 hours Ta=85℃, 4 High Temperature Storage Test 1000 hours 5 Moisture Resistance Test 1000 hours 6 Thermal Shock Test 100 cycle Ice-water(5min.) ~ R.T.(20sec.) ~ Boiling-water(5min.) 7 Temperature Cycle Test 100 cycle -40℃(30min.) ~ +150℃(30min.) 8 Pressure Cooker Test 96 hours 121℃,100%R.H.,2.0265×105Pa, Unsaturated equipment 10 sec. 260±5℃, Dipping up to 1.5mm form case 3.5 sec. 380±5℃, Using soldering iron 245±5℃, 5±0.5sec., Using rosin flux 9 VR=VRM (Half sinewave) With Fin R.H.=85%, VR=VRM×0.8(D.C.) Ta=150℃ Ta=85℃, 85%R.H. Resistance to Soldering Heat Test 10 Solderability Test 95% 11 Lead Bend Test 2 cycles 12 Lead Pull Test 1 time. 13 Lead Twist Test 2 times 14 Drop Test 10 times Acceptance Criteria (1) Item No.1~9 (2)Item No.10 Apply EIAJ ED-4701/400 Naturally drop from 1m height on maple plate The product shall meet the electrical specifications in paragraph 5 satisfy 1 and 2, after being exposed to normal temperature for less than 24 hours in 2 hours or more The product shall meet the rating. (3)Item No.11~14 There shall be no trouble in testing and the electrical characteristics in paragraph 5 satisfy 1 and 2. 120614 SSA-05446 6／8 61426-01 SANKEN ELECTRIC CO., LTD. FMLB-4204S ！ △ CAUTION/ WARNING （１） Remarks in using silicone grease for a heatsink ●When silicone grease is used in mounting this product on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce forced stress. ●Volatile type silicone grease may produce cracks after elapse of long term, resulting in reducing heat radiation effect. Silicone grease with low consistency (hard grease) may cause cracks in the mold resin when screwing the product to a heat-sink. ●Depending on silicone grease to be used base oil separated from the silicone grease may penetrate into the product through possible thinner gaps between the mold resin and the lead-frame to cause wire breakage or cracks in the mold resin by swelling the coating material inside the product, resulting in the shorter product life. Therefore, silicone grease, which contains base oil not causing swelling of coating materials must be selected. Our recommended silicone grease for heat radiation purpose, which will not cause any adverse effect on the product life is indicated below: Type G746 YG6260 SC102 （２） Suppliers Shin-Etsu Chemical Co., Ltd. MOMENTIVE performance materials Inc Dow Corning Toray Co., Ltd. Mounting Method of Heatsink ●Torque when Tightening Screws Mounting Thermal resistance increases when tightening torque is small, and radiation effects are decreased. When the torque is too high, the screw can cut, the heatsink can be deformed, and/or distortion can be arise in the product’s frame. To avoid these problems, Table1. show the recommended tightening torques for each product type. Table1. MT25 MT100 Screw Tightening Torques Screw Tightening Torques 0.490 to 0.686 N･m (5 to 7 kgf･cm) 0.686 to 0.882 N･m (7 to 9 kgf･cm) Package FM20 (TO-220 & Full Mold) FM80/100 (TO-3P & Full Mold) ●Diameter of hole of heatsink: Less than 4mmφ As the slack of press mold for making the hole will be the cause of resin crack at the mounting, please pay special attention for that. 120614 SSA-05446 7／8 61426-01 SANKEN ELECTRIC CO., LTD. FMLB-4204S （３）Others 120614 Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. The products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (transportation equipment, home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). Please return to us this document with your signature(s) or seal(s) prior to the use of the products herein. When considering the use of the products in the applications where higher reliability is required (traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), please contact your nearest Sanken sales representative to discuss, and then return to us this document with your signature(s) or seal(s) prior to the use of the products herein. The use of the products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited.. In the case that you use our semiconductor devices or design your products by using our semiconductor devices, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor devices. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC’s including power devices have large self-heating value, the degree of derating of junction temperature (Tj) affects the reliability significantly. When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. Anti radioactive ray design is not considered for the products listed herein. Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken’s distribution network. SSA-05446 8／8 61426-01