ACTS244MS Radiation Hardened Octal Non-Inverting Three-State Buffer January 1996 tle TS MS - Features Pinouts • Devices QML Qualified in Accordance with MIL-PRF-38535 20 PIN CERAMIC DUAL-IN-LINE MIL-STD-1835 DESIGNATOR CDIP2-T20, LEAD FINISH C TOP VIEW • Detailed Electrical and Screening Requirements are Contained in SMD# 5962-96718 and Intersil’s QM Plan • 1.25 Micron Radiation Hardened SOS CMOS iadl rt- • Total Dose . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . >300K RAD (Si) • Single Event Upset (SEU) Immunity: <1 x (Typ) 10-10 Errors/Bit/Day • SEU LET Threshold . . . . . . . . . . . . . . . . . . . . . . . >100 MEV-cm2/mg • Dose Rate Upset . . . . . . . . . . . . . . . . >1011 RAD (Si)/s, 20ns Pulse • Dose Rate Survivability . . . . . . . . . . . >1012 RAD (Si)/s, 20ns Pulse • Latch-Up Free Under Any Conditions ee er) • Military Temperature Range . . . . . . . . . . . . . . . . . . -55oC to +125oC hor • Input Logic Levels - VIL = 0.8V Max - VIH = VCC/2 Min ds rpon, ior, iad, 1 20 VCC 2 19 BE BO4 3 18 AO1 AI2 4 17 BI4 BO3 5 16 AO2 AI3 6 15 BI3 BO2 7 14 AO3 AI4 8 13 BI2 BO1 9 12 AO4 GND 10 11 BI1 • Significant Power Reduction Compared to ALSTTL Logic • DC Operating Voltage Range . . . . . . . . . . . . . . . . . . . . 4.5V to 5.5V 20 PIN CERAMIC FLATPACK MIL-STD-1835 DESIGNATOR CDFP4-F20, LEAD FINISH C TOP VIEW • Input Current ≤ 1µA at VOL, VOH • Fast Propagation Delay . . . . . . . . . . . . . . . 14.5ns (Max), 10ns (Typ) Description The Intersil ACTS244MS is a Radiation Hardened Octal Non-Inverting Three-State Buffer having two active low enable inputs. The ACTS244MS utilizes advanced CMOS/SOS technology to achieve high-speed operation. This device is a member of radiation hardened, high-speed, CMOS/SOS Logic Family. AE 1 20 VCC AI1 2 19 BE BO4 3 18 AO1 AI2 4 17 BI4 BO3 5 16 AO2 AI3 6 15 BI3 BO2 7 14 AO3 AI4 8 13 BI2 BO1 9 12 AO4 GND 10 11 BI1 The ACTS244MS is supplied in a 20 lead Ceramic Flatpack (K suffix) or a Dual-In-Line Ceramic Package (D suffix). Ordering Information PART NUMBER d, L, AE AI1 TEMPERATURE RANGE SCREENING LEVEL PACKAGE 5962F9671801VRC -55oC to +125oC MIL-PRF-38535 Class V 20 Lead SBDIP 5962F9671801VXC -55oC to +125oC MIL-PRF-38535 Class V 20 Lead Ceramic Flatpack ACTS244D/Sample 25oC Sample 20 Lead SBDIP ACTS244K/Sample 25oC Sample 20 Lead Ceramic Flatpack ACTS244HMSR 25oC Die Die CAUTION: These devices are sensitive to electrostatic discharge; follow proper IC Handling Procedures. 1-888-INTERSIL or 321-724-7143 | Copyright © Intersil Corporation 1999 1 Spec Number File Number 518784 3187.1 ACTS244MS Functional Diagram NOTE: (1 CIRCUIT OF 2) AE 1(19) P AO1 N 18(9) AI1 2(11) P AO2 N 16(7) AI2 4(13) P AO3 N 14(5) AI3 6(15) P AO4 N 12(3) AI4 8(17) TRUTH TABLE INPUTS OUTPUT AE, BE AIn, BIn AOn, BOn L L L L H H H X Z NOTE: H = High Voltage Level, L = Low Voltage Level, X = Immaterial, Z = High Impedance Spec Number 2 518784 ACTS244MS Die Characteristics DIE DIMENSIONS: 100 x 100 (mils) 2.54 x 2.54 (mm) METALLIZATION: Type: AlSi Metal 1 Thickness: 7.125kÅ ±1.125kÅ Metal 2 Thickness: 9kÅ ±1kÅ GLASSIVATION: Type: SiO2 Thickness: 8kÅ ±1kÅ WORST CASE CURRENT DENSITY: < 2.0 x 105A/cm2 BOND PAD SIZE: 110 x 110 (µm) 4.4 x 4.4 (mils) Metallization Mask Layout ACTS244MS AI1 (2) AE (1) VCC (20) VCC (20) BE (19) (18) AO1 BO4 (3) (17) BI4 AI2 (4) (16) AO2 BO3 (5) (15) BI3 AI3 (6) (14) AO3 BO2 (7) (13) BI2 AI4 (8) BO1 (9) AO4 (12) (10) (10) GND GND (11) BI1 All Intersil semiconductor products are manufactured, assembled and tested under ISO9000 quality systems certification. Intersil products are sold by description only. Intersil Corporation reserves the right to make changes in circuit design and/or specifications at any time without notice. Accordingly, the reader is cautioned to verify that data sheets are current before placing orders. Information furnished by Intersil is believed to be accurate and reliable. However, no responsibility is assumed by Intersil or its subsidiaries for its use; nor for any infringements of patents or other rights of third parties which may result from its use. No license is granted by implication or otherwise under any patent or patent rights of Intersil or its subsidiaries. For information regarding Intersil Corporation and its products, see web site http://www.intersil.com Spec Number 3 518784