511AQ

MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
WDFN8 2x2, 0.5P
CASE 511AQ−01
ISSUE A
DATE 18 MAR 2010
1
SCALE 4:1
D
PIN ONE
REFERENCE
2X
0.10 C
2X
A
B
DETAIL A
E
OPTIONAL
CONSTRUCTIONS
EXPOSED Cu
A3
0.05 C
MOLD CMPD
DETAIL B
A
8X
DIM
A
A1
A3
b
D
E
e
L
L1
ÉÉÉ
ÉÉÉ
TOP VIEW
DETAIL B
0.05 C
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSION b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.30mm FROM TERMINAL.
L
L1
ÍÍ
ÍÍ
ÍÍ
0.10 C
L
GENERIC
MARKING DIAGRAM*
OPTIONAL
CONSTRUCTION
A1
C
SIDE VIEW
1
SEATING
PLANE
DETAIL A
1
8
8X
4
5
e/2
e
8X
XX MG
G
XX = Specific Device Code
M = Date Code
G
= Pb−Free Device
L
b
0.10 C A
0.05 C
MILLIMETERS
MIN
MAX
0.80
0.70
0.05
0.00
0.20 REF
0.30
0.20
2.00 BSC
2.00 BSC
0.50 BSC
0.50
0.60
--0.15
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
RECOMMENDED
SOLDERING FOOTPRINT*
B
NOTE 3
7X
BOTTOM VIEW
0.78
PACKAGE
OUTLINE
2.30
0.88
8X
0.35
1
0.50
PITCH
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
DOCUMENT NUMBER:
STATUS:
98AON47612E
ON SEMICONDUCTOR STANDARD
NEW STANDARD:
© Semiconductor Components Industries, LLC, 2002
October, DESCRIPTION:
2002 − Rev. 0
WDFN8 2X2, 0.5P
http://onsemi.com
1
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
Case Outline Number:
PAGE 1 OFXXX
2
DOCUMENT NUMBER:
98AON47612E
PAGE 2 OF 2
ISSUE
REVISION
DATE
O
RELEASED FOR PRODUCTION. REQ. BY D. TRUHITTE.
19 JAN 2010
A
CORRECTED SOLDERING FOOTPRINT. REQ. BY J. LIU.
18 MAR 2010
ON Semiconductor and
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
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“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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© Semiconductor Components Industries, LLC, 2010
March, 2010 − Rev. 01A
Case Outline Number:
511AQ