SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Features and Benefits ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ ▪ Description Built-in pre-drive IC MOSFET power element Alleviate noise generation by adjusting an internal resistor CMOS compatible input (5 V) High-side gate driver using bootstrap circuit or floating power supply Built-in protection circuit for controlling power supply voltage drop (UVLO on VCC) Overcurrent protection (OCP), overcurrent limiting (OCL), and thermal shutdown (TSD) Output of fault signal during operation of protection circuit Output current 1.5, 2.5, or 3 A Small SIP (SLA 24-pin) Packages: Power SIP The SLA power package includes an IC with all of the necessary power elements (six MOSFETs), pre-driver ICs (two), and bootstrap diodes (three), needed to configure the main circuit of an inverter. This enables the main circuit of the inverter to be configured with fewer external components than traditional designs. Applications include residential white goods (home applications) and commercial appliance motor control: • Air conditioner fan • Small ventilation fan • Dishwasher pump Not to scale Leadform 2171 The SLA6868MZ and SLA6870MZ inverter power module (IPM) ICs provide a robust, highly-integrated solution for optimally controlling 3-phase motor power inverter systems and variable speed control systems used in energy-conserving designs to drive motors of residential and commercial appliances. These ICs take 230 VAC input voltage, and up to 3 A (continuous) output current. They can withstand voltages of up to 500 V (MOSFET breakdown voltage). Leadform 2175 Functional Block Diagram VB1 VB2 VB3 UVLO UVLO UVLO VCC1 UVLO HIN1 HIN2 HIN3 Input Logic VBB High-Side Level Shift Driver COM1 W1 W2 V U SD1 VCC 2 UVLO LIN1 LIN2 LIN3 COM2 SD2 Input Logic (OCP Reset ) Thermal Shutdown Low-Side Driver OCP LS 2 OCP and OCL LS1 OCL RC Figure 1. Driver block diagram. 28610.09, Rev. 6 ¯¯D̄¯2̄¯ terminals are used for both input and output. A. S̄¯¯D̄¯1̄¯ , S̄ ¯¯D̄¯2̄¯ , and Ō ¯¯C̄¯L̄¯ terminals are open-collector output. RC terminal is open-drain input. B. S̄¯¯D̄¯1̄¯ , S̄ C. Blanking Time (tblank) is used in Overcurrent Limiting (OCL) and Overcurrent Protection (OCP). If the time exceeds the limit, the signal will be output (open-collector output turns on), and protection operation will start up. SANKEN ELECTRIC CO., LTD. http://www.sanken-ele.co.jp/en/ SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Selection Guide Output Current Part Number MOSFET Breakdown Voltage, VDSS(min) (V) Continuous, IO(max) (A) Pulsed, IOP (max) (A) SLA6868MZ 500 2.5 3.75 SLA6870MZ 500 3 4.5 Absolute Maximum Ratings, valid at TA = 25°C Rating Unit MOSFET Breakdown Voltage Characteristic Symbol VDSS VCC = 15 V, ID = 100 μA, VIN = 0 V 500 V Logic Supply Voltage VCC Between VCC and COM 20 V Bootstrap Voltage VBS Between VB and HS (U,V, and W phases) 20 V Output Current, Continuous IO Output Current, Pulsed IOP Input Voltage VIN Pull-up Voltage for Shutdown Pins VSDX Pull-up Voltage for Overcurrent Limiting Pin VOCL Allowable Power Dissipation PD Remarks SLA6868MZ 2.5 A SLA6870MZ 3 A SLA6868MZ SLA6870MZ PW ≤ 100 μs, duty cycle = 1% HINx and LINx pins 3.75 A 4.5 A –0.5 to 7 V S̄¯¯D̄¯x̄¯ pins 7 V 7 V TC = 25°C 32.9 W Thermal Resistance (Junction to Case) RθJC 3.8 °C/W Case Operating Temperature TCOP All elements operating –20 to 100 °C Junction Temperature (MOSFET) TJ 150 °C Storage Temperature Tstg –40 to 150 °C All performance characteristics given are typical values for circuit or system baseline design only and are at the nominal operating voltage and an ambient temperature, TA, of 25°C, unless otherwise stated. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 2 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Recommended Operating Conditions Characteristic Main Supply Voltage Symbol VBB Remarks Between VBB and LS Min. Typ. Max. Units – – 400 V VBB Snubber Capacitor CSB 0.01 – 0.1 μF Logic Supply Voltage VCC Between VCC and COM 13.5 15 16.5 V Zener Voltage for VCCx Pins VZ Between VCC and COM 18 – 20 V VSDx, VOCL 4.5 5 5.5 V Pull-up Resistor S̄¯¯D̄¯x̄¯ Pins RUP2 3.3 – 10 kΩ Pull-up Resistor OCL Pin RUP1 1 – 10 kΩ Pull-up Resistor RC Pin RR 33 – 390 kΩ CSDX 1 – 10 nF CC 1 – 4.7 nF Pull-up Voltage Capacitor S̄¯¯D̄¯x̄¯ Pins Capacitor RC Pin Dead Time Minimum Input Pulse Width Switching Frequency 28610.09, Rev. 6 tdead TJ = –20°C to 150°C 1.5 – – μs IINMIN(on) TJ = –20°C to 150°C 0.5 – – μs IINMIN(off) TJ = –20°C to 150°C 0.5 – – μs – – 20 kHz fPWM SANKEN ELECTRIC CO., LTD. 3 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Typical Application Diagram Shows configuration for implementing current ¯¯D̄¯1̄¯ pins tied together ¯¯C̄¯L̄¯ and S̄ limiter function: Ō 1 2 3 SLA6868MZ SLA6870MZ 10 VB1 VB2 VB3 4 5V RUP1 HO 1 VCC1 HS1 DZ1 CSD1 HVIC 5 9 8 7 6 SD1 24 HO 2 HS2 12 HIN 3 HO 3 COM1 HS3 11 13 23 M HIN 1 HIN 2 CSB VCC 2 DZ2 LO 1 17 MC U 20 19 18 OCL LVIC LIN1 LIN2 LIN3 RR RS 16 LO 3 5V 15 5V CC LO 2 RUP2 22 CSD2 21 RC 14 SD2 COM 2 15 V NOTE: ▪ The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise susceptibility is necessary. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 4 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Typical Application Diagram Shows configuration without current limiter function: S̄¯¯D̄¯1̄¯ and S̄¯¯D̄¯2̄¯ pins tied together 1 3 2 SLA6868MZ SLA6870MZ 10 VB1 4 VB2 VB3 HO1 VCC1 HS1 ZD 24 5V HO2 Rup Rup1 5 9 8 7 6 SD1 HS2 12 M HIN1 HIN2 HIN3 COM1 HO3 HVIC HS3 11 13 CSD 23 VCC2 ZD LO1 17 20 19 18 OCL LIN1 LIN2 LIN3 RR VRC LO2 RS 16 LO3 15 14 RC CC 22 21 SD2 COM2 LVIC 15V NOTE: The external electrolytic capacitors should be placed as close to the IC as possible, in order to avoid malfunctions from external noise interference. Put a ceramic capacitor in parallel with the electrolytic capacitor if further reduction of noise susceptibility is necessary. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 5 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers ELECTRICAL CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Conditions SLA6868MZ Logic Supply Current ICC Bootstrap Supply Current IBX VBX = 15 V, VHIN = 5 V VIH VIL VIhys Input Voltage Input Voltage Hysteresis Input Current IIN VUVHL VUVHH Undervoltage Lock Out VUVHhys VUVLL VUVLH SDx and OCL Output Voltage Overtemperature Detection Threshold Temperature (Activation and Deactivation) SLA6870MZ VCC = 15 V, TC = –20°C to 125°C Min Typ Max Units – 4.2 7 mA – 2.7 5.0 mA – 135 380 μA VCC = 15 V – 2.9 3.4 V VCC = 15 V 1.6 2.1 – V VCC = 15 V – 0.8 – V VIN = 5 V – 230 500 μA 9.0 10.0 11.0 V 9.5 10.5 11.5 V – 0.5 – V 10.0 11.0 12.0 V 10.5 11.5 12.5 V High side, between VBx and U, V, or W High side, hysteresis Low side, between VCC2 and COM2 VUVLhys Low side, hysteresis – 0.5 – V VSDX(on), VOCL VSDX = VOCL = 5 V, RUPX = 3.3 kΩ – – 0.6 V 120 135 150 °C 100 115 130 °C – 20 – °C V TDH TDL VCC = 15 V, high-side and low side TDhys Overcurrent Protection Trip Voltage VTRIP VCC = 15 V 0.9 1.0 1.1 Overcurrent Limit Reference Voltage VLIM VCC = 15 V 0.5035 0.53 0.5565 V – 2.0 – ms Overcurrent Protection Hold Time tp VRC = 5 V, RR = 360 kΩ, CC = 0.0047 μF Blanking Time tblank VCC = 15 V 1.4 2.0 2.6 μs Bootstrap Diode Leakage Current ILBD VR = 250 V – – 10 μA Bootstrap Diode Forward Voltage VFBD – 1.1 1.3 V – 0.8 1.3 V Bootstrap Diode Recovery Time trrb Bootstrap Diode Series Resistor RBD MOSFET Breakdown Voltage VDSS MOSFET Leakage Current IDSS MOSFET On State Resistance MOSFET Diode Forward Voltage 28610.09, Rev. 6 RDS(on) VSDF SLA6868MZ SLA6870MZ IF = 0.05 A IF / IRP = 100 mA / 100 mA – 70 – ns 168 210 252 Ω VCC = 15 V, ID = 100 μA, VIN = 0 V 500 – – V VCC = 15 V, VDS = 500 V, VIN = 0 V – – 100 μA SLA6868MZ VCC = 15 V, ID = 1.5 A, VIN = 5 V – 2.0 2.4 Ω SLA6870MZ VCC = 15 V, ID = 1.25 A, VIN = 5 V – 1.4 1.7 Ω SLA6868MZ VCC = 15 V, ISD = 1.5 A, VIN = 0 V – 1.1 1.5 V SLA6870MZ VCC = 15 V, ISD = 1.25 A, VIN = 0 V – 1.0 1.5 V SANKEN ELECTRIC CO., LTD. 6 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers SLA6868MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Symbol Conditions tdH(on) trH Switching Time, High Side Typ Max Units – 790 – ns – 60 – ns – 115 – ns tdH(off) – 725 – ns tfH – 20 – ns tdL(on) – 680 – ns trrH VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V trL Switching Time, Low Side Min – 70 – ns – 120 – ns tdL(off) – 605 – ns tfL – 20 – ns Min Typ Max Units tdH(on) – 755 – ns trH – 65 – ns – 100 – ns – 680 – ns trrL VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V SLA6870MZ SWITCHING CHARACTERISTICS, valid at TA=25°C, unless otherwise noted Characteristics Switching Time, High Side Symbol trrH Conditions VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V, inductive load tdH(off) tfH – 15 – ns tdL(on) – 645 – ns trL Switching Time, Low Side 28610.09, Rev. 6 – 70 – ns – 105 – ns tdL(off) – 560 – ns tfL – 20 – ns trrL VBB = 300 V, VCC = 15 V, ID = 2.5 A, 0 V ≤ VIN ≤ 5 V, inductive load SANKEN ELECTRIC CO., LTD. 7 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers IN trr ton VDS td(on) tr 90% ID toff td(off) tf 90% 10% 10% Switching Characteristics Definitions 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 8 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Truth Table Mode Normal TSD OCP ¯¯C̄¯L̄¯ ( = L )1 Ō UVLO ( VCC )2 UVLO ( VB )3 S̄¯¯D̄¯2̄¯ ( = L ) Hin Lin H-side MOSFET L-side MOSFET L L Off Off H L On Off L H Off On H H On On L L Off Off H L On Off L H Off Off H H On Off L L Off Off H L On Off L H Off Off H H On Off Off L L Off H L Off Off L H Off On H H Off On L L Off Off H L Off Off L H Off Off H H Off Off L L Off Off H L Off Off L H Off On H H Off On L L Off Off H L On Off L H Off Off H H On Off 1The OCL feature is enabled when the Ō ¯¯C̄¯L̄¯ and S̄¯¯D̄¯1̄¯ pins are tied together externally. If these pins are not tied when an OCL condition occurs, device operation continues in Normal mode. 2Returning to the Normal mode of operation from a V CC UVLO condition, a high-side MOSFET resumes switching on the rising edge of an HINx input. On the other hand, a low-side MOSFET resumes switching on the first logic high of a LINx input after release of the UVLO condition. 3Returning to the Normal mode of operation from a V UVLO condition, a high-side MOSFET resumes switching on the rising B edge of an HINx input. Note: To prevent a shoot-through condition, the external microcontroller should not drive HINx = LINx = H at the same time. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 9 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers OCP Timing Diagram LIN LO VTRIP LS1 tblank OC P Release S D2 tp RC 3.5 V Slope defined by RC, CC Low-Side TSD Timing Diagram Open-collector output transistor turned on in low state 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 10 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers High-Side UVLO Timing Diagram Low-Side UVLO Timing Diagram LIN VCC2 UVLH UVLL UVLH LO SD2 28610.09, Rev. 6 Open-collector output transistor turned on in low state SANKEN ELECTRIC CO., LTD. 11 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers OCL Timing Diagram ¯¯C̄¯L̄¯ and S̄ ¯¯D̄¯1̄¯ pins connected externally Ō Enable resumption of high-side operation at next HIN rising edge HIN Enable resumption of low-side operation at next LIN rising edge LIN High-side shutdown High-side shutdown HO 3.3 μs 3.3 μs Low-side shutdown LO VTRIP (1 V) LS1 2 μs 2 μs VOCL (0.5 V) 2 μs OCL, SD1 VTH (2.1 V) T= 50 Cf VTH (2.9 V) VTH (2.1 V) VTH (2.9 V) T= RL×Cf T= RL×Cf VTH (2.9 V) SD2 T= 50 C2 T= R2×C2 3.5 V RC T= 50 CC 5 μs 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. T= RR×CC 12 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Shut Down Timing Diagram S̄¯¯D̄¯1̄¯ and S̄¯¯D̄¯2̄¯ pins connected externally; current-limiter function not in use HIN(a) LIN(a) Slope defined by RC, CC (a) Each HINx or LINx pin drives a independent side of a phase, that is, the high-side and the low-side swtiching devices of a U, V, or W motor coil phase are each driven separately, by the corresponding dedicated HINx or LINx input 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 13 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Pin-out Diagram Leadform 2175 Leadform 2171 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 24 Pad Side 1 3 2 5 4 7 6 9 8 11 10 13 12 15 14 17 16 19 18 21 20 23 22 24 Pad Side Terminal List Table 28610.09, Rev. 6 Number 1 Name VB1 High side bootstrap terminal (U phase) 2 VB2 High side bootstrap terminal (V phase) 3 VB3 4 VCC1 Function High side bootstrap terminal (W phase) High side logic supply voltage 5 S̄¯¯D̄¯1̄¯ 6 COM1 7 HIN3 High side input terminal (W phase) 8 HIN2 High side input terminal (V phase) High side shutdown input and UVLO fault signal output High side logic GND terminal 9 HIN1 High side input terminal (U phase) 10 VBB Main supply voltage 11 W1 Output of W phase (connect to W2 externally) 12 V Output of V phase 13 W2 Output of W phase (connect to W1 externally) 14 LS2 Low side source terminal (connect to LS1 externally) 15 RC Overcurrent protection hold time adjustment input terminal 16 LS1 Low side source terminal (connect to LS2 externally) 17 ¯¯C̄¯L̄¯ Ō Output for overcurrent limiting 18 LIN3 Low side input terminal (W phase) 19 LIN2 Low side input terminal (V phase) 20 LIN1 Low side input terminal (U phase) 21 COM2 22 S̄¯¯D̄¯2̄¯ 23 VCC2 24 U Low side GND terminal Low side shutdown input and overtemperature, overcurrent, and UVLO fault signals output Low side logic supply voltage Output of U phase SANKEN ELECTRIC CO., LTD. 14 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Package Outline Drawing Leadform 2171 Dual rows, 24 alternating pins; vertical case mounting; pin #1 on pad side Exposed heatsink pad 31.3 ±0.2 31 ±0.2 24.4 ±0.2 16.4 ±0.2 4.8 ±0.2 0.6 Gate protrusion 1.7 ±0.1 Ø3.2 ±0.15 Ø3.2 ±0.15 2X Gate protrusion 2.45 ±0.2 BSC 16 ±0.2 B 12.9 ±0.2 9.9 ±0.2 Branding Area 5 ±0.5 9.5 +0.7 – 0.5 View A 2 1 4 3 6 5 8 7 10 9 12 11 14 13 16 15 18 17 20 19 22 21 4.5 REF Measured at pin tips B To case top 4.5 ±0.7 24 23 0.7 MAX A R1 REF +0.15 0.5 – 0.05 1.27 ±0.7 A 0.6 +0.15 – 0.05 Heatsink exposed this side 2X Exposed tie bar 0.7 MAX Deflection at pin bend View A Leadform: 2171 Terminal core material: Cu Terminal plating: Ni Recommended attachment: Solder dip (Sn-Ag-Cu) Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, type: SLA6868MZ or SLA6870MZ 2nd line, lot: YMDD# Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date # is the tracking letter Leadframe plating Pb-free. Device composition complies with the RoHS directive. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 15 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Package Outline Drawing Leadform 2175 Dual rows, 24 alternating pins; pins bent 90° for horizontal case mounting; pin #1 in outer row Exposed heatsink pad 31.3 ±0.1 31 ±0.2 24.4 ±0.2 16.4 ±0.2 Gate protrusion 4.8 ±0.2 0.6 1.7 ±0.1 Ø3.2 ±0.15 Ø3.2 ±0.15 2X Gate protrusion 2.45 ±0.1 BSC 16 ±0.2 B 12.9 ±0.2 9.9 ±0.1 Branding Area 3 ±0.3 BSC 2X Exposed tie bar 2.2 ±0.6 BSC 4.4 REF 0.6 +0.2 – 0.1 View A 1.27 ±0.2 A 2.2 ±0.6 BSC R1 REF 0.5 ±0.1 1 2 3 5 7 9 11 13 15 17 19 21 23 16 4 6 18 8 12 14 20 10 22 24 0.7 MAX A Measured at pin exit from case B To case top 0.7 MAX Deflection at pin bend View A Leadform: 2175 Terminal core material: Cu Terminal plating: Ni Recommended attachment: Solder dip (Sn-Ag-Cu) Dimensions in millimeters Branding codes (exact appearance at manufacturer discretion): 1st line, type: SLA6868MZ or SLA6870MZ 2nd line, lot: YMDD# Where: Y is the last digit of the year of manufacture M is the month (1 to 9, O, N, D) DD is the date # is the tracking letter Leadframe plating Pb-free. Device composition complies with the RoHS directive. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 16 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers Because reliability can be affected adversely by improper storage environments and handling methods, please observe the following cautions. Cautions for Storage • Ensure that storage conditions comply with the standard temperature (5°C to 35°C) and the standard relative humidity (around 40% to 75%); avoid storage locations that experience extreme changes in temperature or humidity. • Avoid locations where dust or harmful gases are present and avoid direct sunlight. • Reinspect for rust on leads and solderability of the products that have been stored for a long time. Cautions for Testing and Handling When tests are carried out during inspection testing and other standard test periods, protect the products from power surges from the testing device, shorts between the product pins, and wrong connections. Ensure all test parameters are within the ratings specified by Sanken for the products. Remarks About Using Silicone Grease with a Heatsink • When silicone grease is used in mounting the products on a heatsink, it shall be applied evenly and thinly. If more silicone grease than required is applied, it may produce excess stress. • Volatile-type silicone greases may crack after long periods of time, resulting in reduced heat radiation effect. Silicone greases with low consistency (hard grease) may cause cracks in the mold resin when screwing the products to a heatsink. Our recommended silicone greases for heat radiation purposes, which will not cause any adverse effect on the product life, are indicated below: Type Suppliers G746 Shin-Etsu Chemical Co., Ltd. YG6260 Momentive Performance Materials Inc. SC102 Dow Corning Toray Co., Ltd. Cautions for Mounting to a Heatsink • When the flatness around the screw hole is insufficient, such as when mounting the products to a heatsink that has an extruded (burred) screw hole, the products can be damaged, even with a lower than recommended screw torque. For mounting the products, the mounting surface flatness should be 0.05 mm or less. 28610.09, Rev. 6 • Please select suitable screws for the product shape. Do not use a flat-head machine screw because of the stress to the products. Self-tapping screws are not recommended. When using self-tapping screws, the screw may enter the hole diagonally, not vertically, depending on the conditions of hole before threading or the work situation. That may stress the products and may cause failures. • Recommended screw torque: 0.588 to 0.785 N●m (6 to 8 kgf●cm). • For tightening screws, if a tightening tool (such as a driver) hits the products, the package may crack, and internal stress fractures may occur, which shorten the lifetime of the electrical elements and can cause catastrophic failure. Tightening with an air driver makes a substantial impact. In addition, a screw torque higher than the set torque can be applied and the package may be damaged. Therefore, an electric driver is recommended. When the package is tightened at two or more places, first pre-tighten with a lower torque at all places, then tighten with the specified torque. When using a power driver, torque control is mandatory. Soldering • When soldering the products, please be sure to minimize the working time, within the following limits: 260±5°C 10±1 s (Flow, 2 times) 380±10°C 5±0.5 s (Soldering iron, 1 time) • Soldering should be at a distance of at least 1.5 mm from the body of the products. Electrostatic Discharge • When handling the products, the operator must be grounded. Grounded wrist straps worn should have at least 1 MΩ of resistance from the operator to ground to prevent shock hazard, and it should be placed near the operator. • Workbenches where the products are handled should be grounded and be provided with conductive table and floor mats. • When using measuring equipment such as a curve tracer, the equipment should be grounded. • When soldering the products, the head of soldering irons or the solder bath must be grounded in order to prevent leak voltages generated by them from being applied to the products. • The products should always be stored and transported in Sanken shipping containers or conductive containers, or be wrapped in aluminum foil. SANKEN ELECTRIC CO., LTD. 17 SLA6868MZ and SLA6870MZ High Voltage 3-Phase Motor Drivers • The contents in this document are subject to changes, for improvement and other purposes, without notice. Make sure that this is the latest revision of the document before use. • Application and operation examples described in this document are quoted for the sole purpose of reference for the use of the products herein and Sanken can assume no responsibility for any infringement of industrial property rights, intellectual property rights or any other rights of Sanken or any third party which may result from its use. • Although Sanken undertakes to enhance the quality and reliability of its products, the occurrence of failure and defect of semiconductor products at a certain rate is inevitable. Users of Sanken products are requested to take, at their own risk, preventative measures including safety design of the equipment or systems against any possible injury, death, fires or damages to the society due to device failure or malfunction. • Sanken products listed in this document are designed and intended for the use as components in general purpose electronic equipment or apparatus (home appliances, office equipment, telecommunication equipment, measuring equipment, etc.). When considering the use of Sanken products in the applications where higher reliability is required (transportation equipment and its control systems, traffic signal control systems or equipment, fire/crime alarm systems, various safety devices, etc.), and whenever long life expectancy is required even in general purpose electronic equipment or apparatus, please contact your nearest Sanken sales representative to discuss, prior to the use of the products herein. The use of Sanken products without the written consent of Sanken in the applications where extremely high reliability is required (aerospace equipment, nuclear power control systems, life support systems, etc.) is strictly prohibited. • In the case that you use Sanken products or design your products by using Sanken products, the reliability largely depends on the degree of derating to be made to the rated values. Derating may be interpreted as a case that an operation range is set by derating the load from each rated value or surge voltage or noise is considered for derating in order to assure or improve the reliability. In general, derating factors include electric stresses such as electric voltage, electric current, electric power etc., environmental stresses such as ambient temperature, humidity etc. and thermal stress caused due to self-heating of semiconductor products. For these stresses, instantaneous values, maximum values and minimum values must be taken into consideration. In addition, it should be noted that since power devices or IC's including power devices have large self-heating value, the degree of derating of junction temperature affects the reliability significantly. • When using the products specified herein by either (i) combining other products or materials therewith or (ii) physically, chemically or otherwise processing or treating the products, please duly consider all possible risks that may result from all such uses in advance and proceed therewith at your own responsibility. • Anti radioactive ray design is not considered for the products listed herein. • Sanken assumes no responsibility for any troubles, such as dropping products caused during transportation out of Sanken's distribution network. • The contents in this document must not be transcribed or copied without Sanken's written consent. 28610.09, Rev. 6 SANKEN ELECTRIC CO., LTD. 18