511CD

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 3x3, 0.65P
CASE 511CD
ISSUE O
1
SCALE 2:1
DATE 29 APR 2014
A
D
B
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
L
L1
ÎÎÎ
ÎÎÎ
ÎÎÎ
PIN ONE
REFERENCE
DETAIL A
E
ALTERNATE
CONSTRUCTIONS
0.10 C
2X
0.10 C
2X
ÎÎÎ
ÎÎ
ÏÏ
ÏÏÏ ÎÎ
EXPOSED Cu
TOP VIEW
A
DETAIL B
MOLD CMPD
DIM
A
A1
A3
b
D
D2
E
E2
e
K
L
L1
A3
A1
0.05 C
DETAIL B
ALTERNATE
CONSTRUCTIONS
0.05 C
A3
NOTE 4
A1
SIDE VIEW
DETAIL A
D2
1
C
8X
SEATING
PLANE
5
8
8X
e/2
e
L
XXXXX
XXXXX
ALYWG
G
b
0.10 C A B
BOTTOM VIEW
0.05 C
NOTE 3
RECOMMENDED
SOLDERING FOOTPRINT*
A
L
Y
W
G
= Assembly Location
= Wafer Lot
= Year
= Work Week
= Pb−Free Package
(Note: Microdot may be in either location)
*This information is generic. Please refer to device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
8X
2.31
PACKAGE
OUTLINE
GENERIC
MARKING DIAGRAM*
4
E2
K
MILLIMETERS
MIN
MAX
0.70
0.80
0.00
0.05
0.20 REF
0.25
0.35
3.00 BSC
2.05
2.25
3.00 BSC
1.10
1.30
0.65 BSC
0.20
−−−
0.30
0.50
0.00
0.15
0.63
1.36
3.30
1
0.65
PITCH
8X
0.40
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
98AON84944F
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
STATUS: ON SEMICONDUCTOR STANDARD
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
Case Outline Number:
http://onsemi.com
WDFN8, 3X3, 0.65P
DESCRIPTION:
October, 2002
− Rev. 0
PAGE 1 OFXXX
2
1
DOCUMENT NUMBER:
98AON84944F
PAGE 2 OF 2
ISSUE
O
REVISION
RELEASED FOR PRODUCTION. REQ. BY J. LIU.
DATE
29 APR 2014
ON Semiconductor and
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© Semiconductor Components Industries, LLC, 2014
April, 2014 − Rev. O
Case Outline Number:
511CD