NOTICE OF REVISION (NOR) THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. 1. DATE (YYMMDD) 99-06-01 Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washingtion Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503. PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. 4. ORIGINATOR a. TYPED NAME (First, Middle Initial, Last) b. ADDRESS (Street, City, State, Zip Code) Defense Supply Center Columbus 3990 East Broad Street Columbus, OH 43216-5000 9. TITLE OF DOCUMENT MICROCIRCUIT, DIGITAL, 16-BIT MICROCONTROLLER, RADIATION HARDENED, MONOLITHIC SILICON 2. PROCURING ACTIVITY NO. 3. DODAAC 5. CAGE CODE 67268 6. NOR NO. 5962-R066-99 7. CAGE CODE 67268 8. DOCUMENT NO. 5962-95635 11. ECP NO. 10. REVISION LETTER a. CURRENT C Form Approved OMB No. 0704-0188 N/A b. NEW D 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES All 13. DESCRIPTION OF REVISION Sheet 1: Revisions ltr column; add “D”. Revisions description column; add “Changes in accordance with NOR 5962-R066-99”. Revisions date column; add “99-06-01”. Revision level block; change from “C” to “D”. Rev status of sheets; for sheet 1, change from “C” to “D”. For sheets 4 and 28 through 33, add “D”. Sheets 4: Add new paragraph as follows: “3.1.1 Microcircuit die. For the requirements for microcircuit die, see appendix A to this document.” Revision level block; add “D”. Sheets 28 through 33: Add attached appendix A. Continued on next sheets. 14. THIS SECTION FOR GOVERNMENT USE ONLY a. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DSCC-VAC d. TITLE Chief, Custom Microelectronics Team 15a. ACTIVITY ACCOMPLISHING REVISION DSCC-VAC DD Form 1695, APR 92 c. TYPED NAME (First, Middle Initial, Last) Monica L. Poelking e. SIGNATURE Monica L. Poelking b. REVISION COMPLETED (Signature) Thanh V. Nguyen Previous editions are obsolete. f. DATE SIGNED (YYMMDD) 99-06-01 c. DATE SIGNED (YYMMDD) 99-06-01 Document No: 5962-95635 Revision: D NOR No: 5962-R066-99 Sheet: 2 of 7 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95635 10. SCOPE 10.1 Scope. This appendix establishes minimum requirements for microcircuit die to be supplied under the Qualified Manufacturers List (QML) Program. QML microcircuit die meeting the requirements of MIL-PRF-38535 and the manufacturers approved QM plan for use in monolithic microcircuits, multichip modules (MCMs), hybrids, electronic modules, or devices using chip and wire designs in accordance with MIL-PRF-38534 are specified herein. Two product assurance classes consisting of military high reliability (device class Q) and space application (device Class V) are reflected in the Part or Identification Number (PIN). When available a choice of Radiation Hardiness Assurance (RHA) levels are reflected in the PIN. 10.2 PIN. The PIN shall be as shown in the following example: 5962 F Federal Stock class designator RHA designator (see 10.2.1) 95653 01 V 9 A Device type (see 10.2.2) Device class designator (see 10.2.3) Die code Die Det ails (see 10.2.4) Drawing Number 10.2.1 RHA designator. Device classes Q and V RHA identified die shall meet the MIL-PRF-38535 specified RHA levels. A dash (-) indicates a non-RHA die. 10.2.2 Device type(s). The device type(s) shall identify the circuit function as follows: Device type Generic number Circuit function 01 HS-RTX2010RH 16-bit microcontroller radiation hardened, SOS 10.2.3 Device class designator. Device class Q or V Device requirements documentation Certification and qualification to the die requirements of MIL-PRF-38535. 10.2.4 Die Details. The die details designation shall be a unique letter which designates the die’s physical dimensions, bonding pad location(s) and related electrical function(s), interface materials, and other assembly related information, for each product and variant supplied to this appendix. 10.2.4.1 Die Physical dimensions. Die Types Figure number 01 A-1 STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-95635 A REVISION LEVEL D SHEET 28 Document No: 5962-95635 Revision: D NOR No: 5962-R066-99 Sheet: 3 of 7 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95635 10.2.4.2 Die Bonding pad locations and Electrical functions. Die Types Figure number 01 A-1 10.2.4.3 Interface Materials. Die Types Figure number 01 A-1 10.2.4.4 Assembly related information. Die Types Figure number 01 A-1 10.3 Absolute maximum ratings. See paragraph 1.3 within the body of this drawing for details. 10.4 Recommended operating conditions. See paragraph 1.4 within the body of this drawing for details. 20. APPLICABLE DOCUMENTS 20.1 Government specifications, standards, bulletin, and handbooks. Unless otherwise specified, the following specifications, standards, bulletin, and handbook of the issue listed in that issue of the Department of Defense Index of Specifications and Standards specified in the solicitation, form a part of this drawing to the extent specified herein. SPECIFICATION DEPARTMENT OF DEFENSE MIL-PRF-38535 - Integrated Circuits, Manufacturing, General Specification for. STANDARDS DEPARTMENT OF DEFENSE MIL-STD-883 - Test Method Standard Microcircuits. HANDBOOK DEPARTMENT OF DEFENSE MIL-HDBK-103 – List of Standard Microcircuit Drawings (SMD’s). (Copies of the specification, standards, bulletin, and handbook required by manufacturers in connection with specific acquisition functions should be obtained from the contracting activity or as directed by the contracting activity). 20.2 Order of precedence. In the event of a conflict between the text of this drawing and the references cited herein, the text of this drawing shall take precedence. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-95635 A REVISION LEVEL D SHEET 29 Document No: 5962-95635 Revision: D NOR No: 5962-R066-99 Sheet: 4 of 7 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95635 30. REQUIREMENTS 30.1 Item Requirements. The individual item requirements for device classes Q and V shall be in accordance with MIL-PRF-38535 and as specified herein or as modified in the device manufacturer’s Quality Management (QM) plan. The modification in the QM plan shall not affect the form, fit or function as described herein. 30.2 Design, construction and physical dimensions. The design, construction and physical dimensions shall be as specified in MIL-PRF-38535 and the manufacturer’s QM plan, for device classes Q and V and herein. 30.2.1 Die Physical dimensions. The die physical dimensions shall be as specified in 10.2.4.1 and on figure A-1. 30.2.2 Die bonding pad locations and electrical functions. The die bonding pad locations and electrical functions shall be as specified in 10.2.4.2 and on figure A-1. 30.2.3 Interface materials. The interface materials for the die shall be as specified in 10.2.4.3 and on figure A-1. 30.2.4 Assembly related information. The assembly related information shall be as specified in 10.2.4.4 and figure A-1. 30.2.5 Radiation exposure circuit. The radiation exposure circuit shall be as defined within paragraph 3.2.4 of the body of this document. 30.3 Electrical performance characteristics and post- irradiation parameter limits. Unless otherwise specified herein, the electrical performance characteristics and post-irradiation parameter limits are as specified in table I of the body of this document. 30.4 Electrical test requirements. The wafer probe test requirements shall include functional and parametric testing sufficient to make the packaged die capable of meeting the electrical performance requirements in table I. 30.5 Marking. As a minimum, each unique lot of die, loaded in single or multiple stack of carriers, for shipment to a customer, shall be identified with the wafer lot number, the certification mark, the manufacturer’s identification and the PIN listed in 10.2 herein. The certification mark shall be a “QML” or “Q” as required by MIL-PRF-38535. 30.6 Certification of compliance. For device classes Q and V, a certificate of compliance shall be required from a QML-38535 listed manufacturer in order to supply to the requirements of this drawing (see 60.4 herein). The certificate of compliance submitted to DSCC-VA prior to listing as an approved source of supply for this appendix shall affirm that the manufacturer’s product meets, for device classes Q and V, the requirements of MIL-PRF-38535 and the requirements herein. 30.7 Certificate of conformance. A certificate of conformance as required for device classes Q and V in MIL-PRF-38535 shall be provided with each lot of microcircuit die delivered to this drawing. 40. QUALITY ASSURANCE PROVISIONS 40.1 Sampling and inspection. For device classes Q and V, die sampling and inspection procedures shall be in accordance with MIL-PRF-38535 or as modified in the device manufacturer’s Quality Management (QM) plan. The modifications in the QM plan shall not affect the form, fit or function as described herein. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-95635 A REVISION LEVEL D SHEET 30 Document No: 5962-95635 Revision: D NOR No: 5962-R066-99 Sheet: 5 of 7 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95635 40.2 Screening. For device classes Q and V, screening shall be in accordance with MIL-PRF-38535, and as defined in the manufacturer’s QM plan. As a minimum it shall consist of: a) Wafer Lot acceptance for Class V product using the criteria defined within MIL-STD-883 TM 5007. b) 100% wafer probe (see paragraph 30.4). c) 100% internal visual inspection to the applicable class Q or V criteria defined within MIL-STD-883 TM2010 or the alternate procedures allowed within MIL-STD-883 TM5004. 40.3 Conformance inspection. 40.3.1 Group E inspection. Group E inspection is required only for parts intended to be identified as radiation assured (see 30.5 herein). RHA levels for device classes Q and V shall be as specified in MIL-PRF-38535. End point electrical testing of packaged die shall be as specified in table IIA herein. Group E tests and conditions are as specified within paragraphs 4.4.4.1, 4.4.4.1.1, and 4.4.4.2. 50. DIE CARRIER 50.1 Die carrier requirements. The requirements for the die carrier shall be in accordance with the manufacturer’s QM plan or as specified in the purchase order by the acquiring activity. The die carrier shall provide adequate physical, mechanical and electrostatic protection. 60. NOTES 60.1 Intended use. Microcircuit die conforming to this drawing are intended for use in microcircuits built in accordance with MIL-PRF-38535 or MIL-PRF-38534 for government microcircuit applications (original equipment), design applications and logistics purposes. 60.2 Comments. Comments on this appendix should be directed to DSCC-VA, Columbus, Ohio, 43216-5000 or telephone (614)-692-0674. 60.3 Abbreviations, symbols and definitions. The abbreviations, symbols, and definitions used herein are defined with MIL-PRF-38535 and MIL-STD-1331. 60.4 Sources of Supply for device classes Q and V. Sources of supply for device classes Q and V are listed in QML-38535. The vendors listed within QML-38535 have submitted a certificate of compliance (see 30.6 herein) to DSCC-VA and have agreed to this drawing. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-95635 A REVISION LEVEL D SHEET 31 Document No: 5962-95635 Revision: D NOR No: 5962-R066-99 Sheet: 6 of 7 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95635 FIGURE A-1 o DIE PHYSICAL DIMENSIONS Die Size: Die Thickness: 9240 x 9530 microns. 21 2 mils. o DIE BONDING PAD LOCATIONS AND ELECTRICAL FUNCTIONS The following metallization diagram supplies the locations and electrical functions of the bonding pads. The internal metallization layout and alphanumeric information contained within this diagram may or may not represent the actual circuit defined by this SMD. NOTE: Pad numbers reflect terminal numbers when placed in case outline Y (see figure 1). STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-95635 A REVISION LEVEL D SHEET 32 Document No: 5962-95635 Revision: D NOR No: 5962-R066-99 Sheet: 7 of 7 APPENDIX A APPENDIX A FORMS A PART OF SMD 5962-95635 o INTERFACE MATERIALS 7.0kA 1kA 10.0kA 1kA Metal 1: Metal 2 (Top): AlSi AlSi Backside Metallization None Glassivation Type: Thickness PSG 13kA 1.5kA Substrate: Silicon on Sapphire (SOS) o ASSEMBLY RELATED INFORMATION Substrate Potential: Insulator. STANDARD MICROCIRCUIT DRAWING DEFENSE SUPPLY CENTER COLUMBUS COLUMBUS, OHIO 43216-5000 DSCC FORM 2234 APR 97 SIZE 5962-95635 A REVISION LEVEL D SHEET 33 STANDARD MICROCIRCUIT DRAWING BULLETIN DATE: 99-06-01 Approved sources of supply for SMD 5962-95635 are listed below for immediate acquisition information only and shall be added to MIL-HDBK-103 and QML-38535 during the next revision. MIL-HDBK-103 and QML-38535 will be revised to include the addition or deletion of sources. The vendors listed below have agreed to this drawing and a certificate of compliance has been submitted to and accepted by DSCC-VA. This bulletin is superseded by the next dated revision of MIL-HDBK-103 and QML-38535. Standard microcircuit drawing PIN Vendor CAGE number Vendor similar PIN 1/ 5962F9563501V9A 34371 HS0-RTX2010RH-Q 1/ Caution. Do not use this number for item acquisition. Items acquired to this number may not satisfy the performance requirements of this drawing. Vendor CAGE number 34371 Vendor name and address Harris Semiconductor P.O. Box 883 Melbourne, FL 32902-0883 The information contained herein is disseminated for convenience only and the Government assumes no liability whatsoever for any inaccuracies in the information bulletin. NOTICE OF REVISION (NOR) THIS REVISION DESCRIBED BELOW HAS BEEN AUTHORIZED FOR THE DOCUMENT LISTED. 1. DATE (YYMMDD) 98-11-10 Public reporting burden for this collection is estimated to average 2 hours per response, including the time for reviewing instructions, searching existing data sources, gathering and maintaining the data needed, and completing and reviewing the collection of information. Send comments regarding this burden estimate or any other aspect of this collection of information, including suggestions for reducing this burden, to Department of Defense, Washingtion Headquarters Services, Directorate for Information Operations and Reports, 1215 Jefferson Davis Highway, Suite 1204, Arlington, VA 22202-4302, and to the Office of Management and Budget, Paperwork Reduction Project (0704-0188), Washington, DC 20503. PLEASE DO NOT RETURN YOUR COMPLETED FORM TO EITHER OF THESE ADDRESSED. RETURN COMPLETED FORM TO THE GOVERNMENT ISSUING CONTRACTING OFFICER FOR THE CONTRACT/ PROCURING ACTIVITY NUMBER LISTED IN ITEM 2 OF THIS FORM. 4. ORIGINATOR a. TYPED NAME (First, Middle Initial, Last) b. ADDRESS (Street, City, State, Zip Code) Defense Supply Center Columbus 3990 East Broad Street Columbus, OH 43216-5000 9. TITLE OF DOCUMENT MICROCIRCUIT, DIGITAL, 16-BIT MICROCONTROLLER, RADIATION HARDENED, MONOLITHIC SILICON 2. PROCURING ACTIVITY NO. 3. DODAAC 5. CAGE CODE 67268 6. NOR NO. 5962-R014-99 7. CAGE CODE 67268 8. DOCUMENT NO. 5962-95635 11. ECP NO. 10. REVISION LETTER a. CURRENT B Form Approved OMB No. 0704-0188 N/A b. NEW C 12. CONFIGURATION ITEM (OR SYSTEM) TO WHICH ECP APPLIES All 13. DESCRIPTION OF REVISION Sheet 1: Revisions ltr column; add "C". Revisions description column; add "Changes in accordance with NOR 5962-R014-99". Revisions date column; add "98-11-10". Revision level block; change from “B” to "C". Rev status of sheets; for sheets 1 and 5, change from “B” to “C”. For sheet 21, add "C". Sheet 5: Table I, Low output voltage, VOL, conditions column; change IOL from “4.0 V” to “4.0 mA” Table I, Input leakage current, II, pre-irradiation limits; change from “-1.0 µA Min.” to “-5.0 µA Min.” and from “1.0 µA Max.” to “5.0 µA Max.” for subgroups 1 and 3. Change from “-5.0 µA Min.” to “-10.0 µA Min.” and from “5.0 µA Max.” to “10.0 µA Max.” for subgroup 2. Post-irradiation limits; change from “-5.0 µA Min.” to “-10.0 µA Min.” and from “5.0 µA Max.” to “10.0 µA Max.” for subgroup 1. Table I, Standby power suppy current, ICCSB, pre-irradiation limits; change from “500 µA Max.” to “3.0 mA Max.” for subgroups 1 and 3. Revision level block; change from “A” to "C". Sheet 21: Table IIA, Interim electrical parameters; delete subgroup 9 for device classes M, Q, and V. Revision level block; add "C". 14. THIS SECTION FOR GOVERNMENT USE ONLY a. (X one) X (1) Existing document supplemented by the NOR may be used in manufacture. (2) Revised document must be received before manufacturer may incorporate this change. (3) Custodian of master document shall make above revision and furnish revised document. b. ACTIVITY AUTHORIZED TO APPROVE CHANGE FOR GOVERNMENT DSCC-VAC d. TITLE Chief, Custom Microelectronics 15a. ACTIVITY ACCOMPLISHING REVISION DSCC-VAC DD Form 1695, APR 92 c. TYPED NAME (First, Middle Initial, Last) Monica L. Poelking e. SIGNATURE Monica L. Poelking b. REVISION COMPLETED (Signature) Thanh V. Nguyen Previous editions are obsolete. f. DATE SIGNED (YYMMDD) 98-11-10 c. DATE SIGNED (YYMMDD) 98-11-10