HI-5042, HI-5043, HI-5047, HI-5049, HI-5051 Data Sheet June 16, 2016 FN3127.7 CMOS Analog Switches Features This family of CMOS analog switches offers low resistance switching performance for analog voltages up to the supply rails and for signal currents up to 80mA. “ON” resistance is low and stays reasonably constant over the full range of operating signal voltage and current. rON remains exceptionally constant for input voltages between +5V and -5V and currents up to 50mA. Switch impedance also changes very little over temperature, particularly between 0oC and 75oC. rON is nominally 25 for HI-5049 and HI-5051 and 50 for HI-5042 through HI-5047. • Wide Analog Signal Range . . . . . . . . . . . . . . . . . . . 15V All devices provide break-before-make switching and are TTL and CMOS compatible for maximum application versatility. Performance is further enhanced by Dielectric Isolation processing which insures latch-free operation with very low input and output leakage currents (0.8nA at 25oC). This family of switches also features very low power operation (1.5mW at 25oC). There are 7 devices in this switch series which are differentiated by type of switch action and value of rON (see Functional Description Table). The HI-504X and HI-505X series switches can directly replace IH-5040 series devices, and are functionally compatible with the DG180 and DG190 family • Low “ON” Resistance . . . . . . . . . . . . . . . . . . . . . . . . . 25 • High Current Capability . . . . . . . . . . . . . . . . . . . . . . 80mA • Break-Before-Make Switching - Turn-On Time . . . . . . . . . . . . . . . . . . . . . . . . . . . . 370ns - Turn-Off Time . . . . . . . . . . . . . . . . . . . . . . . . . . . 280ns • No Latch-Up • Input MOS Gates are Protected from Electrostatic Discharge • DTL, TTL, CMOS, PMOS Compatible • Pb-Free Available (RoHS Compliant) Applications • High Frequency Switching • Sample and Hold • Digital Filters • Operational Amplifier Gain Switching Functional Diagram S A P N D Functional Description PART NUMBER 1 TYPE rON HI-5042 SPDT 50 HI-5043 Dual SPDT 50 HI-5047 4PST 50 HI-5049 Dual DPST 25 HI-5051 Dual SPDT 25 CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 1-888-352-6832 | Intersil (and design) is a registered trademark of Intersil Americas Inc. Copyright Intersil Americas Inc. 2001, 2005. All Rights Reserved All other trademarks mentioned are the property of their respective owners. HI-5042 thru HI-5051 Ordering Information TEMP. RANGE (oC) PART NUMBER PACKAGE PKG. DWG. # HI1-5042-2 -55 to 125 16 Ld CERDIP F16.3 HI1-5043-2 -55 to 125 16 Ld CERDIP F16.3 HI1-5043-5 0 to 75 16 Ld CERDIP F16.3 HI3-5043-5 0 to 75 16 Ld PDIP E16.3 HI3-5043-5Z (See Note) 0 to 75 16 Ld PDIP* (Pb-free) F16.3 HI9P5043-5 0 to 75 16 Ld SOIC M16.15 HI9P5043-5Z (See Note) 0 to 75 16 Ld SOIC (Pb-free) M16.15 HI1-5047-5 0 to 75 16 Ld CERDIP F16.3 HI1-5049-5 0 to 75 16 Ld CERDIP F16.3 HI1-5051-2 -55 to 125 16 Ld CERDIP F16.3 HI1-5051-5 0 to 75 16 Ld CERDIP F16.3 HI3-5051-5 0 to 75 16 Ld PDIP E16.3 HI3-5051-5Z (No longer available, recommended replacement: HI9P5051-9Z (See Note) 0 to 75 16 Ld PDIP * (Pb-free) E16.3 HI9P5051-9 -40 to 85 16 Ld SOIC M16.15 HI9P5051-9Z (See Note) -40 to 85 16 Ld SOIC (Pb-free) M16.15 *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. NOTE: Intersil Pb-free products employ special Pb-free material sets; molding compounds/die attach materials and 100% matte tin plate termination finish, which are RoHS compliant and compatible with both SnPb and Pb-free soldering operations. Intersil Pb-free products are MSL classified at Pb-free peak reflow temperatures that meet or exceed the Pb-free requirements of IPC/JEDEC J STD-020. Pinouts (SWITCHES SHOWN FOR LOGIC “0” INPUT) Single Control (SWITCHES SHOWN FOR LOGIC “0” INPUT) Dual Control SPDT HI-5042 (50) 4PST HI-5047 (50) 16 S1 15 A D2 1 2 D2 3 14 V- S2 4 5 13 VR 12 VL 6 11 V+ 7 10 7 8 9 D3 8 D1 1 Pinouts DUAL SPDT HI-5043 (50), HI-5051 (25) D1 1 16 S1 D1 1 16 S1 2 16 S2 15 A 2 15 A1 2 15 A1 D1 3 14 V- D3 3 14 V- D3 3 14 V- S1 4 13 VR S3 4 13 VR S3 4 13 VR S4 5 D4 6 12 VL 11 V+ S4 5 D4 6 12 VL 11 V+ S4 5 12 VL D4 6 11 V+ 7 10 A2 7 10 A2 D2 8 9 S2 D2 8 9 S2 10 9 S3 NOTE: Unused pins may be internally connected. Ground all unused pins. 2 DUAL DPST HI-5049 (25) NOTE: Unused pins may be internally connected. Ground all unused pins. HI-5042 thru HI-5051 Switch Functions (SWITCHES SHOWN FOR LOGIC “1” INPUT) SPDT HI-5042 (50) VL 12 S1 S2 A DUAL SPDT HI-5043 (50) V+ VL 12 11 16 1 4 D1 S1 S3 3 D2 A1 A2 S2 15 S4 13 VR 12 S1 S2 S3 S4 A 10 9 5 13 14 VR 3 D1 D3 8 6 D2 D4 14 V- DUAL DPST HI-5049 (25) V+ VL 12 11 3 16 1 9 8 5 6 15 D1 S1 D2 S3 D3 D4 A1 A2 S2 S4 VR 1 15 V- 4 13 11 16 4 4PST HI-5047 (50) VL V+ 14 VL 12 11 1 4 15 3 D1 D3 S1 S3 A1 10 9 5 8 6 VR 3 V+ 16 13 V- DUAL SPDT HI-5051 (25) 14 V- D2 D4 A2 S2 S4 V+ 11 16 1 4 15 3 D1 D3 8 6 D2 10 9 5 13 VR 14 V- D4 HI-5042 thru HI-5051 Schematic Diagrams P15 VL V+ P16 R6 QP6 25A QP5 25A QP4 100A QP3 QN1 QP1 N13 25A 35A P14 R3 R4 R2 R5 QP7 VR QN2 TO VR’ 25A V+ 25A QP8 16A P13 R7 QP2 N14 V- N15 N16 to VL’ NOTE: Connect V+ to VL for minimizing power consumption when driving from CMOS circuits. TTL/CMOS REFERENCE CIRCUIT (NOTE) A1 (A2) N1 V+ N3 IN OUT P2 N2 VP1 A1 (A2) SWITCH CELL V+ P3 P5 P1 V+ P4 N1 P6 D1 R4 P8 P7 P9 P10 P11 P12 A1 A1 VR' A 200 D2 A2 A2 VL' N6 V- N7 N8 N9 P2 N4 N2 N5 N3 V- NOTE: All N-Channel bodies to V-, all P-Channel bodies to V+ except as shown. DIGITAL INPUT BUFFER AND LEVEL SHIFTER 4 N10 N11 N12 HI-5042 thru HI-5051 Absolute Maximum Ratings Thermal Information Supply Voltage (V+ to V-) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36V VR to Ground . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . V+, VDigital and Analog Input Voltage . . . . . . . . . . . . (V+) +4V to (V-) -4V Analog Current (S to D) Continuous . . . . . . . . . . . . . . . . . . . . 30mA Analog Current (S to D) Peak . . . . . . . . . . . . . . . . . . . . . . . . . 80mA Thermal Resistance (Typical, Note 1) JA (oC/W) JC (oC/W) CERDIP Package. . . . . . . . . . . . . . . . . 75 22 SOIC Package . . . . . . . . . . . . . . . . . . . 110 N/A PDIP Package* . . . . . . . . . . . . . . . . . . 90 N/A Maximum Junction Temperature Plastic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .150oC Ceramic Packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .175oC Maximum Storage Temperature . . . . . . . . . . . . . . . -65oC to 150oC Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . 300oC (SOIC - Lead Tips Only) *Pb-free PDIPs can be used for through hole wave solder processing only. They are not intended for use in Reflow solder processing applications. Operating Conditions Temperature Range HI-50XX-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -55oC to 125oC HI-50XX-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 0oC to 75oC HI-50XX-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . -40oC to 85oC CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the device at these or any other conditions above those indicated in the operational sections of this specification is not implied. NOTE: 1. JA is measured with the component mounted on an evaluation PC board in free air. Electrical Specifications Supplies = +15V, -15V; VR = 0V; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V, VL = 5V, Unless Otherwise Specified. For Test Conditions, Consult Performance Characteristics, Unused Pins are Grounded TEST CONDITIONS PARAMETER -2 -5, -9 TEMP (oC) MIN TYP MAX MIN TYP MAX UNITS 25 - 370 500 - 370 500 ns DYNAMIC CHARACTERISTICS (Note 5) Switch ON Time, tON Switch OFF Time, tOFF (Note 5) 25 - 280 500 - 280 500 ns Charge Injection, Q (Note 3) 25 - 5 20 - 5 - mV OFF Isolation (Note 4) 25 75 80 - - 80 - dB Crosstalk (Note 4) 25 -80 -88 - - -88 - dB Input Switch Capacitance, CS(OFF) 25 - 11 - - 11 - pF Output Switch Capacitance, CD(OFF) 25 - 11 - - 11 - pF Output Switch Capacitance, CD(ON) 25 - 22 - - 22 - pF Digital Input Capacitance, CA 25 - 5 - - 5 - pF Drain To Source Capacitance, CDS(OFF) 25 - 0.5 - - 0.5 - pF Input Low Threshold, VAL Full - - 0.8 - - 0.8 V Input High Threshold, VAH Full 2.4 - - 2.4 - - V Input Leakage Current (High or Low), IA Full - 0.01 1.0 - 0.01 1.0 A Full -15 - +15 -15 - +15 V 25 - 50 75 - 50 75 Full - - 150 - - 150 DIGITAL INPUT CHARACTERISTICS ANALOG SWITCH CHARACTERISTICS Analog Signal Range ON Resistance, rON HI-5042 to HI-5047 (Note 2) 25 - 25 45 - 25 45 Full - - 50 - - 50 HI-5042 to HI-5047 25 - 2 10 - 2 10 HI-5049, HI-5051 25 - 1 5 - 1 5 HI-5049, HI-5051 (Note 2) Channel-to-Channel Match, rON 5 HI-5042 thru HI-5051 Electrical Specifications Supplies = +15V, -15V; VR = 0V; VAH (Logic Level High) = 2.4V, VAL (Logic Level Low) = 0.8V, VL = 5V, Unless Otherwise Specified. For Test Conditions, Consult Performance Characteristics, Unused Pins are Grounded (Continued) TEST CONDITIONS PARAMETER -2 TEMP (oC) MIN TYP -5, -9 MAX MIN TYP MAX UNITS OFF Input or Output Leakage Current, IS(OFF) = ID(OFF) 25 - 0.8 2 - 0.8 2 nA Full - 100 200 - 100 200 nA ON Leakage Current, ID(ON) 25 - 0.01 2 - 0.01 2 nA Full - 2 200 - 2 200 nA Quiescent Power Dissipation, PD 25 - 1.5 - - 1.5 - mW I+, I-, IL , IR 25 - - 0.2 - - 0.3 mA POWER REQUIREMENTS I+, +15V Quiescent Current (Note 5) Full - - 0.3 - - 0.5 mA I-, -15V Quiescent Current (Note 5) Full - - 0.3 - - 0.5 mA IL , +5V Quiescent Current (Note 5) Full - - 0.3 - - 0.5 mA IR , Ground Quiescent Current (Note 5) Full - - 0.3 - - 0.5 mA NOTES: 2. VOUT = 10V, IOUT = 3. VIN = 0V, CL = 10nF. 1mA. 4. RL = 100, f = 100kHz, VIN = 2.0VP-P , CL = 5pF. 5. VAL = 0V, VAH = 5V. TA = 25oC, V+ = +15V, V- = -15V, VL = +5V, VR = 0V, VAH = 3V and VAL = 0.8V Unless Otherwise Specified Test Circuits and Waveforms 1mA rON = V2 V2 1mA IN OUT VIN FIGURE 1A. TEST CIRCUIT NORMALIZED ON RESISTANCE (REFERRED TO 25oC) ON RESISTANCE () 80 60 V+ = +12V V- = -12V V+ = +10V V- = -10V 40 20 0 -15 V+ = +15V V- = -15V 1.2 1.1 1.0 0.9 0.8 0.7 0.6 -10 0 -5 5 10 15 -25 0 25 50 75 100 125 FIGURE 1C. NORMALIZED ON RESISTANCE vs TEMPERATURE FIGURE 1. ON RESISTANCE 6 -50 TEMPERATURE (oC) ANALOG SIGNAL LEVEL (V) FIGURE 1B. ON RESISTANCE vs ANALOG SIGNAL LEVEL VIN = 0V HI-5042 thru HI-5051 Test Circuits and Waveforms TA = 25oC, V+ = +15V, V- = -15V, VL = +5V, VR = 0V, VAH = 3V and VAL = 0.8V Unless Otherwise Specified (Continued) OFF LEAKAGE CURRENT 100nA A IS(OFF) = ID(OFF) 10nA ID(OFF) IN OUT A 10V LEAKAGE CURRENT IS(OFF) 10V ON LEAKAGE CURRENT 1nA IN OUT ID(ON) 100pA A ID(ON) 10V 10pA 25 50 75 100 125 TEMPERATURE (oC) FIGURE 2A. LEAKAGE CURRENTS vs TEMPERATURE FIGURE 2B. TEST CIRCUITS FIGURE 2. LEAKAGE CURRENTS NORMALIZED ON RESISTANCE (REFERRED TO 1mA) 1.4 1.3 1.2 IN VIN 1.1 OUT I V IN r ON = --------I 1.0 0 20 40 60 80 ANALOG CURRENT (mA) FIGURE 3A. NORMALIZED ON RESISTANCE vs ANALOG CURRENT FIGURE 3B. TEST CIRCUIT FIGURE 3. NORMALIZED ON RESISTANCE OFF ISOLATION (dB) 200 IN 160 VIN 2VP-P RL = 100 120 80 1 10 100 1K 10K 50 V IN OFF ISOLATION = 20 Log ---------------- V OUT RL = 10k 40 OUT 100K 1M FREQUENCY (Hz) FIGURE 4A. OFF ISOLATION vs FREQUENCY FIGURE 4C. OFF ISOLATION 7 FIGURE 4B. TEST CIRCUIT RL VOUT HI-5042 thru HI-5051 TA = 25oC, V+ = +15V, V- = -15V, VL = +5V, VR = 0V, VAH = 3V and VAL = 0.8V Unless Otherwise Specified (Continued) Test Circuits and Waveforms CROSSTALK (dB) -200 SWITCHED CHANNEL -160 VIN -120 50 2VP-P RL = 100 VOUT RL -80 RL = 1k RL = 10k -40 0 RL 1 10 100 1K 10K 100K V OUT CROSSTALK = 20 Log ---------------- V IN 1M FREQUENCY (Hz) FIGURE 5A. CROSSTALK vs FREQUENCY FIGURE 5B. TEST CIRCUIT FIGURE 5. CROSSTALK POWER CONSUMPTION (mW) 200 160 +10V -10V 120 TOGGLE AT 50% DUTY 80 A VL VR V+ IL I+ VI- 40 +5V 0 1K 10K 100K +15V -15V 1M TOGGLE FREQUENCY (50% DUTY CYCLE) (Hz) FIGURE 6A. POWER CONSUMPTION vs FREQUENCY FIGURE 6B. TEST CIRCUIT FIGURE 6. POWER CONSUMPTION VAH VA IN1 OUT 1 90% 90% +10V OUT 2 IN2 1K OUT 1 tON tOFF 90% 1K 90% VA tOFF FIGURE 7A. TEST CIRCUIT 8 tON FIGURE 7B. MEASUREMENT POINTS OUT 2 HI-5042 thru HI-5051 Test Circuits and Waveforms TA = 25oC, V+ = +15V, V- = -15V, VL = +5V, VR = 0V, VAH = 3V and VAL = 0.8V Unless Otherwise Specified (Continued) VA VA OUTPUT OUTPUT VA = 0V to 10V Vertical: 5V/Div. Horizontal: 200ns/Div. FIGURE 7D. WAVEFORMS WITH CMOS COMPATIBLE LOGIC INPUT 720 660 660 600 600 540 540 INPUT) 720 480 420 tON 360 300 (NEED (NEED INPUT) VA = 0V to 5V Vertical: 2V/Div. Horizontal: 200ns/Div. FIGURE 7C. WAVEFORMS WITH TTL COMPATIBLE LOGIC INPUT tOFF 240 480 420 360 240 180 180 120 120 60 2.4 tON 300 tOFF 60 3.0 3.6 4.2 4.8 0 DIGITAL “HIGH” (V) 1.0 1.5 DIGITAL “LOW” (V) FIGURE 7E. SWITCHING TIMES vs POSITIVE DIGITAL VOLTAGE FIGURE 7F. SWITCHING TIMES vs NEGATIVE DIGITAL VOLTAGE FIGURE 7. SWITCH tON AND tOFF 9 0.5 HI-5042 thru HI-5051 Revision History The revision history provided is for informational purposes only and is believed to be accurate, but not warranted. Please go to the web to make sure that you have the latest revision. DATE REVISION June 16, 2016 FN3127.7 CHANGE Updated Ordering Information table on page 2. Added Revision History and About Intersil sections. Updated POD M16.15 to the latest revision changes are as follows: Remove "u" symbol from drawing (overlaps the "a" on Side View). Multiple changes were made to table. About Intersil Intersil Corporation is a leading provider of innovative power management and precision analog solutions. The company's products address some of the largest markets within the industrial and infrastructure, mobile computing and high-end consumer markets. For the most updated datasheet, application notes, related documentation and related parts, please see the respective product information page found at www.intersil.com. You may report errors or suggestions for improving this datasheet by visiting www.intersil.com/ask. Reliability reports are also available from our website at www.intersil.com/support. 10 HI-5042 thru HI-5051 Dual-In-Line Plastic Packages (PDIP) E16.3 (JEDEC MS-001-BB ISSUE D) N 16 LEAD DUAL-IN-LINE PLASTIC PACKAGE E1 INDEX AREA 1 2 3 INCHES N/2 -B- -AE D BASE PLANE -C- SEATING PLANE A2 A L D1 e B1 D1 A1 eC B 0.010 (0.25) M C A B S MILLIMETERS SYMBOL MIN MAX MIN MAX NOTES A - 0.210 - 5.33 4 A1 0.015 - 0.39 - 4 A2 0.115 0.195 2.93 4.95 - B 0.014 0.022 0.356 0.558 - C L B1 0.045 0.070 1.15 1.77 8, 10 eA C 0.008 0.014 C D 0.735 0.775 eB NOTES: 1. Controlling Dimensions: INCH. In case of conflict between English and Metric dimensions, the inch dimensions control. 0.005 - 0.13 - 5 0.300 0.325 7.62 8.25 6 E1 0.240 0.280 6.10 7.11 5 e 0.100 BSC eA 0.300 BSC eB - 4. Dimensions A, A1 and L are measured with the package seated in JEDEC seating plane gauge GS-3. L 0.115 N 8. B1 maximum dimensions do not include dambar protrusions. Dambar protrusions shall not exceed 0.010 inch (0.25mm). 9. N is the maximum number of terminal positions. 10. Corner leads (1, N, N/2 and N/2 + 1) for E8.3, E16.3, E18.3, E28.3, E42.6 will have a B1 dimension of 0.030 - 0.045 inch (0.76 - 1.14mm). 11 5 E 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 7. eB and eC are measured at the lead tips with the leads unconstrained. eC must be zero or greater. 0.355 19.68 D1 3. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication No. 95. 5. D, D1, and E1 dimensions do not include mold flash or protrusions. Mold flash or protrusions shall not exceed 0.010 inch (0.25mm). 6. E and eA are measured with the leads constrained to be perpendicular to datum -C- . 0.204 18.66 16 2.54 BSC 7.62 BSC 0.430 - 0.150 2.93 16 6 10.92 7 3.81 4 9 Rev. 0 12/93 HI-5042 thru HI-5051 Small Outline Plastic Packages (SOIC) M16.15 (JEDEC MS-012-AC ISSUE C) N INDEX AREA H 0.25(0.010) M 16 LEAD NARROW BODY SMALL OUTLINE PLASTIC PACKAGE B M INCHES E -B- 1 2 3 L SEATING PLANE -A- A D h x 45° -C- e A1 B 0.25(0.010) M C 0.10(0.004) C A M SYMBOL MIN MAX MIN MAX NOTES A 0.0532 0.0688 1.35 1.75 - A1 0.0040 0.0098 0.10 0.25 - B 0.013 0.020 0.33 0.51 9 C 0.0075 0.0098 0.19 0.25 - D 0.3859 0.3937 9.80 10.00 3 E 0.1497 0.1574 3.80 4.00 4 e B S 1. Symbols are defined in the “MO Series Symbol List” in Section 2.2 of Publication Number 95. 2. Dimensioning and tolerancing per ANSI Y14.5M-1982. 3. Dimension “D” does not include mold flash, protrusions or gate burrs. Mold flash, protrusion and gate burrs shall not exceed 0.15mm (0.006 inch) per side. 4. Dimension “E” does not include interlead flash or protrusions. Interlead flash and protrusions shall not exceed 0.25mm (0.010 inch) per side. 5. The chamfer on the body is optional. If it is not present, a visual index feature must be located within the crosshatched area. 6. “L” is the length of terminal for soldering to a substrate. 7. “N” is the number of terminal positions. 8. Terminal numbers are shown for reference only. 9. The lead width “B”, as measured 0.36mm (0.014 inch) or greater above the seating plane, shall not exceed a maximum value of 0.61mm (0.024 inch). 10. Controlling dimension: MILLIMETER. Converted inch dimensions are not necessarily exact. 12 0.050 BSC 1.27 BSC - H 0.2284 0.2440 5.80 6.20 - h 0.0099 0.0196 0.25 0.50 5 L 0.016 0.050 0.40 1.27 6 N NOTES: MILLIMETERS 16 0° 16 8° 0° 7 8° Rev. 1 6/05 HI-5042 thru HI-5051 Ceramic Dual-In-Line Frit Seal Packages (CERDIP) F16.3 MIL-STD-1835 GDIP1-T16 (D-2, CONFIGURATION A) 16 LEAD CERAMIC DUAL-IN-LINE FRIT SEAL PACKAGE LEAD FINISH c1 -D- -A- BASE METAL (c) E M -Bbbb S C A-B S Q -C- SEATING PLANE S1 b2 ccc M C A-B S eA/2 - 0.200 - 5.08 - 0.026 0.36 0.66 2 b1 0.014 0.023 0.36 0.58 3 b2 0.045 0.065 1.14 1.65 - b3 0.023 0.045 0.58 1.14 4 c 0.008 0.018 0.20 0.46 2 c1 0.008 0.015 0.20 0.38 3 D - 0.840 - 21.34 5 E 0.220 0.310 5.59 7.87 5 c aaa M C A - B S D S D S NOTES 0.014 eA e b MAX b A A MIN A A L MILLIMETERS MAX M (b) D BASE PLANE MIN b1 SECTION A-A D S INCHES SYMBOL NOTES: 1. Index area: A notch or a pin one identification mark shall be located adjacent to pin one and shall be located within the shaded area shown. The manufacturer’s identification shall not be used as a pin one identification mark. e 0.100 BSC 2.54 BSC - eA 0.300 BSC 7.62 BSC - eA/2 0.150 BSC 3.81 BSC - L 0.125 0.200 3.18 5.08 - Q 0.015 0.060 0.38 1.52 6 S1 0.005 - 0.13 - 7 105o 90o 105o - 2. The maximum limits of lead dimensions b and c or M shall be measured at the centroid of the finished lead surfaces, when solder dip or tin plate lead finish is applied. 90o aaa - 0.015 - 0.38 - 3. Dimensions b1 and c1 apply to lead base metal only. Dimension M applies to lead plating and finish thickness. bbb - 0.030 - 0.76 - ccc - 0.010 - 0.25 - M - 0.0015 - 0.038 2, 3 4. Corner leads (1, N, N/2, and N/2+1) may be configured with a partial lead paddle. For this configuration dimension b3 replaces dimension b2. N 16 16 5. This dimension allows for off-center lid, meniscus, and glass overrun. 8 Rev. 0 4/94 6. Dimension Q shall be measured from the seating plane to the base plane. 7. Measure dimension S1 at all four corners. 8. N is the maximum number of terminal positions. 9. Dimensioning and tolerancing per ANSI Y14.5M - 1982. 10. Controlling dimension: INCH. All Intersil U.S. products are manufactured, assembled and tested utilizing ISO9001 quality systems. Intersil Corporation’s quality certifications can be viewed at www.intersil.com/design/quality Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design, software and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see www.intersil.com 13